SENSOR DEVICES MECHANICAL SENSORS

Similar documents
Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications

Piezoresistive Sensors

Published by: PIONEER RESEARCH & DEVELOPMENT GROUP(

Biosensors and Instrumentation: Tutorial 2

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4

Piezoresistive sensors

EE 5344 Introduction to MEMS CHAPTER 6 Mechanical Sensors. 1. Position Displacement x, θ 2. Velocity, speed Kinematic

Slide 1. Temperatures Light (Optoelectronics) Magnetic Fields Strain Pressure Displacement and Rotation Acceleration Electronic Sensors

Midterm 2 PROBLEM POINTS MAX

DESIGN AND SIMULATION OF UNDER WATER ACOUSTIC MEMS SENSOR

Sensors, Signals and Noise 1 COURSE OUTLINE. Introduction Signals and Noise Filtering Sensors: Strain Gauges. Signal Recovery, 2017/2018 Strain Gauges

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

Strain Gages. Approximate Elastic Constants (from University Physics, Sears Zemansky, and Young, Reading, MA, Shear Modulus, (S) N/m 2

Lecture 20. Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature MECH 373. Instrumentation and Measurements

MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané

Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by

Learning Objectives By the end of this section, the student should be able to:

Laboratory 7 Measurement on Strain & Force. Department of Mechanical and Aerospace Engineering University of California, San Diego MAE170

Strain Gages. Approximate Elastic Constants (from University Physics, Sears Zemansky, and Young, Reading, MA, 1979

Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy

Piezoresistive pressure sensors. Electronics and Cybernetics 1

SENSORS and TRANSDUCERS

Bending Load & Calibration Module

b. The displacement of the mass due to a constant acceleration a is x=

Silicon Capacitive Accelerometers. Ulf Meriheinä M.Sc. (Eng.) Business Development Manager VTI TECHNOLOGIES

MICROMECHANICAL PIEZORESISTIVE TACTILE SENSOR

Fundamental Theory and Design of Micro Pressure Sensor

MEMS Mechanical Fundamentals

Review of Electromechanical Concepts

Design And Analysis of Microcantilevers Type Sensor With Different Shape of Piezoresistive Patch

Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System Design

PIEZOELECTRIC TECHNOLOGY PRIMER

10 Measurement of Acceleration, Vibration and Shock Transducers

Lecture 19. Measurement of Solid-Mechanical Quantities (Chapter 8) Measuring Strain Measuring Displacement Measuring Linear Velocity

EE C245 / ME C218 INTRODUCTION TO MEMS DESIGN FALL 2009 PROBLEM SET #7. Due (at 7 p.m.): Thursday, Dec. 10, 2009, in the EE C245 HW box in 240 Cory.

EE C245 ME C218 Introduction to MEMS Design Fall 2007

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving

MET 487 Instrumentation and Automatic Controls. Lecture 13 Sensors

ELECTRONIC SENSORS PREAMBLE. This note gives a brief introduction to sensors. The focus is. on sensor mechanisms. It describes in general terms how

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS

Agricultural Science 1B Principles & Processes in Agriculture. Mike Wheatland

Kurukshetra University INDIA

ME 2570 MECHANICS OF MATERIALS

Mechanical Properties of Materials

ME 243. Mechanics of Solids

Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview

1. Narrative Overview Questions

High Tech High Top Hat Technicians. An Introduction to Solid Mechanics. Is that supposed to bend there?

Analytical Design of Micro Electro Mechanical Systems (MEMS) based Piezoelectric Accelerometer for high g acceleration

2. Rigid bar ABC supports a weight of W = 50 kn. Bar ABC is pinned at A and supported at B by rod (1). What is the axial force in rod (1)?

COURSE OUTLINE. Introduction Signals and Noise Filtering Sensors: Piezoelectric Force Sensors. Sensors, Signals and Noise 1

Stress-Strain Behavior

Modelling of Different MEMS Pressure Sensors using COMSOL Multiphysics

EE C245 ME C218 Introduction to MEMS Design

Modeling, Simulation and Optimization of the Mechanical Response of Micromechanical Silicon Cantilever: Application to Piezoresistive Force Sensor

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 PROBLEM SET #1

Force and Displacement Measurement

Sensors and Transducers. mywbut.com

Strain and Force San José State University A. Mysore Spring 2009

Design of Piezoresistive MEMS Accelerometer with Optimized Device Dimension

Technology Brief 9: Capacitive Sensors

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS)

2D BEAM STEERING USING ELECTROSTATIC AND THERMAL ACTUATION FOR NETWORKED CONTROL ABSTRACT

Comb Resonator Design (2)

Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing

6.4 A cylindrical specimen of a titanium alloy having an elastic modulus of 107 GPa ( psi) and

Design of a MEMS Capacitive Comb-drive Accelerometer

The Effect of Mechanical Loading on the Frequency of an Oscillator Circuit

Thermal Sensors and Actuators

Mechanics of Materials MENG 270 Fall 2003 Exam 3 Time allowed: 90min. Q.1(a) Q.1 (b) Q.2 Q.3 Q.4 Total

Comb resonator design (2)

Strain Measurements. Isaac Choutapalli

MASSACHUSETTS INSTITUTE OF TECHNOLOGY DEPARTMENT OF MATERIALS SCIENCE AND ENGINEERING CAMBRIDGE, MASSACHUSETTS 02139

COURSE TITLE : THEORY OF STRUCTURES -I COURSE CODE : 3013 COURSE CATEGORY : B PERIODS/WEEK : 6 PERIODS/SEMESTER: 90 CREDITS : 6

Finite Element Analysis of Piezoelectric Cantilever

NORMAL STRESS. The simplest form of stress is normal stress/direct stress, which is the stress perpendicular to the surface on which it acts.

BEAM DEFLECTION THE ELASTIC CURVE

Strain Measurement. Prof. Yu Qiao. Department of Structural Engineering, UCSD. Strain Measurement

[8] Bending and Shear Loading of Beams

AC : MEMS FABRICATION AS A MULTIDISCIPLINARY LABORATORY

4.MECHANICAL PROPERTIES OF MATERIALS

LAYOUT TECHNIQUES. Dr. Ivan Grech

20. Rheology & Linear Elasticity

Design and Simulation of Micro-cantilever

Simulation based Analysis of Capacitive Pressure Sensor with COMSOL Multiphysics

Mechanics of Microstructures

2.76/2.760 Multiscale Systems Design & Manufacturing

The science of elasticity

EMA 3702 Mechanics & Materials Science (Mechanics of Materials) Chapter 2 Stress & Strain - Axial Loading

Appendix A Glossary of Mathematical Symbols

Robotics Intelligent sensors (part 2)

Mechanics of Materials II. Chapter III. A review of the fundamental formulation of stress, strain, and deflection

Chapter 8. Model of the Accelerometer. 8.1 The static model 8.2 The dynamic model 8.3 Sensor System simulation

Chapter 5 Structural Elements: The truss & beam elements

MCE 403 MACHINERY LABORATORY EXPERIMENT 10

Mechanical Properties

Mechanics in Energy Resources Engineering - Chapter 5 Stresses in Beams (Basic topics)

QUESTION BANK SEMESTER: III SUBJECT NAME: MECHANICS OF SOLIDS

Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation

Transcription:

SENSOR DEVICES MECHANICAL SENSORS

OUTLINE 4 Mechanical Sensors Introduction General mechanical properties Piezoresistivity Piezoresistive sensors Capacitive sensors Applications

INTRODUCTION MECHANICAL SEMICONDUCTOR SENSORS Combine electronic properties of semiconductorswith its excellent mechanical properties mechanical properties TWO MAJOR CLASSES OF MECHANICAL SENSORS Piezorestistive sensors (material property p in silicon) Capacitive sensors (relative motion of electrodes) APPLICATIONS Pressure sensors Accelerometer Flow sensors Piezo = squeeze or press

INTRODUCTION Piezoresistive sensing applications Load cell Accelerometer Pressure sensor

General mechanical properties Hooke's law: σ = Eε Stress: σ = F Area, [N/m 2 ] Strain: ε =ΔLL Young's module: E, [N/m 2 =Pa], Volumetric change: ΔV V ΔL L 2ΔL l L = ( 1 2ν ) ΔL L Poisson's ratio: ν = ΔL l ΔL = -ε l ε, l =lateral Silicon: E Si 190 GPa, ν Si 0.28

General mechanical properties Brittle Fracture x Ductile Silicon Linear elasticity until fracture No plastic deformation Excellent for sensor applications Metals Linear elastic behaviour for small strain only Strength Yield strength = tensile stress where plastic deformation starts (non-reversible) Tensile strength = maximum tensile stress before facture

General mechanical properties

General mechanical properties Stress in thin film R Stress in thin film cause a curvature of the sample, which can be measured using a laser system 1 Δs = 61 ν R ET Δ s =σt = surface stress [N/m] unstressed ( ) 2 stressed R= radius E= Young s module in substrate T= substrate thickness t = thin film thickness v = Poisson s ratio in substrate

General mechanical properties p Cantilever beams Max deflection Max longitudinal stress Resonant frequency Square membranes Max deflection Max longitudinal and transverse stress Resonant frequency

General mechanical properties Cantilever beam with uniform distributed load (P=F/Δx) P[N/m] 4 Beam equation: EI d w(x) = P dx 4 Beam stifness: EI = Eat 3 12 I = at 3 12 (2nd moment of inertia) L t a Deflection: w(x) = ( ) P 2 2 2 24EI x2 6L 2 4Lx+ x 2 Max stress SENSOR: P = at ρ acceleration Δ P= atρ g measurand w(l) = PL4 8EI Surface stress: σ (x)=- te d 2 w(x) 2 dx 2 Max stress: σ (0) = PL2 t = 3PL2 4I at 2

General mechanical properties Cantilever beam point load at the end L Q [N] a 2 Qx Defelction: wx ( ) = 3L x 6EI 3 QL wl ( ) = 2EI QLt 6QL Max stress: σ (0) = = 2 I at ( ) t 2 Max stress SENSOR: Q = mass acceleration Resonant frequency: F t E t Eta = 0.161 = 0.161 L ρ L ML 0 2 Quasi-static static sensing f measure < F 0

General mechanical properties SQUARE MEMBRANES (UNIFORM LOAD) P [N/m^2] E, ρ, ν a t Plate equation: D 4 w(x, y) = P Et 3 Membrane stiffness: D = 12 1 ν 2 ( ) Max deflection: w 00126 Pa4 max = 0.001265 D Max longitud. stress: σ Pa2 l = 0.3081 t 2 Max transverse stress: σ t νσ l Resonant frequency: F 0 =1.654 12D ρta 4

Piezoresistivity L R = ρ 2 a Resistivity change in semiconductor: ρ = ρ( σ) Resistivity change due to mechanical stress L piezoresistive effect R( σ) = R+ ρσ 2 Large resistivity change a Dependence on Δ RR = ( ρ ρ ) σ Doping (n- or p-type, doping concentration) πσ Temperature Direction of force and direction of current flow = π Eε (anisotropic effect) ΔR R 100ε Resistivity change in metal strain gauge mainly due to geometric effect F L L R = ρ 2 L+ΔL a a F a+δa

Piezoresistivity Longitudinal and transverse piezoresistance coefficients Force σ l Current flow V Longitudinal stress: ΔR/R = π l σ l π l = longitudinal piezoresistance coefficient Force Force σ t Current flow Force V Transverse stress: ΔR/R = π t σ t π t = transverse piezoresistance coefficient Stress: σ=force/area E = j ρ j i ij j ρ = π σ ij k l ijkl kl In general we have both longitudinal and transverse stresses: ΔR/R = π t σ t + π l σ l

PIEZORESISTIVITY Piezoresistance coefficients in p-type silicon [10-11 /Pa] 100 plane Upper half Longitudinal coefficient π l Lower half Transverse coefficient π t In sensor application the π should be as large as possible, i.e. resistors along <110> direction ( ) π 1 l = π 2 + π + π π 1 t = π 2 + π π 11 12 44 ( ) 11 12 44

PIEZORESISTIVITY Resistors along <110> direction in (100) wafers (common for bulk micromachining) ( ) ( ) π l = 1 2 π 11 + π 12 + π 44 π = 1 π + π π t 11 12 2 44 ΔR R = π l σ l + π t σ t π 44 2 (σ l σ t ) <110> ΔR π π E R 44 2 σ 44 Eε 100ε 2

Piezoresistive Sensors Piezoresitive pressure sensor Membrane fabrication Anisotropic etch Piezoresistor fabrication doped d area or deposited polysilicon resistor on an insulator (SiO 2 or Si 3 N 4 ) Piezoresistor position at the edges of the membrane where the stress is maximal

Piezoresistive Sensors Piezoresistive accelerometer The piezoresistor must be places where the stress is maximal To increase the sensitivity an inertial mass is included

Piezoresistivity R= ρ L w t π( NT, ) = π0pnt (, ) π 0 = low-doped room-temerature value

Piezoresistiv Sensor Wheatstone Bridge Configuration R1 and R3 under lateral stress ΔR and decrease R π 44 2 σ R2 and R4 under longitudinal stress and increase ΔR R π 44 2 σ R 1 = R 3 = R Δ R R2 = R4 = R+ΔR Δ R π = 44 ( σ l σ t) R 2 Δ R π 44 Vm = Vb = Vb σ l σ t R 2 ( )

Piezoresistive Sensors Pressuresensitivity for constantv b : S v = ΔVV b ΔP [mv/v-bar] = ΔRR ΔP = 1 2ΔP π 44 ( σ σ l t ) Pressure sensitivity for constant I b : ΔV I b S i = [mv/ma-bar] ΔP = ΔR = 1 Rπ 44 ΔP 2ΔP ( σ σ l t )

Piezoresistive Sensors Offset voltage Symmetrical mismatch of the resistors, caused by difference in layout (parallel and perpendicular to the edges of the membrane) R 1 = R 3 = R R 2 = R 4 = R+ r r V o =V b 2R+ r V r 1 O = o = = V b 2R+ r 1+ 2R r Offset also caused by residual stress on resistors - pre-stress due to passivation layers and packaging

Piezoresistive Sensors Temperature coefficient of offset O 2Rr r R = T + r R ( 2Rπ r ) 2 If resistors have equal temperature coefficients r R O =, = 0 r R T However, temperature dependence of pre-stress might be significant.

Piezoresistive Sensors Temperature coefficient of sensitivity Constant bridge voltage S π 44 (σ l σ t ) Temperature coefficient for π 44 can be high for p type silicon Constant bridge current S π 44 R(σ l σ t ) - +

Piezoresistive Sensors

Capacitive Sensors Capacitor two electrodes separated by a dielectric Electronic should be close to the sensor, minimising the stray capacitance Δd<< d result in High sensitivity means Large area S and a small distance d Advantage with capacitive sensors no direct sensitivity to temperature

Capacitive Sensors a) Pressure sensor b) Accelerometer c)? θ

Comparison of different technologies

Applications Symmetric capacitive accelerometer with low thermal sensitivity In some cases the movabel electrode must be damped to avoid serious oscillations. A small cavity with a viscous liquid or gas can fulfil the requirements

Flow sensors (gas) With no flow the two sensors display the same temperature With gas flow the first sensor is cooled, while the second is heated up by the gas

Some examples, Bulk micro-machinedmachined piezoresistive sensor Laboratory for Electron Devices Ljubljana SLOVENIA

EXERCISES 1) 2) 3)

EXERCISES 4) Force Q between two parallel Force Q between two parallel plates of area A, separation d and applied voltage V

EXERCISES ANSWER: 1) Wmax=1.17µm, σl=12.3 MPa, σt=3.45 MPa 2) σmax= 4.3*10 7 Pa, a=150 µm 3) fo= 4.39 khz 4) V=9.6V