OEM Silicon Pressure Die

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OEM Silicon Pressure Die SM9520 Series FEATURES High volume, cost effective Gauge configuration Constant current or constant voltage drive Millivolt output Available in 0.15, 0.60 & 1.50 PSIG full-scale Ratiometric with supply voltage up to 6.5 V Manufactured according to ISO9001 and ISO/TS 16949 standards RoHS & REACH compliant DESCRIPTION The SM9520 is a silicon micro-machined, piezoresistive pressure sensing die. This device is available with a full-scale range of 0.15 to 1.50 PSI (1.0 to 10 kpa) and is ideal for OEM and high-volume applications. Provided in die form, these sensors can be mounted on ceramic or PC board substrates as part of an OEM system. They also may be packaged into proprietary or application specific sensor lines. Dies are electrically probed, diced, inspected, and shipped on tape. Medical Industrial Automotive Patient Monitors Industrial Controls Diesel Particulate Filter Blood Pressure Monitors Compressors & Pumps Exhaust Gas Recirculation Oxygen Concentrators Pressure Switches Automotive Systems Fluid Evacuation Oil-Filled Packages Ventilators Page 1

Absolute Maximum Ratings No. Characteristic Symbol Minimum Typical Maximum Units 1 Excitation Voltage (a) V DD - - 6.5 V 2 Operating Temperature T OP -40 - +85 C 3 Storage Temperature (a) T STG -40 - +125 C Notes: a. Bridge must be driven with the positive voltage applied to +Vex No. Product Number Operating Pressure Proof Pressure Burst Pressure (P PROOF ) (b) (P BURST ) (b) 4 SM9520-010M-G-D 0 to 0.15 PSI 1.5 PSI 3.0 PSI 5 SM9520-040M-G-D 0 to 0.60 PSI 4.8 PSI 6.0 PSI 6 SM9520-100M-G-D 0 to 1.50PSI 12 PSI 15 PSI Notes: b. Tested on a sample basis. Page 2

OPERATING CHARACTERISTICS FOR SM9520 DIE The operating characteristics are based on packaged die. The sensor performance may vary depending on the die attach material and process. The die attach material and process should minimize the stress transferred to the sensor die. All parameters are specified at VSUPPLY = 5.00 V supply voltage at 25 C, unless otherwise noted. Operating Characteristics - Specifications All parameters are specified at Vdd = 5.0 V supply voltage at 25 o C, unless otherwise noted. No. Characteristic Symbol Minimum Typical Maximum Units 7 Span (FS P RANGE ) 0.15 PSIG (b) 30 45 60 0.60 PSIG (b) 60 90 120 V SPAN 1.50 PSIG (b) 65 95 125 mv 8 Zero Offset V ZERO -75-25 mv 9 TC Span (b, c ) TCS -0.24-0.21-0.155 %FS/ C 10 TC Zero Offset (b, c) TCZ -100-100 µv/ C 11 TC Resistance (c, e) TCR 0.17 0.20 0.23 %Rb/ C 12 Linearity - Topside (b, d) NL TS -0.15 ±0.1 0.15 %/FS 13 Linearity Backside (b, d) NL BS -0.35 ±0.2 0.35 %/FS 14 Bridge Resistance R B 4.0 5.2 6.0 kω Notes: b. Tested on a sample basis c. Determined by measurements taken over -40 to 85 o C d. Defined as best fit straight line e. Tested annually on a sample basis. Page 3

SM9520 Diagrams and Dimensions All dimensions are in micron. Assembly Recommendations (a) Use soft RTV for die-attachment (b) A bond line thickness of 180-220 µm is recommended (c) The RTV should not go up the inside of the die cavity by more than 50% of the die thickness. Typical Operation Pad Coordinate PAD # PAD DESCRIPTION PAD LABEL TYPE VALUE Coordinate X-Axis (µm) Coordinate Y-Axis (µm) 1 VSIG+2 Positive Analog Out - 0 0 2 -VEXC2 Negative Power 0 V 0 1760 3 +VEXC2 Positive Power +5 V 350 1760 4 VSIG+1 Positive Analog Out - 700 1760 5 +VEXC1 Positive Power 5 V 1050 1760 6 -VEXC1 Negative Power 0 V 1400 1760 7 VSIG-1 Negative Analog Out - 1760 1760 8 VSIG-2 Negative Analog Out - 1760 1360 9 -VEXC3 Negative Power 0 V 1760 0 Bond pad opening size = 100x100 µm Page 4

Ordering Information Order Code Full-Scale Pressure Range Pressure Type Minimum Order Quantity SM9520-010M-G-D 0.15 PSI SM9520-040M-G-D 0.60 PSI Gauge 1 Wafer (1 wafer = 2,700 ±10%) SM9520-100M-G-D 1.50 PSI Part Number Legend Qualification Standards REACH Compliant RoHS Compliant PFOS/PFOA Compliant For qualification specifications, please contact Sales at sales@si-micro.com Page 5

Silicon Microstructures Warranty and Disclaimer: Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to amend the contents of this data sheet at any time and at its sole discretion. Information in this document is provided solely to enable software and system implementers to use Silicon Microstructures, Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design or fabricate any siliconbased microstructures based on the information in this document. Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of any product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Silicon Microstructure s data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals, must be validated for each customer application by customer s technical experts. Silicon Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures, Inc. makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Silicon Microstructures, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Silicon Microstructures, Inc. was negligent regarding the design or manufacture of the part. Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty workmanship. Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon Microstructures, Inc. in writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc. directly for specific warranty details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of coverage, Silicon Microstructures, Inc. will repair or replace, at its option, without charge those items it finds defective. The foregoing is buyer s sole remedy and is in lieu of all warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Silicon Microstructures, Inc. be liable for consequential, special, or indirect damages. While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific application. The information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this printing. However, Silicon Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes no responsibility for any inaccuracies and/or errors in this publication and reserves the right to make changes without further notice to any products or specifications herein Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All other service or product names are the property of their respective owners. Silicon Microstructures, Inc. 2001-2017. All rights reserved. Page 6