ASMT-Ax3x 3W Power LED Light Source Data Sheet Description This 3W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available. The White Power LED is available in the range of color temperature from 27K to 1K. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering process. This part has a foot print that is compatible to most of the high power LED in the market today. Features Available in Red, Red Orange, Amber, Green, Blue, Royal Blue, Cool White, Neutral White and Warm White color Energy efficient Exposed metal slug for excellent heat transfer Compatible with reflow soldering process High current operation Long operation life Wide viewing angle at 14 Silicone encapsulation Non-ESD sensitive (threshold > 16 kv) MSL 2a products Applications Architectural lighting Channel backlighting Contour lighting Retail Display lighting Decorative lighting Garden lighting Safety, exit and emergency signs lighting Specialty lighting Task lighting
Package Dimensions 7.4 Ø 6. 1.1 1.5 7.4 2.3 Ø 8. Metal Slug TOP VIEW BOTTOM VIEW Anode Lead Lens 3..5 2. 6. 13.8 ±.2 4.1 (ref:) Metal Slug Cathode Lead Body Figure 1. ASMT-Ax3x package outline drawing Notes: 1. All dimensions in millimeters. 2. Metal slug is connected to anode for electrically non-isolated option. 3. Tolerance is ±.1 mm unless otherwise specified. 4. Terminal Finish: Ag plating 2
Part Numbering System ASMT A x 1 3 x 2 x 3 x 4 x 5 x 6 x 7 Packaging Option Color Bin Selection Maximum Flux Bin Selection Minimum Flux Bin Selection Dice Type N InGaN A AllnGaP Heat Sink Electrically Non-isolated 1 Electrically Isolated Color R Red H Red Orange A Amber G Green B Blue L Royal Blue W Cool White N Neutral White Y Warm White Note: 1. Please refer to Page 11 for selection details. Device Selection Guide (T j = 25 C) Part Number Color Luminous Flux (lm) / Radiometric Power (mw), Φ V [1,2] Min. Typ. Max. Test Current (ma) Dice Technology ASMT-AR3-AST Red 51.7 6. 87.4 35 AllnGaP No [3] ASMT-AH3-ARS Red Orange 39.8 5. 67.2 35 AllnGaP No [3] ASMT-AA3-ARS Amber 39.8 5. 67.2 35 AllnGaP No [3] ASMT-AG31-NTU Green 67.2 78. 99.6 35 InGaN Yes ASMT-AG31-NUV 87.4 15. 113.6 35 InGaN Yes ASMT-AB31-NMP Blue 13.9 18. 3.6 35 InGaN Yes ASMT-AB31-NNP 18.1 23. 3.6 35 InGaN Yes ASMT-AL31-NRS Royal Blue 515 mw 6 mw 685 mw 35 InGaN Yes ASMT-AW31-NVX Cool White 99.6 12. 147.7 35 InGaN Yes ASMT-AN31-NWX Neutral White 113.6 12. 147.7 35 InGaN Yes ASMT-AY31-NUW Warm White 87.4 95. 129.5 35 InGaN Yes Notes: 1. ΦV is the total luminous flux / radiometric power output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux and power tolerance is ±1 % 3. Electrically isolated metal slug option is also available. Please contact your Avago sale representative. Electrically Isolated Metal Slug 3
Absolute Maximum Ratings Parameter AllnGaP InGaN Units DC Forward Current [1] 7 7 ma Peak Pulsing Current 15 24 ma Power Dissipation 182 273 mw LED Junction Temperature 125 135 C Operating Metal Slug Temperature Range at 35 ma -4 to +115-4 to +12 C Operating Metal Slug Temperature Range at 7 ma -4 to +1-4 to +15 C Storage Temperature Range -4 to +12-4 to +12 C Soldering Temperature Refer to Figure 26 Reverse Voltage [2] Note: 1. Derate linearly based on Figure 1 for AlInGaP and Figure 22 for InGaN. 2. Not recommended for reverse bias operation. Not recommended Optical Characteristics at 35 ma (T J = 25 C) Part Number Color Peak Wavelength, l PEAK (nm) Dominant Wavelength, l D [1] (nm) Viewing Angle, 2q½ [2] ( ) Typ. Typ. Typ. Typ. ASMT-AR3-AST Red 635 625 14 82 ASMT-AH3-ARS Red Orange 625 615 14 68 ASMT-AA3-ARS Amber 598 59 14 68 ASMT-AG31-NTU Green 519 525 14 7 ASMT-AG31-NUV 519 525 14 94 ASMT-AB31-NMP Blue 454 46 14 16 ASMT-AB31-NNP 454 46 14 21 Luminous Efficiency (lm/w) ASMT-AL31-NRS Royal Blue 45 455 14 Not applicable Part Number Color Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2q½ [2] ( ) Min. Max. Typ. Typ. ASMT-AW31-NVX Cool White 45 1 14 17 ASMT-AN31-NWX Neutral White 35 45 14 17 ASMT-AY31-NUW Warm White 27 35 14 85 Notes: 1. The dominant wavelength, l D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Luminous Efficiency (lm/w) 4
Electrical Characteristic at 35 ma (T J = 25 C) Dice Type Forward Voltage, V F (Volts) Min. Typ Max. Typ. AllnGaP 1.7 2.1 2.3 1 InGaN 2.8 3.2 3.5 1 Notes: 1. Rθ j-ms is Thermal Resistance from LED junction to metal slug. Thermal Resistance, Rθ j-ms ( C/W) [1] Optical and Electrical Characteristic at 7 ma (T J = 25 C) Part Number Color Luminous Flux (lm) / Radiometric Power (mw), Φ V Typ. ASMT-AR3-AST Red 112. 2.4 ASMT-AH3-ARS Red Orange 94. 2.4 ASMT-AA3-ARS Amber 94. 2.4 ASMT-AG31-NTU Green 125. 3.6 ASMT-AG31-NUV 168. 3.6 ASMT-AB31-NMP Blue 3. 3.6 ASMT-AB31-NNP 39. 3.6 ASMT-AL31-NRS Royal Blue 122 mw 3.6 ASMT-AW31-NVX Cool White 25. 3.6 ASMT-AN31-NWX Neutral White 25. 3.6 ASMT-AY31-NUW Warm White 162. 3.6 Forward Voltage, V F (Volts) Typ. 5
AlInGaP RELATIVE INTENSITY 1.9.8.7.6.5.4.3.2.1 AMBER RED ORANGE RED 53 545 56 575 59 65 62 635 65 665 68 WAVELENGTH - nm Figure 2. Relative Intensity vs. Wavelength for Red, Red Orange and Amber. RELATIVE LUMINOUS FLUX (NORMALIZED AT 35 ma) 2 1.8 1.6 1.4 1.2 1.8.6.4.2 1 2 3 4 5 6 7 MONO PULSE CURRENT - ma Figure 3. Relative Luminous Flux vs. Mono Pulse Current. FORWARD CURRENT - ma 7 65 6 55 5 45 4 35 3 25 2 15 1 5.5 1 1.5 2 2.5 3 FORWARD VOLTAGE - V Figure 4. Forward Current vs. Forward Voltage. NORMALIZED INTENSITY 1.9.8.7.6.5.4.3.2.1-9 -6-3 3 6 9 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern Red, Red Orange and Amber. IP - PULSE CURRENT - A 1.8 1.7 1.6 1.5 D = 1.4.5 1.3.1 1.2.25 1.1.5 1. 1..9.8.7.6.5.4 t p.3 D = tp I F.2 T.1 T..1.1.1 1 t p - PULSE DURATION - sec IP - PULSE CURRENT - A 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1..9.8.7.6.5.4.3.2.1. D = tp T D =.5.1.25.5 1..1.1.1 1 t p - PULSE DURATION - sec t p T I F Figure 6. Maximum pulse current vs.pulse duration. Derated based on T A = 25 C, Rθ J-A = 3 C/W. Figure 7. Maximum pulse current vs. pulse duration. Derated based on T A = 85 C, Rθ J-A = 3 C/W. 6
AlInGaP RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25 C) 12. 11. 1. 9. 8. 7. 6. 5. 4. 3. 2. 1.. RED-ORANGE RED AMBER 25 5 75 1 125 JUNCTION TEMPERATURE, T J - C Figure 8. Relative Light Output vs. Junction Temperature. FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25 C).5. -.5 -.1 -.15 -.2 AMBER RED Figure 9. Forward Voltage Shift vs. Junction Temperature. RED ORANGE -.25 25 5 75 1 125 JUNCTION TEMPERATURE, T J - C MAX ALLOWABLE DC CURRENT - ma 8 7 6 5 4 3 2 1 Rθ J-A = 2 C/W Rθ J-A = 25 C/W Rθ J-A = 3 C/W 2 4 6 8 1 12 14 AMBIENT TEMPERATURE, T A - C Figure 1. Maximum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 125 C, Rθ J-A = 2 C/W, 25 C/W and 3 C/W. MAX ALLOWABLE DC CURRENT - ma 8 7 6 5 4 3 2 1 Rθ J-MS = 1 C/W 2 4 6 8 1 12 14 METAL SLUG TEMPERATURE, T MS - C Figure 11. Maximum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 125 C, Rθ J-MS = 1 C/W. 7
InGaN RELATIVE INTENSITY 1..9.8.7.6.5.4.3 WARM WHITE NEUTRAL WHITE COOL WHITE.2.1. 38 48 58 68 78 WAVELENGTH - nm Figure 12. Relative Intensity vs. Wavelength for Warm White and Cool White. RELATIVE INTENSITY 1.9.8.7.6.5.4.3.2 GREEN BLUE ROYAL BLUE.1 38 45 43 455 48 55 53 555 58 65 63 WAVELENGTH - nm Figure 13. Relative Intensity vs. Wavelength for Blue, Royal Blue and Green. RELATIVE LUMINOUS FLUX / RADIOMETRIC POWER (NORMALIZED AT 35 ma) 2 1.8 1.6 1.4 1.2 1.8.6.4.2 1 2 3 4 5 6 7 MONO PULSE CURRENT - ma Figure 14. Relative Luminous Flux vs. Mono Pulse Current. FORWARD CURRENT - ma 7 65 6 55 5 45 4 35 3 25 2 15 1 5.5 1 1.5 2 2.5 3 3.5 4 FORWARD VOLTAGE - V Figure 15. Forward Current vs. Forward Voltage. NORMALIZED INTENSITY 1.9.8.7.6.5.4.3.2.1-9 -6-3 3 6 9 ANGULAR DISPLACEMENT - DEGREES NORMALIZED INTENSITY 1.9.8.7.6.5.4.3.2.1-9 -6-3 3 6 9 ANGULAR DISPLACEMENT - DEGREES Figure 16. Radiation Pattern for Blue, Royal Blue and Green Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White. 8
InGaN Ip - PULSE CURRENT - A 3. 2.8 2.6 2.4 2.2 2. 1.8 1.6 1.4 1.2 1..8.6.4.2. D = tp T D =.5.1.25.5 1..1.1.1 1 t p - PULSE DURATION - sec t p T I F Ip - PULSE CURRENT - A 3. 2.8 2.6 2.4 2.2 2. 1.8 1.6 1.4 1.2 1..8.6.4.2. D = tp T D =.5.1.25.5 1..1.1.1 1 t p - PULSE DURATION - sec t p T I F Figure 18. Maximum pulse current vs. pulse duration. Derated based on T A = 25 C, Rθ J-A = 3 C/W. Figure 19. Maximum pulse current vs. pulse duration. Derated based on T A = 85 C, Rθ J-A = 3 C/W. RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25 C) 12. 11. 1. 9. 8. 7. 6. 5. 4. 3. 2. 1.. BLUE ROYAL BLUE GREEN WHITE 25 5 75 1 125 15 JUNCTION TEMPERATURE, T J - C Figure 2. Relative Light Output vs. Junction Temperature. FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25 C).5. -.5 -.1 -.15 -.2 -.25 -.3 -.35 -.4 GREEN WHITE ROYAL BLUE BLUE -.45 25 45 65 85 15 125 145 JUNCTION TEMPERATURE, T J - C Figure 21. Forward Voltage Shift vs. Junction Temperature. MAX ALLOWABLE DC CURRENT - ma 8 7 6 5 4 3 2 1 Rθ J-A = 2 C/W Rθ J-A = 25 C/W Rθ J-A = 3 C/W 2 4 6 8 1 12 14 AMBIENT TEMPERATURE, T A - C Figure 22. Maximum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 135 C, Rθ J-A = 2 C/W, 25 C/W and 3 C/W. MAX ALLOWABLE DC CURRENT - ma 8 7 6 5 4 3 2 1 Rθ J-MS = 1 C/W 2 4 6 8 1 12 14 METAL SLUG TEMPERATURE, T MS - C Figure 23. Maximum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 135 C, Rθ J-MS = 1 C/W. 9
1.6 Ø 6.4 4.38 8.8 14.1 2.65 5.8 1.1 Figure 24. Recommended soldering land pattern. Figure 25. Recommended pick and place nozzle tip. Inner diameter = 5.8 mm 1 to 3 SEC. TEMPERATURE 217 C 2 C 15 C 255-26 C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX. 6-12 SEC. 1 SEC. MAX. TIME Figure 26. Recommended Reflow Soldering. (Acc. to J-STD-2C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN16 Surface Mounting SMT LED Indicator Components. 1
Option Selection Details ASMT-A x 1 3 x 2 x 3 x 4 x 5 x 6 x 7 x 4 Minimum Flux Bin Selection x 5 Maximum Flux Bin Selection x 6 Color Bin Selection x 7 Packaging Option Color Bin Selection [x 6 ] Individual reel or tube will contain parts from one color bin selection only. Cool White Selection Bin ID Full Distribution B E F G H J K L M N P Q VN and V VM, UM, VN and UN WM, VM, WN and VN XM, WM, XN and WN UN, VN, U and V WN, VN, W and V XN, WN, X and W V, U, VP and UP W, V, WP, VP and WQ X, W, XP, WP and WQ Y YA Flux / Power Bin Limit [x 4, x 5 ] Luminous Flux (lm) / Radiometric Power (mw) at 35 ma Color Bin ID Min. Max. Blue M 13.9 18.1 N 18.1 23.5 P 23.5 3.6 Other Colors R 39.8 51.7 S 51.7 67.2 T 67.2 87.4 U 87.4 99.6 V 99.6 113.6 W 113.6 129.5 X 129.5 147.7 Royal Blue P 355. 435. Q 435. 515. R 515. 595. S 595. 685. Tolerance for each bin limits is ±1 % Warm White Selection Bin ID Full Distribution A B C E F G H J K L M N M and MA PA and P N1 and N NM, MM, N1 and M1 PM, NM, P1 and N1 QM, PM, Q1 and P1 M1, N1, M and N P1, N1, P and N Q1, P1, Q and P N, M, NA and MA P, N, PA and NA Q, P, QA and PA Neutral White Selection Bin ID Full Distribution A S1 and S B S and R E SM, RM, S1 and R1 F TM, SM, TN and S1 G S1, R1, S and R H TN, S1, T and S J S, R, SA and RA K T, S, TP and SA Other Colors Selection Bin ID Full Distribution Z A and B Y B and C W C and D V D and E Q A, B and C P B, C and D N C, D and E M D, E and F 11
Y-COORDINATE.42.4.38.36.34.32.3.28 1K 7K Y YA 45K 5K UM 565K VM 63K UN WM VN U XM WN V UP XN W VP X WP XP WQ BLACK BODY CURVE Y-COORDINATE.48.46.44.42.4.38.36.34 QA Q 35K Q1 QM P1 P PA NA 325K PM N1 N MA 35K NM M 285K M1 MM 27K BLACK BODY CURVE.26.26.28.3.32.34.36.38.4 X-COORDINATE Figure 27. Color bin structure for Cool White..32.38.4.42.44.46.48.5 X-COORDINATE Figure 28. Color bin structure for Warm White..46 Y-COORDINATE.44.42.4.38.36.34 45K TP TM TN T SA 41K SM S1 S RA 35K 38K RM R1 R BLACK BODY CURVE.32.34.36.38.4.42.44 X-COORDINATE Figure 29. Color bin structure for Neutral White. 12
Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Bin UM x.365.367.348.347 y.386.4.385.372 Bin UN x.365.362.346.347 y.386.372.359.372 Bin U x.362.36.344.346 y.372.357.344.359 Bin UP x.36.357.343.344 y.357.342.311.344 Bin VM x.329.329.348.347 y.357.369.385.372 Bin VN x.329.329.347.346 y.345.357.372.359 Bin V x.329.329.346.344 y.311.345.359.344 Bin VP x.329.344.343.329 y.331.344.331.32 Bin WM x.329.329.315.314 y.369.357.344.355 Bin WN x.329.316.315.329 y.345.333.344.357 Bin W x.329.329.317.316 y.345.331.32.333 Bin WP x.329.329.318.317 y.331.32.31.32 Bin WQ x.329.329.319.318 y.32.31.3.31 Bin XM x.31.314.315.33 y.342.355.344.333 Bin XN x.35.33.315.316 y.322.333.344.333 Bin X x.38.35.316.317 y.311.322.333.32 Bin XP x.38.317.319.311 y.311.32.3.293 Bin Y x.38.283.274.33 y.311.284.31.333 Bin YA x.38.311.29.283 y.311.293.27.284 Tolerance: ±.1 Warm White Color Limits (Chromaticity Coordinates) Bin MM x.471.46.473.486 y.451.43.432.455 Bin M1 x.46.453.467.473 y.43.416.419.432 Bin M x.453.444.459.467 y.416.399.43.419 Bin MA x.459.444.436.451 y.43.399.384.389 Bin NM x.454.444.46.471 y.446.426.43.451 Bin N1 x.444.438.453.46 y.426.412.416.43 Bin N x.438.429.444.453 y.412.394.399.416 Bin NA x.444.429.422.436 y.399.394.379.384 Bin PM x.438.43.444.454 y.44.421.426.446 Bin P1 x.43.424.438.444 y.421.47.412.426 Bin P x.424.416.429.438 y.47.389.394.412 Bin PA x.429.416.41.422 y.394.389.374.379 Bin QM x.421.414.43.438 y.433.414.421.44 Bin Q1 x.414.49.424.43 y.414.4.47.421 Bin Q x.49.42.416.424 y.4.382.389.47 Bin QA x.416.42.396.41 y.389.382.367.374 Tolerance: ±.1 13
Neutral White Color Limits (Chromaticity Coordinates) Bin RM x.421.414.397.42 y.433.414.46.423 Bin R1 x.414.49.392.397 y.414.4.391.46 Bin R x.392.387.42.49 y.391.374.382.4 Bin RA x.387.383.396.42 y.374.36.367.382 Bin SM x.42.397.382.386 y.423.46.397.413 Bin S1 x.397.392.378.382 y.46.391.382.397 Bin S x.392.387.374.378 y.391.374.366.382 Bin SA x.387.383.37.374 y.374.36.351.366 Bin TM x.386.382.365.367 y.413.397.386.4 Bin TN x.382.378.362.365 y.397.382.372.386 Bin T x.378.374.36.362 y.382.366.357.372 Bin TP x.374.37.357.36 y.366.351.342.357 Tolerance: ±.1 Color Bin ID Dominant Wavelength (nm) at 35 ma Min. Max. Red 62. 635. Red Orange 61. 62. Amber B 587. 589.5 C 589.5 592. D 592. 594.5 E 594.5 597. Green A 515. 52. B 52. 525. C 525. 53. D 53. 535. Blue A 455. 46. Tolerance: ±1 nm Color B 46. 465. C 465. 47. D 47. 475. Bin ID Peak Wavelength (nm) at 35 ma Min. Max. Royal Blue C 44. 445. Tolerance: ±2 nm D 445. 45. E 45. 455. F 455. 46. Packaging Option [x 7 ] Selection Option Tube 1 Tape and Reel Example ASMT-AW31-NUV ASMT-AW31-Nxxxx Cool White, InGaN, Electrically isolated Heat Sink x 4 = U Minimum Flux Bin U x 5 = V Maximum Flux Bin V x 6 = Full Distribution x 7 = Tube Option 14
Packing Tube Option 17.2 ±.1.4 ±.1 7.3 ±.1 3.4 ±.1 5. ±.1 8.4 ±.1 395mm Figure 3. Package tube dimensions. 15
Tape and Reel Option 1 1.75 ±.1 4. ±.1 2. ±.1 B Ø 1.5 +.1..4 ±.5 24. ±.3 11.5 ±.1 A A Ø 8.1 +.1. BO 14.3 ±.1 12. ±.1 B KO 4.5 ±.1 R.3 Max (TYP.) Section 'B-B' 2.55 AO 8.1 ±.1 Section 'A-A' Figure 31. Carrier tape dimensions. Ø 33. ± 2. 1.8 +.2. 24. +.2. 2. ±.5 Ø 21. ±.8 Ø 13. +.5.2 1 ±.5 Detail 1 See Detail 1 Figure 32. Reel dimensions. 16
Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-2. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at < 4 C/9%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB The humidity indicator card (HIC) shall be read immediately upon opening of MBB. The LEDs must be kept at < 3 C/6%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at < 5%RH. D. Control of assembled boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at < 5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: HIC 1% indicator is NOT Brown and 5% indicator is Azure. The LEDs are exposed to condition of > 3 C/6%RH at any time. The LED floor life exceeded 672 hrs. Recommended baking condition: 6±5 C for 2 hrs. DISCLAIMER: Avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 25-215 Avago Technologies. All rights reserved. AV2-248EN - February 2, 215