DISCRETE SEMICONDUCTORS DATA SHEET. ok, halfpage M3D302. PMEM4020ND NPN transistor/schottky-diode module. Product data sheet 2003 Nov 10

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DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D302 NPN transistor/schottky-diode module 2003 Nov 0

FEATURES 600 mw total power dissipation High current capability Reduces required PCB area Reduced pick and place costs Small plastic SMD package. Transistor: Low collector-emitter saturation voltage. PINNING PIN DESCRIPTION emitter 2 not connected 3 cathode 4 anode 5 base 6 collector Diode: Ultra high-speed switching Very low forward voltage Guard ring protected. APPLICATIONS DC-to-DC converters Inductive load drivers MOSFET drivers. DESCRIPTION 6 Marking code: B6. Fig. 5 4 2 3 MGU865 Simplified outline (SOT457) and symbol. 4 5 3 6 Combination of an NPN transistor with low V CEsat and high current capability and a planar Schottky barrier diode with an integrated guard ring for stress protection in a SOT457 (SC-74) small plastic package. PNP complement: PMEM4020PD. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION plastic surface mounted package; 6 leads SOT457 2003 Nov 0 2

LIMITING VALUES In accordance with the Absolute Maximum System (IEC 6034). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT NPN transistor V CBO collector-base voltage open emitter 40 V V CEO collector-emitter voltage open base 40 V V EBO emitter-base voltage open collector 5 V I C collector current (DC) note 0.95 A Notes. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; standard footprint for SOT457. 2. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; mounting pads for collector and cathode both cm 2. 3. Device mounted on a ceramic printed-circuit board, single-sided copper; tinplated; standard footprint. 4. Solder point of collector or cathode tab. note 2.30 A note 3.65 A T s 55 C; note 4 2.0 A I CM peak collector current 3 A I BM peak base current A P tot total power dissipation T amb 25 C; note 295 mw T amb 25 C; note 2 400 mw T amb 25 C; note 3 500 mw T s 55 C; note 4 000 mw T j junction temperature 50 C Schottky barrier diode V R continuous reverse voltage 20 V I F continuous forward current A I FSM non-repetitive peak forward current t = 8.3 ms square wave 5 A P tot total power dissipation T amb 25 C; note 295 mw T amb 25 C; note 2 400 mw T amb 25 C; note 3 500 mw T s 55 C; note 4 000 mw T j junction temperature note 2 50 C Combined device P tot total power dissipation T amb = 25 C; note 2 600 mw T stg storage temperature 65 +50 C T amb operating ambient temperature note 2 65 +50 C 2003 Nov 0 3

THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Single device R th j-s R th j-a thermal resistance from junction to solder point thermal resistance from junction to ambient Combined device R th j-a thermal resistance from junction to ambient in free air; notes and 2 95 K/W in free air; notes and 3 250 K/W in free air; notes and 4 35 K/W in free air; notes and 5 425 K/W in free air; notes and 3 208 K/W Notes. For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses P R are a significant part of the total power losses. Nomograms for determination of the reverse power losses P R and I F (AV) rating will be available on request. 2. Solder point of collector or cathode tab. 3. Device mounted on a ceramic printed-circuit board; single-sided copper; tinplated; standard footprint. 4. Device mounted on a FR4 printed-circuit board, single-sided copper; tinplated; mounting pad for collector and cathode cm 2 /each. 5. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; standard footprint for SOT457. 2003 Nov 0 4

ELECTRICAL CHARACTERISTICS T amb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT NPN transistor I CBO collector-base cut-off current V CB = 40 V; I E = 0 00 na Note. Pulse test: t p 300 µs; δ 0.02. V CB = 40 V; I E = 0; T amb = 50 C 50 µa I CEO collector-emitter cut-off current V CE = 30 V; I B = 0 00 na I EBO emitter-base cut-off current V EB = 5 V; I C = 0 00 na h FE current gain (DC) V CE = 5 V; I C = ma 300 V CE = 5 V; I C = 500 ma 300 900 V CE = 5 V; I C = A 200 V CE = 5 V; I C = 2 A; note 75 V CEsat collector-emitter saturation voltage I C = 00 ma; I B = ma 75 mv I C = 500 ma; I B = 50 ma 00 mv I C = A; I B = 00 ma 90 mv I C = 2 A; I B = 200 ma 400 mv V BEsat base-emitter saturation voltage I C = A; I B = 00 ma.2 V R CEsat equivalent on-resistance I C = A; I B = 00 ma; note 50 90 mω V BEon base-emitter turn-on voltage V CE = 5 V; I C = A. V f T transition frequency I C = 50 ma; V CE = 0 V; 50 MHz f = 00 MHz C c collector capacitance V CB = 0 V; I E = 0; i e = 0; f = MHz 0 pf Schottky barrier diode V F continuous forward voltage see Fig.2; note I F = 0 ma 240 270 mv I F = 00 ma 300 350 mv I F = 000 ma 480 550 mv I R reverse current see Fig.3; note V R = 5 V 5 0 µa V R = 8 V 7 20 µa V R = 5 V 0 50 µa C d diode capacitance V R = 5 V; f = MHz; see Fig.4 9 25 pf 2003 Nov 0 5

GRAPHICAL DATA 0 3 I F (ma) MLE230 0 5 I R (µa) 0 4 () MHC32 0 2 0 3 (2) 0 () (2) (3) 0 2 (3) 0 0 00 200 300 400 500 V F (mv) 0 5 0 5 20 25 V R (V) Schottky barrier diode. () T amb = 25 C. (2) T amb = 85 C. (3) T amb = 25 C. Schottky barrier diode. () T amb = 25 C. (2) T amb = 85 C. (3) T amb = 25 C. Fig.2 Forward current as a function of forward voltage; typical values. Fig.3 Reverse current as a function of reverse voltage; typical values. 80 C d (pf) MHC33 000 h FE 800 () MHC077 60 600 (2) 40 400 (3) 20 200 0 0 5 0 5 20 VR (V) Schottky barrier diode; f = MHz; T amb = 25 C. 0 0 0 NPN transistor; V CE = 5 V. () T amb = 50 C. (2) T amb = 25 C. (3) T amb = 55 C. 0 2 0 3 0 4 I C (ma) Fig.4 Diode capacitance as a function of reverse voltage; typical values. Fig.5 DC current gain as a function of collector current; typical values. 2003 Nov 0 6

0 MHC078 0 3 MHC079 V BE (V) V CEsat (mv) 0 2 () () (2) (2) (3) 0 (3) 0 0 0 0 2 0 3 0 4 I C (ma) 0 0 2 0 3 0 4 I C (ma) NPN transistor; V CE = 5 V. () T amb = 55 C. (2) T amb = 25 C. (3) T amb = 50 C. NPN transistor; I C /I B = 0. () T amb = 50 C. (2) T amb = 25 C. (3) T amb = 55 C. Fig.6 Base-emitter voltage as a function of collector current; typical values. Fig.7 Collector-emitter saturation voltage as a function of collector current; typical values. 0 2 MHC080 R CEsat (Ω) 0 400 f T (MHz) 300 MHC08 200 () 00 0 0 0 (2) (3) 0 2 0 3 0 4 I C (ma) 0 0 200 400 600 800 000 I C (ma) NPN transistor; I C /I B = 0. () T amb = 50 C. (2) T amb = 25 C. (3) T amb = 55 C. NPN transistor; V CE = 0 V. Fig.8 Equivalent on-resistance as a function of collector current; typical values. Fig.9 Transition frequency as a function of collector current. 2003 Nov 0 7

APPLICATION INFORMATION V CC V IN V OUT CONTROLLER R load IN MLE23 MDB577 Fig.0 DC-to-DC converter. Fig. Inductive load driver (relays, motors, buzzers) with free-wheeling diode. 2003 Nov 0 8

PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT457 D B E A X y H E v M A 6 5 4 Q pin index A 2 3 A c L p e b p w M B detail X 0 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A bp c D E e H E Lp Q v w y mm. 0.9 0. 0.03 0.40 0.25 0.26 0.0 3. 2.7.7.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT457 SC-74 97-02-28 0-05-04 2003 Nov 0 9

DATA SHEET STATUS Notes DOCUMENT STATUS () PRODUCT STATUS (2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Production This document contains the product specification.. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6034) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 2003 Nov 0 0

Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/0/pp Date of release: 2003 Nov 0 Document order number: 9397 750 906