Copper Wire for Wire-Bonded BGA and Leadframe QFP Packages Qualification Report. RPT156 (v1.1) December 9, 2013

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Copper Wire for Wire-Bonded BGA and Leadframe QFP Packages Qualification Report

The information disclosed to you hereunder (the Materials ) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available AS IS and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx had been advised of the possibility of the same. Xilinx assumes no obligation to correct any errors contained in the Materials, or to advise you of any corrections or update. You may not reproduce, modify, distribute, or publicly display the Materials without prior written consent. Certain products are subject to the terms and conditions of the Limited Warranties which can be viewed at http://www.xilinx.com/warranty.htm; IP cores may be subject to warranty and support terms contained in a license issued to you by Xilinx. Xilinx products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance; you assume sole risk and liability for use of Xilinx products in Critical Applications: http://www.xilinx.com/warranty.htm#critapps. Copyright 2011 2013 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. Revision History The following table shows the revision history for this document. Date Version Revision 08/12/11 1.0 Initial Xilinx release. Associated with XCN11002. 12/09/13 1.1 Associated with XCN14001. Added test results for XC3SD3400A devices in Table 1, page 6 and Table 2, page 7, page 8, and page 9 for TC-B, uhast, and HTS. Copper Wire for Wire-Bonded Packages www.xilinx.com

Table of Contents Revision History............................................................. 2 Copper Wire for Wire-Bonded BGA and Leadframe QFP Packages Overview.................................................................... 5 Qualification Objectives..................................................... 5 Package Qualification Plan................................................... 5 Reliability and Results...................................... 5 Qualification Data and Results for Assembly Supplier in Taiwan................. 7 Qualification Data and Results for Assembly Supplier in Korea.................. 9 Copper Wire for Wire-Bonded Packages www.xilinx.com 3

4 www.xilinx.com Copper Wire for Wire-Bonded Packages

Copper Wire for Wire-Bonded BGA and Leadframe QFP Packages Overview This qualification report summarizes the results of the reliability stress tests that were performed to qualify the copper wire used by wire-bonded BGA and leadframe QFP packages. Qualification Objectives Package Qualification Plan The objective of the reliability stress testing summarized in this document is to qualify the use of copper wire in wire-bonded BGA and leadframe QFP packages assembled by Xilinx-approved assembly suppliers in Taiwan and Korea. Specific reliability stress tests for qualification were run on selected qualification vehicles based on package type, package size, pin count, assembly site, and other known reliability risk factors. Reliability and Results Table 1 summarizes the results and test conditions for the reliability stress tests performed on the qualification vehicles. Based on the data gathered, copper wire demonstrates performance meeting the qualification requirements for use in wire-bonded BGA packages and leadframe QFP packages and is released for production use. Copper Wire for Wire-Bonded Packages www.xilinx.com 5

Reliability and Results Table 1: Summary of Reliability and Results Vehicle- Package Type Cumulative Device-Hours/Cycle Number of Failures TC-B (1) -55 C/+125 C XC3S1200E-FTG256 3 75,000 0 XC3S1400A-FGG676 6 149,000 0 XC3S1400A-FTG256 6 150,000 0 XC3S1500-FGG676 3 75,000 0 XC3S1600E-FGG320 3 69,000 0 XC3S1600E-FGG484 3 75,000 0 XC3S400-PQG208 3 75,000 0 XC3S5000-FGG900 3 75,000 0 XC3S500E-CPG132 3 75,000 0 XC3SD3400A-FGG676 6 150,000 0 XC3SD3400A-CSG484 3 75,000 0 THB (1) XC3S1400A-FGG676 3 71,000 0 85 C, 85% RH, Bias V CCMAX XC3S250E-VQG100 3 75,000 0 HAST (1) XC3S1400A-FTG256 6 39,600 0 110 C, 85% RH, Bias V CCMAX XC3S1500-FGG676 3 19,800 0 XC3S1200E-FTG256 3 19,800 0 XC3S1400A-FGG676 3 19,536 0 XC3S1400A-FTG256 3 19,800 0 uhast (1) 110 C, 85% RH XC3S1500-FGG676 3 19,800 0 XC3S1600E-FGG320 3 19,800 0 XC3S250E-VQG100 3 19,800 0 XC3S400-PQG208 3 19,800 0 XC3SD3400A-FGG676 3 19,800 0 XC3S1200E-FTG256 3 75,000 0 XC3S1400A-FGG676 6 150,000 0 XC3S1400A-FTG256 3 1,000 0 HTS 150 C XC3S1600E-FGG320 3 75,000 0 XC3S250E-VQG100 3 75,000 0 XC3S400-PQG208 3 75,000 0 XC3SD3400A-FGG676 3 75,000 0 Notes: 1. Package level-3 preconditioning using Pb-free reflow temperature was performed prior to TC-B, THB, HAST, and uhast tests. 6 www.xilinx.com Copper Wire for Wire-Bonded Packages

Reliability and Results Qualification Data and Results for Assembly Supplier in Taiwan Table 2: Qualification Data Number Device Package Sample Duration Failure TC-B (1) -55 C/+125 C 20222 XC3S400 PQG208 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20222 XC3S400 PQG208 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20222 XC3S400 PQG208 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20213 XC3S1400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20213 XC3S1400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20213 XC3S1400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20427 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20428 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20429 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20613 XC3S1600E FGG484 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20614 XC3S1600E FGG484 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20615 XC3S1600E FGG484 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20424 XC3S5000 FGG900 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20425 XC3S5000 FGG900 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20426 XC3S5000 FGG900 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20430 XC3S1200E FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20431 XC3S1200E FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20432 XC3S1200E FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20481 XC3S500E CPG132 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20482 XC3S500E CPG132 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20483 XC3S500E CPG132 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22915 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22916 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22917 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22918 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22919 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22920 XC3SD3400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22927 XC3SD3400A CSG484 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22928 XC3SD3400A CSG484 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 22929 XC3SD3400A CSG484 25 1,000 cycles 0 THB (1) 85 C, 85% RH, Bias V CCMAX 20223 XC3S250E VQG100 25 1,000 hours 0 Copper Wire for Wire-Bonded Packages www.xilinx.com 7

Reliability and Results Table 2: Qualification Data (Cont d) Number Device Package Sample Duration Failure THB (1) 85 C, 85% RH, Bias V CCMAX 20223 XC3S250E VQG100 25 1,000 hours 0 THB (1) 85 C, 85% RH, Bias V CCMAX 20223 XC3S250E VQG100 25 1,000 hours 0 THB (1) 85 C, 85% RH, Bias V CCMAX 20213 XC3S1400A FGG676 24 1,000 hours 0 THB (1) 85 C, 85% RH, Bias V CCMAX 20213 XC3S1400A FGG676 25 1,000 hours 0 THB (1) 85 C, 85% RH, Bias V CCMAX 20213 XC3S1400A FGG676 22 1,000 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20494 XC3S1400A FTG256 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20495 XC3S1400A FTG256 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20496 XC3S1400A FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 20222 XC3S400 PQG208 25 264 hours 0 uhast (1) 110 C, 85% RH 20222 XC3S400 PQG208 25 264 hours 0 uhast (1) 110 C, 85% RH 20222 XC3S400 PQG208 25 264 hours 0 uhast (1) 110 C, 85% RH 20223 XC3S250E VQG100 25 264 hours 0 uhast (1) 110 C, 85% RH 20223 XC3S250E VQG100 25 264 hours 0 uhast (1) 110 C, 85% RH 20223 XC3S250E VQG100 25 264 hours 0 uhast (1) 110 C, 85% RH 20213 XC3S1400A FGG676 24 264 hours 0 uhast (1) 110 C, 85% RH 20213 XC3S1400A FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20213 XC3S1400A FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20430 XC3S1200E FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 20431 XC3S1200E FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 20432 XC3S1200E FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 22915 XC3SD3400A FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 22916 XC3SD3400A FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 22917 XC3SD3400A FGG676 25 264 hours 0 HTS 150 C 20222 XC3S400 PQG208 25 1,000 hours 0 HTS 150 C 20222 XC3S400 PQG208 25 1,000 hours 0 HTS 150 C 20222 XC3S400 PQG208 25 1,000 hours 0 HTS 150 C 20223 XC3S250E VQG100 25 1,000 hours 0 HTS 150 C 20223 XC3S250E VQG100 25 1,000 hours 0 HTS 150 C 20223 XC3S250E VQG100 25 1,000 hours 0 HTS 150 C 20610 XC3S1400A FGG676 25 1,000 hours 0 HTS 150 C 20611 XC3S1400A FGG676 25 1,000 hours 0 HTS 150 C 20612 XC3S1400A FGG676 25 1,000 hours 0 8 www.xilinx.com Copper Wire for Wire-Bonded Packages

Reliability and Results Table 2: Qualification Data (Cont d) Number Device Package Sample Duration Failure HTS 150 C 20430 XC3S1200E FTG256 25 1,000 hours 0 HTS 150 C 20431 XC3S1200E FTG256 25 1,000 hours 0 HTS 150 C 20432 XC3S1200E FTG256 25 1,000 hours 0 HTS 150 C 22915 XC3SD3400A FGG676 25 1,000 hours 0 HTS 150 C 22916 XC3SD3400A FGG676 25 1,000 hours 0 HTS 150 C 22917 XC3SD3400A FGG676 25 1,000 hours 0 Notes: 1. Package level-3 preconditioning using Pb-free reflow temperature was performed prior to TC-B, THB, HAST, and uhast tests. Qualification Data and Results for Assembly Supplier in Korea Table 3: Qualification Data Number Device Package Sample Duration Failure TC-B (1) -55 C/+125 C 20622 XC3S1400A FGG676 24 1,000 cycles 0 TC-B (1) -55 C/+125 C 20623 XC3S1400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20624 XC3S1400A FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20487 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20488 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20489 XC3S1400A FTG256 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20412 XC3S1500 FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20413 XC3S1500 FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20414 XC3S1500 FGG676 25 1,000 cycles 0 TC-B (1) -55 C/+125 C 20409 XC3S1600E FGG320 22 1,000 cycles 0 TC-B (1) -55 C/+125 C 20410 XC3S1600E FGG320 24 1,000 cycles 0 TC-B (1) -55 C/+125 C 20411 XC3S1600E FGG320 23 1,000 cycles 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20487 XC3S1400A FTG256 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20488 XC3S1400A FTG256 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20489 XC3S1400A FTG256 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20616 XC3S1500 FGG676 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20617 XC3S1500 FGG676 25 264 hours 0 HAST (1) 110 C, 85% RH, Bias V CCMAX 20618 XC3S1500 FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20487 XC3S1400A FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 20488 XC3S1400A FTG256 25 264 hours 0 Copper Wire for Wire-Bonded Packages www.xilinx.com 9

Reliability and Results Table 3: Qualification Data (Cont d) Number Device Package Sample Duration Failure uhast (1) 110 C, 85% RH 20489 XC3S1400A FTG256 25 264 hours 0 uhast (1) 110 C, 85% RH 20412 XC3S1500 FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20413 XC3S1500 FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20414 XC3S1500 FGG676 25 264 hours 0 uhast (1) 110 C, 85% RH 20619 XC3S1600E FGG320 25 264 hours 0 uhast (1) 110 C, 85% RH 20620 XC3S1600E FGG320 25 264 hours 0 uhast (1) 110 C, 85% RH 20621 XC3S1600E FGG320 25 264 hours 0 HTS 150 C 20490 XC3S1400A FGG676 25 1,000 hours 0 HTS 150 C 20491 XC3S1400A FGG676 25 1,000 hours 0 HTS 150 C 20492 XC3S1400A FGG676 25 1,000 hours 0 HTS 150 C 20625 XC3S1400A FTG256 25 1,000 hours 0 HTS 150 C 20626 XC3S1400A FTG256 25 1,000 hours 0 HTS 150 C 20627 XC3S1400A FTG256 25 1,000 hours 0 HTS 150 C 20409 XC3S1600E FGG320 25 1,000 hours 0 HTS 150 C 20410 XC3S1600E FGG320 25 1,000 hours 0 HTS 150 C 20411 XC3S1600E FGG320 25 1,000 hours 0 Notes: 1. Package level-3 preconditioning using Pb-free reflow temperature was performed prior to TC-B, THB, HAST, and uhast tests. 10 www.xilinx.com Copper Wire for Wire-Bonded Packages