This test consists of twenty-five multiple-choice questions. All questions are from the video: Through-Hole Rework (DVD-41C). Each question has only one most correct answer. Circle the letter corresponding to your selection for each test item. If you wish to change an answer, erase your choice completely. You should read through the questions and answer those you are sure of first. After your first pass through the test, then go back and answer the questions that you were not sure of. If two answers appear to be correct, pick the answer that seems to be the most correct response. When you are finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (18 correct answers or better). Good luck! 1
ANSWER SHEET THROUGH-HOLE REWORK (DVD-41C) v.1 Name: Date: Circle the letter corresponding to your answer for each test item. 1 A B C D 2 A B C D 3 A B C D 4 A B C D 5 A B C D 6 A B C D 7 A B C D 8 A B C D 9 A B C D 10 A B C D 11 A B C D 12 A B C D 13 A B C D 14 A B C D 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 21 A B C D 22 A B C D 23 A B C D 24 A B C D 25 A B C D 2
1. The industry specifications many companies use for workmanship standards are a. IPC-T-50 and IPC-A-620 b. DRM-64 and DRM-SMT c. ANSI/J-STD-001 and IPC-A-610 2. If a solder joint meets minimum acceptable conditions, it should be a. left alone b. touched up so that its cosmetic appearance is more acceptable c. reworked so that it has the attributes of a target solder joint d. none of the above 3. Cosmetic imperfections not considered detrimental to the reliability of a solder joint are called a. cosmetic anomalies b. process indicators c. process imperfections d. cosmetic processes 4. Electromigration is the a. movement of electrons through a passive component b. fancy name for the copper plating on circuit board assemblies c. growth of metal dendrites in the presence of flux residues d. migration of electrons along the path electronic circuitry 5. A safe starting temperature for reworking solder joints is a. 400 degrees C b. 360 degrees C c. 330 degrees C d. 315 degrees C 6. The main reason to tin the tip of the soldering iron is to a. give the tip much more surface area b. have better heat transfer c. create oxidation 7. The material that removes oxidation and assists with heat transfer during soldering is a. the lead in tin-lead solder b. the solder alloy c. flux d. dross 3
8. The solder braid is used to a. remove solder from the joint b. create more professional looking solder joints c. assist in heart transfer d. apply the flux more evenly 9. The vacuum extractor is used to a. remove solder from the joint b. create more professional looking solder joints c. assist in heart transfer d. apply the flux more evenly 10. Tip selection for the vacuum extractor is based upon a. the shape of the soldered lead b. the diameter of the soldered lead c. the size of the land 11. The vacuum switch is pressed on the vacuum extractor a. immediately after the lead comes loose b. after the extractor tip is placed on the joint c. when complete solder melt is achieved d. before the extractor tip is placed on the joint 12. The purpose of continuing to press the vacuum switch after the solder is removed a. is to distribute the flux evenly b. is to cool the metals inside the hole c. is to repair any damage done to the land d. is to allow the solder to dissipate inside the extractor 13. A sweat joint occurs when a. a bead of water appears on the joint after the extraction process b. the soldering temperature is too high c. flux remains after the extraction process d. the joint isn t properly cooled and the residual solder bonds to the lead 14. A partially clinched lead should be straightened by a. placing a chisel tip beneath the lead and applying upward pressure b. using needle nose pliers to twist the lead and bend it up c. using a vacuum extractor to melt the solder, then bend the lead upright d. any of the above 4
15. To straighten a fully clinched lead a. use a thermal parting tool with a flat tip b. use a chisel tip on a hand soldering iron c. use a vacuum, extractor and pliers d. any of the above 16. The main functional difference between desoldering DIP and axial components is a. DIP components contain ICs b. DIP components have flat leads c. vacuum extractors cannot be used on DIP components d. there are no polarity markings on axial components 17. In order to avoid potential heat damage to the board when desoldering DIPs a. skip around as you desolder the leads b. desolder in a continuous line starting at the corners c. desolder in a continuous line starting in the middle d. the order in which leads are desoldered is not a factor in heat damage to the board 18. If you re having trouble desoldering, it can be helpful to a. significantly raise the temperature of the vacuum extractor b. use a solder braid in addition to the extractor c. use an auxiliary heating source on the opposite side of the board 19. To correct a solder bridging condition a. place a chisel tip on the solder bridge and reheat both joints completely b. use a solder braid to desolder the bridge and the affected joints, then resolder the joints c. remove the bridge with a vacuum extractor, then resolder the joints 20. The easiest way to remove unacceptable solder icicles is to use a a. solder braid b. hand soldering iron and a small amount of flux c. vacuum extractor d. thermal parting tool 21. The easiest and fastest method to remove excess solder is to use a a. hand soldering iron and a small amount of flux b. vacuum extractor c. thermal parting tool d. solder braid 5
22. Cross contamination can occur when a. an operator sneezes on an assembly b. different solder alloys are mixed c. oils from ungloved hands get on the assembly d. coffee is spilled on an assembly 23. The visual appearance of the lead free solder joints is a. smoother than tin-lead b. grainier than tin-lead c. shinier than tin-lead d. wetter than tin-lead 24. The melting temperature for lead free solder is typically a. 50 degrees C higher than tin-lead b. 40 degrees C higher than tin-lead c. 30 degrees C higher than tin-lead d. 20 degrees C higher than tin-lead 25. In lead free soldering, the more robust fluxes a. clean surfaces more aggressively b. assist in heat transfer c. are harder to clean after soldering 6