µclamp61p - µclamp661p High Power MicroClamp 1-Line ESD and Surge Protection PROTECTION PRODUCTS Description µclamp TVS diodes are designed to protect sensitive electronics from damage or latch-up due to EOS, lightning, CDE, and ESD. They feature large crosssectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. µclamp xx61p series are designed for for use in harsh transient environments. They feature extremely good protection characteristics highlighted by high surge current capability, low peak ESD clamping voltage, and high ESD withstand voltage. Device options are available for protecting data or power lines operating at V to 6V. µclamp xx61p are in a 2-pin SLP168P2 package measuring 1.6 x.8 mm with a nominal height of.mm. The leads are finished with lead-free NiAu. High surge current capability and low clamping voltage making them ideal for protecting VBus, battery, and other power lines in consumer and industrial electronics. Package Dimension.8 Features Transient Protection to IEC 61-4-2 (ESD) 3kV (Air), 3kV (Contact) IEC 61-4-4 (EFT) 4kV (/ns) IEC 61-4- (Lightning) 8-8A (8/2µs) Protects one data or power line Working voltage options: V, 1V, 12V, 1V, 24V, 3V, 36V, 4V, 6V Low leakage current High peak pulse current capability Solid-state silicon-avalanche technology Mechanical Characteristics SLP168P2 package Pb-Free, Halogen Free, RoHS/WEEE compliant Nominal Dimensions: 1.6 x.8 x. mm Lead Finish: NiAu Marking: Marking code Packaging: Tape and Reel Applications Cellular Handsets Industrial Equipment Microcontroller RESET and IRQ Pins USB Voltage Bus Battery protection Tablet PC CCTV Cameras Instrumentation Schematic & Pin Configuration 2 1.6 1. SLP168P2 (Bottom View) µclamp61p - µclamp661p www.semtech.com 1 of 12
Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/2µs) P PK 12-16 W Peak Pulse Current (tp = 8/2µs) 8-8 A ESD per IEC 61-4-2 (Contact) (1) ±3 V ESD per IEC 61-4-2 (Air) (1) ESD ±3 Operating Temperature T J -4 to +12 O C Storage Temperature T STG - to +1 O C kv Electrical Characteristics (T=2 O C unless otherwise specified) µclamp61p Reverse Stand-Off Voltage -4 O C to 12 O C V 6 7 9 V = V T = 2 O C 3 na Peak Pulse Current tp = 8/2µs 8 A = 4A, tp = 8/2µs, = 8A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2):Tested using a constant current source 12 V 1 V. Ohms T = 2 O C 8 pf (3): Transmission Line Pulse Test (TLP) Settings: tp = 1ns, tr =.2ns, I TLP and V TLP averaging window: t 1 = 7ns to t 2 = 9ns. (4): Dynamic resistance calculated from I TLP = 4A to I TLP = 16A µclamp61p - µclamp661p www.semtech.com 2 of 12
Electrical Characteristics (T=2 O C unless otherwise specified) µclamp161p Reverse Stand-Off Voltage -4 O C to 12 O C 1 V 12 13. 1. V = 1V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 6 A = 1A, tp = 8/2µs, = 6A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 17 V 2 V. Ohms T = 2 O C 3 pf µclamp1261p Reverse Stand-Off Voltage -4 O C to 12 O C 12 V 14 16. 19 V = 12V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 4 A = 1A, tp = 8/2µs, = 4A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 2 V 33 V. Ohms T = 2 O C 27 pf µclamp61p - µclamp661p www.semtech.com 3 of 12
Electrical Characteristics (T=2 O C unless otherwise specified) µclamp161p Reverse Stand-Off Voltage -4 O C to 12 O C 1 V 17. 2 23 V = 1V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 4 A = 1A, tp = 8/2µs, = 4A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 28 V 4 V. Ohms T = 2 O C 22 pf µclamp2461p Reverse Stand-Off Voltage -4 O C to 12 O C 24 V 27 32 36 V = 24V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 23 A = 1A, tp = 8/2µs, = 23A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz V 6 V.2 Ohms T = 2 O C 16 pf µclamp61p - µclamp661p www.semtech.com 4 of 12
Electrical Characteristics (T=2 O C unless otherwise specified) µclamp361p Reverse Stand-Off Voltage -4 O C to 12 O C 3 V 34 4 42 V = 3V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 18 A = 1A, tp = 8/2µs, = 18A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz V 6 V.2 Ohms T = 2 O C 1 pf µclamp3661p Reverse Stand-Off Voltage -4 O C to 12 O C 36 V 37 4 44 V = 36V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 18 A = 2A, tp = 8/2µs, = 18A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 48 V 7 V.2 Ohms T = 2 O C 1 pf µclamp61p - µclamp661p www.semtech.com of 12
Electrical Characteristics (T=2 O C unless otherwise specified) µclamp461p Reverse Stand-Off Voltage -4 O C to 12 O C 4 V 4 V = 4V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 12 A = 12A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 8 V.3 Ohms T = 2 O C 12 pf µclamp661p Reverse Stand-Off Voltage -4 O C to 12 O C 6 V 6 7 8 V = 6V T = 2 O C <1 1 na Peak Pulse Current tp = 8/2µs 8 A = 8A, tp = 8/2µs, tp =.2/1ns (TLP) = V, f = 1MHz 1 V.4 Ohms T = 2 O C 11 pf µclamp61p - µclamp661p www.semtech.com 6 of 12
Typical Characteristics Clamping Voltage vs. Peak Pulse Current ( = V - 1V) Clamping Voltage vs. Peak Pulse Current ( = 24V - 6V) ClampingVoltage - Vc(V) 3 3 2 2 1 1 µclamp161p µclamp1261p µclamp161p µclamp61p T A = 2 O C Waveform 8x2us 2 4 6 8 1 Peak Pulse Current - Ipp (A) ClampingVoltage - Vc(V) 12 1 8 6 4 2 µclamp661p µclamp461p µclamp3661p µclamp361p µclamp2461p T A = 2 O C Waveform 8x2us 1 1 2 2 Peak Pulse Current - Ipp (A) ESD Clamping (8kV Contact per IEC 61-4-2) ESD Clamping (8kV Contact per IEC 61-4-2) Clamping Voltage 4 4 3 3 2 2 1 µclamp161p V PK = 39V V 3ns = 17V µclamp61p V PK = 34V V 3ns = 7.V Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane. Clamping Voltage 4 4 3 3 2 2 1 µclamp161p V PK = 46V V 3ns = 2V µclamp1261p V PK = 4V V 3ns = 19V Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane. 1 1-1 1 2 3 4 6 7 8 Time (ns) -1 1 2 3 4 6 7 8 Time (ns) ESD Clamping (8kV Contact per IEC 61-4-2) ESD Clamping (8kV Contact per IEC 61-4-2) Clamping Voltage 12 1 8 6 4 µclamp3661p V PK = 97V V 3ns = 1.V µclamp361p V PK = 86V V 3ns = 46.V µclamp2461p V PK = 6V V 3ns = 36V Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane. Clamping Voltage 16 14 12 1 8 6 µclamp661p V PK = 131V V 3ns = 8V µclamp461p V PK = 16V V 3ns = 68V Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane. 4 2 2-1 1 2 3 4 6 7 8 Time (ns) -1 1 2 3 4 6 7 8 Time (ns) µclamp61p - µclamp661p www.semtech.com 7 of 12
Typical Characteristics ESD Clamping (-8kV Contact per IEC 61-4-2) Forward Voltage vs. Peak Pulse Current ( = V - 6V) - 6 T A = 2 O C Waveform: tp= 8x2us Clamping Voltage -1-1 -2-2 -3-3 -4 µclamp61p µclamp661p V PK = 37V V 3ns = 1.V Measured with Ohm scope input impedance, 2GHz bandwidth. Corrected for Ohm, 2dB attenuator. ESD gun return path connected to ESD ground plane. -4-1 1 2 3 4 6 7 8 Time (ns) Peak Clamping Voltage - V C (V) 4 3 2 1 1 2 3 4 6 7 8 9 Peak Pulse Current - (A) TLP Characteristic (Positive Pulse) - ( = V - 1V) TLP Characteristic (Positive Pulse) - ( = 24V - 6V) TLP Current (A) 4 3 3 2 2 1 1 Transmission Line Pulse Test (TLP) Settings:t p = 1ns, t r =.2ns, I TLP and V TLP averaging window: t 1 = 7ns to t 2 = 9ns µclamp61p µclamp161p µclamp1261p 1 1 2 2 Clamping Voltage (V) µclamp161p TLP Current (A) 4 3 3 2 2 1 1 Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.2ns, I TLP and V TLP averaging window: t 1 = 7ns to t 2 = 9ns µclamp2461p µclamp361p µclamp3661p µclamp461p µclamp661p 2 4 6 8 1 Clamping Voltage (V) Capacitance vs. Reverse Voltage - ( = V - 1V) Capacitance vs. Reverse Voltage - ( = 24V - 6V) 8 7 f = 1 MHz 14 12 Capacitance (pf) 6 4 3 2 1 µclamp61p µclamp161p µclamp1261p µclamp161p 1 1 2 Voltage (V) Capacitance (pf) 1 8 6 µclamp2461p 4 µclamp461p µclamp3661p 2 µclamp361p µclamp661p f = 1 MHz 1 2 3 4 6 7 Voltage (V) µclamp61p - µclamp661p www.semtech.com 8 of 12
Application Information Assembly Guidelines The figure at the right details s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. s recommended mounting pattern is based on the following design guidelines: Recommended Mounting Pattern Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of.7.7 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Table 1 - Recommended Assembly Guidelines Assembly Parameter Solder Stencil Design Aperture Shape Recommendation Laser Cut, Electro-Polished Rectangular Solder Stencil Thickness.12mm (. ) Solder Paste Type Solder Reflow Profile PCB Solder pad Design PCB Pad Finish Type 3 size sphere or smaller Per JEDEC J-STD-2 Non-Solder Mask Defined OSP or NiAu recommends a stencil thickness of.12mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. Since this device has uneven pad sizes, the recommended stencil opening is 1% smaller than the size of the large pad and 2um larger than the size of the small pad. This is done to control solder height and keep the part planar during reflow. Solder paste with Type 3 or smaller particles are recommended. µclamp61p - µclamp661p www.semtech.com 9 of 12
Outline Drawing - SLP168P2 A D B E DIMENSIONS DIM MILLIMETERS MIN NOM MAX A.47..3 A1..2. b D..7.6.8.6.8 E 1. 1.6 1.6 L.8.8.9 L1.13.18.23 N 2 aaa.8 bbb.1 A aaa C A1.1 D/2 C SEATING PLANE (A) L E/2.36 (.1) L1 bxn bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP168P2 DIMENSIONS DIM MILLIMETERS G.26 X.9 Y 1. Y1.38 Z 1.7 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. µclamp61p - µclamp661p www.semtech.com 1 of 12
Marking Ordering Information Cathode Bar Notes: 1) Dashes represent matrix date code 2) See ordering information for part specific marking codes 2 1 Part Number Marking Code Working Voltage Qty per 7 Reel µclamp61p.tnt 6A V 1, µclamp161p.tnt 6B 1V 1, µclamp1261p.tnt 6C 12V 1, µclamp161p.tnt 6D 1V 1, µclamp2461p.tnt 6F 24V 1, µclamp361p.tnt 6G 3V 1, µclamp3661p.tnt 6H 36V 1, µclamp461p.tnt 6J 4V 1, µclamp661p.tnt 6K 6V 1, Notes: 1) MicroClamp, uclamp and µclamp are trademarks of Corporaton Tape and Reel Specification 6A 6A 6A 6A 6A Cathode Location (Towards Sprocket Holes) µclamp61p - µclamp661p www.semtech.com 11 of 12
IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and assumes no liability for any errors in this document, or for the application or design described herein. reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER S OWN RISK. Should a customer purchase or use products for any such unauthorized application, the customer shall indemnify and hold and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The name and logo are registered trademarks of the Corporation. All other trademarks and trade names mentioned may be marks and names of or their respective companies. reserves the right to make changes to, or discontinue any products described in this document without further notice. makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. 21 Contact Information Corporation 2 Flynn Road, Camarillo, CA 9312 Phone: (8) 498-2111, Fax: (8) 498-384 www.semtech.com µclamp61p - µclamp661p 12 of 12