Predicting the Lifetime of Flexible Permeation Barrier Layers for OLED Displays

Similar documents
Quiz #1 Practice Problem Set

Preliminary measurements of charge collection and DLTS analysis of p + /n junction SiC detectors and simulations of Schottky diodes

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications

Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

SiOx Barrier Films for Flexible Displays

Permeation Measurement Testing Techniques. Michelle Stevens MOCON, Inc.

IV. Surface analysis for chemical state, chemical composition

SENSOR DEVICES MECHANICAL SENSORS

Oxide growth model. Known as the Deal-Grove or linear-parabolic model

SCB10H Series Pressure Elements PRODUCT FAMILY SPEFICIFATION. Doc. No B

Thin Film Bi-based Perovskites for High Energy Density Capacitor Applications

Chalcogenide semiconductor research and applications. Tutorial 2: Thin film characterization. Rafael Jaramillo Massachusetts Institute of Technology

Secondary ion mass spectrometry (SIMS)

CVD-3 LFSIN SiN x Process

Consider a uniformly doped PN junction, in which one region of the semiconductor is uniformly doped with acceptor atoms and the adjacent region is

EE 527 MICROFABRICATION. Lecture 5 Tai-Chang Chen University of Washington

THE PROPERTIES OF THIN FILM DIELECTRIC LAYERS PREPARED BY SPUTTERING

Surface modification of polyethylene terephthalate (PET) and oxide coated PET for adhesion improvement

Dielectric materials for Organic Thin-Film Transistors

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Chenming Hu.

n i exp E g 2kT lnn i E g 2kT

September 21, 2005, Wednesday

Initial Stages of Growth of Organic Semiconductors on Graphene

ECE 340 Lecture 39 : MOS Capacitor II

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Energetic particles and their detection in situ (particle detectors) Part II. George Gloeckler

H loss mechanism during anneal of silicon nitride: Chemical dissociation

Solid State Device Fundamentals

Key Words: Permeation barrier coatings Moisture permeation

Ratcheting deformation in thin film structures

Photovoltaic cell and module physics and technology. Vitezslav Benda, Prof Czech Technical University in Prague

Photovoltage phenomena in nanoscaled materials. Thomas Dittrich Hahn-Meitner-Institute Berlin

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1

Lecture 150 Basic IC Processes (10/10/01) Page ECE Analog Integrated Circuits and Systems P.E. Allen

Pingshan Wang. Jim Rui

ECEN 3320 Semiconductor Devices Final exam - Sunday December 17, 2000

100 pf to 47µF RoHS compliant & Halogen free

Thermal properties of Engineering Materials

PHOTOELECTRON SPECTROSCOPY IN AIR (PESA)

CVD: General considerations.

Frontiers of Fracture Mechanics. Adhesion and Interfacial Fracture Contact Damage

Polymer/drug films as a model system for a drug eluting coronary stent coating layer

Spring Semester 2012 Final Exam

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS NP0/X5R/X7R

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures

Report AFK0242/18 TABLE OF CONTENTS

UNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun

Implantation Energy Dependence on Deuterium Retention Behaviors for the Carbon Implanted Tungsten

High speed vacuum deposition of organic TFTs in a roll-to-roll facility

CVD-3 MFSIN-HU-2 SiN x Mixed Frequency Process

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

atmospheric pressure

Self-study problems and questions Processing and Device Technology, FFF110/FYSD13

an introduction to Semiconductor Devices

IONTOF. Latest Developments in 2D and 3D TOF-SIMS Analysis. Surface Analysis Innovations and Solutions for Industry 2017 Coventry

Xing Sheng, 微纳光电子材料与器件工艺原理. Doping 掺杂. Xing Sheng 盛兴. Department of Electronic Engineering Tsinghua University

Modeling and Characterization of Dielectric-Charging Effects in RF MEMS Capacitive Switches

Midterm I - Solutions

Traps in MOCVD n-gan Studied by Deep Level Transient Spectroscopy and Minority Carrier Transient Spectroscopy

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

EE 5344 Introduction to MEMS CHAPTER 5 Radiation Sensors

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

Acidic Water Monolayer on Ruthenium(0001)

CVD-3 SIO-HU SiO 2 Process

Novel High-Efficiency Crystalline-Si-Based Compound. Heterojunction Solar Cells: HCT (Heterojunction with Compound. Thin-layer)

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General purpose & High capacitance Class 2, Y5V

EE143 Fall 2016 Microfabrication Technologies. Lecture 6: Thin Film Deposition Reading: Jaeger Chapter 6

Semiconductors Reference: Chapter 4 Jaeger or Chapter 3 Ruska Recall what determines conductor, insulator and semiconductor Plot the electron energy

Surface analysis techniques

Effects of Antimony Near SiO 2 /SiC Interfaces

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Technology Brief 9: Capacitive Sensors

Semiconductor X-Ray Detectors. Tobias Eggert Ketek GmbH

Supplementary information

Chapter 6 ELECTRICAL CONDUCTIVITY ANALYSIS

Plasma Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide (SiO2) Using Oxford Instruments System 100 PECVD

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General purpose & High capacitance Class 2, X5R

MOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.

Supporting Information: Poly(dimethylsiloxane) Stamp Coated with a. Low-Surface-Energy, Diffusion-Blocking,

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, X7R

Supporting information

Multilayer Ceramic Capacitors Y5V

CIRCUIT ELEMENT: CAPACITOR

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General purpose & High capacitance Class 2, X5R

Dopant Diffusion Sources

Laser processing of materials. Temperature distributions

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Semiconductor Physics Problems 2015

Multilayer Ceramic Chip Capacitors

Fig. S1 The Structure of RuCE(Left) and RuCA (Right)

CURRENT STATUS OF NANOIMPRINT LITHOGRAPHY DEVELOPMENT IN CNMM

Long Channel MOS Transistors

EE C245 ME C218 Introduction to MEMS Design Fall 2007

Real-time and in-line Optical monitoring of Functional Nano-Layer Deposition on Flexible Polymeric Substrates

Multilayer Ceramic Chip Capacitors

Relaxation of a Strained Elastic Film on a Viscous Layer

Transcription:

Predicting the Lifetime of Flexible Permeation Barrier Layers for OLED Displays Bhadri Visweswaran, Siddharth Harikrishna Mohan, William Quinn, Ruiqing (Ray) Ma, Jeff Silvernail, James Sturm, Sigurd Wagner Electrical Engineering and Princeton Institute for the Science and Technology of Materials Princeton University Universal Display Corporation, Ewing, New Jersey

Outline Introduction on permeation barrier films Modes of permeation of water Bulk permeation Techniques for measuring diffusion of water Secondary Ion Mass Spectrometry Electrical Capacitance Film stress Designing barrier films and predicting a display lifetime

Why do we need permeation barrier films? Organic Light Emitting Diode on Plastic film Flexible permeation barrier film OLED Plastic film Lifetime ~few minutes to few days Required lifetime > 0 years! Required barrier film water vapor transmission rate: 0-6 g / (m day) LG Display, SID 03 UDC, SID 0 Samsung, CES 03 3

Modes of permeation through a barrier layer Flexible permeation barrier film Pin-hole 4 Particle OLED Barrier 3 Permeation along a particle 4µm film at 65 C 85% RH t = 0 7 h 5h 6h Water permeates in four modes:. Through pin-holes. Along particles 3. Along interfaces 4. Through the bulk of the barrier layer Permeation along interface 6µm film at 65 C 85% RH In university research, often,, 3 4 t = 0 863 h 967h 69h P. Mandlik, et al., APL 93, 03306 (008). Difficult to measure! 4

Motivation for measuring bulk permeation Permeation along a particle 4µm film at 65 C 85% RH t = 0 7 h 5h 6h Tests on OLEDs are not quantitative! We need new techniques! How does quantitative evaluation of bulk permeation help?. Evaluate new permeation barrier materials. Design new single and multilayer barrier films 3. Extrapolate and predict room temperature condition performance from accelerated tests I quantitatively evaluate intrinsic water diffusion using 3 techniques:. Secondary Ion Mass Spectroscopy (SIMS). Electrical capacitance 3. Film stress 5

concentration n x, t Evaluation of diffusion profiles Water concentration profile In an ideal barrier Water side: n = n(x=0) n(0) n x, t = n(x=0)erfc x Dt x OLED side: n h = 0 h time depth x Permeability P = D n(x = 0) Water Vapor Transmission Rate WVTR = P/h Fundamental properties: Solubility of water, n(x=0) Diffusion coefficient, D Required OLED water vapor transmission rate: 0-6 g / (m day) 6

atoms cc Secondary Ion Mass Spectrometry, SIMS 00 D O SIMS profile after hours 00 D O. A 660 nm thick barrier layer on a silicon wafer was boiled in heavy water, D O for hours.. Deuterium was determined by sputter profiling using secondary ion mass spectroscopy Deuterium profile depth x (nm) The deuterium follows erfc function! Diffusion coefficient: D = 4. 0 5 cm s Solubility of water: n 0 =.6 0 0 molecules cm 3 = 4.8 mg cm 3 7

concentration n x, t N t Extracting D from total dissolved water Water concentration profile x n x, t = n(0)erfc n(0) Dt Total number of dissolved molecules in the barrier N(t) = n x, t dt h 0 time 3 3 N t = 4n x=0 D t π depth x time t Film capacitance C Film stress σ is proportional to N(t) Therefore C(t) and σ(t) can be used to determine D 8

C t C 0 in Dielectric constant, ε x, t D from Electrical Capacitance ε(0) Capacitor structure time h ε barrier depth x pf Slope = 4 π C( ) C(0) h D C(t) C 0 = C( ) C 0 h π Dt C t = capacitance at time t C 0 = initial capacitance C( ) = saturated final capacitance In water at 00 C = ε 0 ε A d ε barrier ε SiO = 3.9 ε barrier with H O = 3.9 +.6 0 6 N(t) time t (hours) Diffusion coefficient: D = 5.6 0 5 cm Compare D from SIMS: 4. 0 5 cm s 9 s

D from Stress In-diffusing water causes film expansion of the barrier layer Compressive stress Change in stress MPa In water at 00 Water uptake Film under stress Slope = 4 π σ( ) h D Average film stress: R E W H h H σ = E W 6R h - Bending radius - Wafer elastic constant - Substrate thickness - Barrier thickness time t (hours) Diffusion coefficient: D = 4.4 0 5 cm D from SIMS : 4. 0 5 cm /s Capacitance : 5.6 0 5 cm /s s Stress: σ t N(t) 8 = 0 h σ t - stress at time t σ - saturated final stress MPa Advantages:. Extremely simple fabrication: step!. Particles and defects have no impact! 0

Salient points of new techniques SIMS Diffusion coefficient Area Barrier thickness D = 4. 0 5 cm /s Electrical Capacitance D = 5.6 0 5 cm /s Film stress D = 4.4 0 5 cm /s 0.mmx0.mm sputter target mmxmm capacitor size 4 inch silicon wafer 660nm 00nm 500nm Uniform D over different area and thickness Measured at 00 C boiling water (00 C 00% RH) What about performance at room temperature?

molecules cm 3 atm Solubility and Diffusion coefficient activation energies Diffusion Coefficient (cm s) Solubility Obtained from film stress measurements Diffusion coefficient n T = n 0 e 0.0eV kt D T = D 0 e 0.7eV kt T( ) T( ) silica glass + Measured solubility E S = 0.0eV 000 T (/K) E D = 0.7eV 000 T (/K) + Tomozawa, M., Am Ceram Soc Bull. 985, 337.

Extrapolating barrier performance to room temperature Number of monolayers of permeated water At 00 C and 00% Relative Humidity Solubility.6 0 0 molecules cm 3 atm At 38 C and 90% Relative Humidity Diffusion coefficient 4. 0 5 cm s Solubility 3. 0 9 molecules cm 3 Solubility activation energy Diffusion coefficient activation energy 0.0 ev 0.7 ev Diffusion coefficient 5.4 0 7 cm s (*P HO at 38 C and 90% Relative Humidity is 0.06atm) Total quantity of permeated water Performance of a 3µm barrier at 38 C and 90% Relative Humidity 3µm, 38 C and 90% RH Water vapor transmission rate.5 0 7 g m day monolayer of water Permeation time for monolayer 3.4 years time t (years) 3

time τ ML (years) Acceleration factor Barrier design and testing At 38 C and 90% Relative Humidity Solubility 3. 0 9 molecules cm 3 Diffusion coefficient 5.4 0 7 cm s monolayer permeation time at 38 C 90% RH Acceleration factor from 38 C 90% RH to 00% RH at higher temperatures τ ML =.4h.57 3µm, τ ML = 3.4 years Barrier thickness h (μm) Temperature ( ) Barrier film lifetime is not linear with thickness! 4

Conclusion Introduced simple techniques to measure diffusion coefficient of water Electrical Capacitance Film stress Determined the concentration of water with SIMS, used to calibrate capacitance and film stress The techniques are Simple: fabrication & testing Immune to particles and defects With the techniques we can: Rapidly evaluate barrier materials and films Predict room temperature performance 5

Acknowledgements Prof. Sigurd Wagner and group Sushobhan Avasti, Warren Rieutort-Louis, Josh Sanz-Robinson, Lin Han, Prashant Mandlik Prof. James Sturm Princeton Program in Plasma Science and Technology 6

Questions? Thanks! 7