Cree XLamp XM-L LEDs Product family data sheet CLD-DS33 Rev 3 WWW.CREE.COM/XLMP Product Description FETURES The XLamp XM-L LED is the Maximum drive current: industry s highest performance, 3000 m single-die white lighting-class LED. Low thermal resistance: The XLamp XM-L is 20% more 2.5 C/W efficient than the XLamp XP-G at the same current, and can deliver 1000 lumens with 100 lumens per Maximum junction temperature: 150 C watt efficacy. The XLamp XM-L Viewing angle: 125 LED offers Cree s industry-leading vailable in 80 CRI minimum, features: wide viewing angle, warm, neutral and cool white symmetrical package, unlimited NSI-compatible chromaticity floor life and electrically neutral bins thermal path. Unlimited floor life at XLamp XM-L LEDs can enable 30 ºC/85% RH LED light into new applications Reflow solderable - that require tens of thousands of JEDEC J-STD-020C lumens, such as high bay and highoutput Electrically neutral thermal area lighting. The XM-L is path also the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED light bulbs, outdoor lighting, portable lighting, indoor lighting and solar-powered lighting. TBLE OF CONTENTS Label Flux Characteristics... with Cree Bin Code, 2 Qty, Characteristics... Lot #... 2 10 Label Relative with Spectral Customer Power Order Code,... 10 Distribution... 3 Qty, Relative Reel ID, Flux PO#... vs. Junction 10 Temperature... 3 Electrical Characteristics... 4 Thermal Design... 4 Relative Flux vs. Current... 5 Relative Chromaticity vs. Current and Temperature (Cool White)... 5 Relative Chromaticity vs. Current and Temperature (Warm White)... 6 Typical Spatial Distribution... 7 Reflow Soldering Characteristics... 8 Notes... 9 Mechanical Dimensions...10 Tape and Reel...11 Packaging...12 Copyright 2010-2011 Cree, Inc. ll rights reserved. The information in this document is subject to change without notice. Cree, Inc. Copyright 2010 Cree, Inc. ll rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4600 Silicon Drive Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Durham, NC 27703 US Tel: +1.919.313.5300 www.cree.com/xlamp
Flux Characteristics (TJ = 25 C) The following table provides several base order codes for XLamp XM-L LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XM-L Binning and Labeling document. Color CCT Range Base Order Codes Min. Luminous Flux @ 700 m (lm) Order Code Min. Max. Group Flux (lm) Cool White 5,000 K 8,300 K Neutral White 3,700 K 5,000 K 80-CRI White 2,600 K 4,300 K Warm White 2,600 K 3,700 K T5 260 XMLWT-00-0000-0000T5051 T6 280 XMLWT-00-0000-0000T6051 T4 240 XMLWT-00-0000-000LT40E4 T5 260 XMLWT-00-0000-000LT50F4 T2 200 XMLWT-00-0000-000HT20E7 T3 220 XMLWT-00-0000-000HT30F7 T2 200 XMLWT-00-0000-000LT20E7 T3 220 XMLWT-00-0000-000LT30F7 Notes: Cree maintains a tolerance of ± 7% on flux and power measurements and ± 2 on CRI measurements. Typical CRI for Cool White (5,000 K 8,300 K CCT) is 65. Typical CRI for Neutral White (3,700 K 5,000 K CCT) is 75. Typical CRI for Warm White (2,600 K 3,700 K CCT) is 80. Minimum CRI for 80-CRI White is 80. Characteristics Characteristics Unit Minimum Typical Maximum Thermal Resistance, junction to solder point C/W 2.5 Viewing ngle (FWHM) degrees 125 Temperature coefficient of voltage mv/ C -3.0 ESD Classification (HBM per Mil-Std-883D) Class 2 DC Forward Current m 3000 Reverse Voltage V 5 Forward voltage (@ 700 m) V 2.9 3.5 Forward voltage (@ 1500 m) V 3.1 Forward voltage (@ 3000 m) V 3.35 LED Junction Temperature C 150 2
Relative Spectral Power Distribution Relative 100 Spectral Power Relative Radiant Power (%) 80 60 40 20 0 400 450 500 550 600 650 700 750-20 2600K -3700K CCT 3700K - 5000K CCT 5000K - 8300K CCT Wavelength (nm) Relative Flux vs. Junction Temperature (I F = 700 m) 100% 90% Relative Luminous Flux 80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) 3
Electrical Characteristics (T J = 25 C) Forward Current (m) 3000 2800 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 0 2.00 2.20 2.40 2.60 2.80 3.00 3.20 3.40 3.60 Forward Voltage (V) Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 3500 3000 Maximum Current (m) 2500 2000 1500 Design 1000 500 Rj-a = 4 C/W Rj-a = 7 C/W Rj-a = 10 C/W Rj-a = 15 C/W 0 0 20 40 60 80 100 120 140 mbient Temperature (ºC) 4
Relative Flux vs. Current (T J = 25 C) Relative Luminous Flux (%) 350% 325% 300% 275% 250% 225% 200% 175% 150% 125% 100% 75% Typical Spatial Radiation Pattern 50% 25% 0% 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 Forward Current (m) Relative Chromaticity vs. Current and Temperature (Cool White) Cool White 0.020 0.015 0.010 0.005 0.000-0.005-0.010-0.015-0.020 0 500 1000 1500 2000 2500 3000 Current (m) ΔCCx ΔCCy 5
Relative Chromaticity vs. Current and Temperature (Cool White) Cool White 0.020 0.015 0.010 0.005 0.000-0.005-0.010-0.015-0.020 25 50 75 100 125 150 ΔCCx ΔCCy Tsp ( C) Relative Chromaticity vs. Current and Temperature (Warm White) Warm White 0.020 0.015 0.010 0.005 0.000-0.005-0.010-0.015-0.020 0 500 1000 1500 2000 2500 3000 Current (m) ΔCCx ΔCCy 6
Relative Chromaticity vs. Current and Temperature (Warm White) Warm White 0.020 0.015 0.010 0.005 0.000-0.005-0.010-0.015-0.020 25 50 75 100 125 150 Tsp ( C) ΔCCx ΔCCy Typical Spatial Distribution 120 Relative Luminous Intensity (%) 100 80 60 40 20 0-100 -80-60 -40-20 0 20 40 60 80 100 ngle (º) 7
Reflow Soldering Characteristics In testing, Cree has found XLamp XM-L LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. s a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder verage Ramp-Up Rate (Ts max to Tp) 3 C/second max. 3 C/second max. Preheat: Temperature Min (Ts min ) 100 C 150 C Preheat: Temperature Max (Ts max ) 150 C 200 C Preheat: Time (ts min to ts max ) 60-120 seconds 60-180 seconds Time Maintained bove: Temperature (T L ) 183 C 217 C Time Maintained bove: Time (t L ) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 C 260 C Time Within 5 C of ctual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 C/second max. 6 C/second max Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Note: ll temperatures refer to the topside of the package, measured on the package body surface. 8
Notes Lumen Maintenance Projections Cree currently recommends a maximum drive current of 2000 m for XLamp XM-L white in designs seeking the ENERGY STR* 35,000 hour lifetime rating ( 94.1% luminous flux @ 6000 hours) or 25,000-hour lifetime rating ( 91.8% luminous flux @ 6000 hours). Please read the XLamp Long-Term Lumen Maintenance application note for more details on Cree s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. * These lifetime ratings are based on the current ENERGY STR Solid State Lighting Luminaires V1.1 (December 12, 2008) and ENERGY STR Integral LED Lamps V1.0 (December 3, 2009) lumen maintenance criteria. Moisture Sensitivity In testing, Cree has found XLamp XM-L LEDs to have unlimited floor life in conditions 30 ºC/85% relative humidity (RH). Moisture testing included a 168 hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDS to the resealable moisture-barrier bag and closing the bag immediately after use. Vision dvisory Claim WRNING: Do not look at exposed lamp in operation. Eye injury can result. See LED Eye Safety at www.cree.com/ products/pdf/xlamp_eyesafety.pdf. 9
Mechanical Dimensions ll measurements are ±.13 mm unless otherwise indicated. 3.8 5.00 3.02 0.73 0.5 0.5 2.8 5.00 4.8 Top View Side View Bottom View 0.5 4.8 3.8 0.6 4.7 3.9 0.5 4.8 0.4 4.7 0.4 0.5 2.782 0.4 0.4 Recommended PCB Solder Pad Recommended Stencil Pattern (Shaded rea Is Open) 10
6 NOTICE E CONFIDENTIL. THIS PLOT ND THE INFORMTION TINED WITHIN RE THE PROPRIETRY ND FIDENTIL INFORMTION OF CREE, INC. THIS PLOT NOT BE COPIED, REPRODUCED OR DISCLOSED TO NY UTHORIZED PERSON WITHOUT THE WRITTEN CONSENT REE INC. 2.00[.079] P2 4.00[.157] Po Tape and Reel 5 4 Do1.50 +.10 +.0039.0591 -.00 -.0000 [ ] ll Cree carrier tapes conform to EI-481D, 6 12.00[.472] utomated 5 Component 4 Handling Systems 3 Standard. 8.00[.315] P D 5.50[.217]F 1.75[.069] E1 NOTICE 2.00[.079] 2.00[.079] P2 P2 1.50[.059] D1 4.00[.157] 4.00[.157] Po Po 3 REV NOMINL CREE CONFIDENTIL. THIS PLOT ND THE INFORMTION CONTINED WITHIN RE THE PROPRIETRY ND CONFIDENTIL INFORMTION OF CREE, INC. THIS PLOT MY NOT BE COPIED, REPRODUCED OR DISCLOSED TO NY UNUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. 10.25 12.30 [.484] [.404] MX E2 W 2 DESCRIPTION REVISIONS POCKET SIZE o - 5.40mm [.213"] Bo - 5.40mm [.213"] Ko - 3.35mm [.132"] 3.0 5.40[.213] Bo BY 1 PP'D Do1.50 +.10 Do1.50 +.10 +.0039.0591 -.00 +.0039.0591 -.0000 [ ] -.00 -.0000 [ ].36[.014] T D C 1.75[.069] E1 1.75[.069] E1 REV xlamp xm-l leds 2 DESCRIPTION REVISIONS POCKET SIZE PP'D o - 5.40mm [.213"] ll dimensions in mm. Bo - 5.40mm [.213"] Ko - 3.35mm [.132"] BY 1 D 6 5 END 5.40[.213] o Trailer 160mm (min) of empty pockets sealed with tape (15 pockets min.) C 7.0 3.35[.132] Ko THIRD NGLE PROJECTION.X ±.06 DRWING.XX ±.03 B NO. 2402-00011 REV. SIZE.XXX ±.010 FINL PROTECTIVE FINISH X ±.5 63User Feed Direction SCLE DRWING SCLE 7.0 1 / SHEET OF SURFCE FINISH: 1 4 3 2 1 4 8 1.75 3.35 CTHODE SIDE STRT 3.35[.132] Ko NODE SIDE Loaded Pockets (1000 Lamps) 10.25 12.30 [.484] 10.25 12.30 [.484] [.404] MX [.404] MX E2 W E2 W CREE REFERENCE DRWING FOR TEK-PK DRWING 018275 UNLESS OTHERWISE SPECIFIED DIMENSIONS RE IN INCHES ND FTER FINISH. TOLERNCE UNLESS SPECIFIED:.XX ±.01.XXX ±.005 X ±.5 FOR SHEET METL PRTS ONLY DRWN BY D. CRONIN CHECK PPROVED MTERIL 6 5 4/23/10 5.40[.213] o 8.00[.315] 8.00[.315] TITLE P P THIRD NGLE PROJECTION Leader 400mm (min.) of empty pockets with at least 100mm sealed by tape (40 empty pockets min.) 4 5.50[.217]F 5.50[.217]F 4600 Silicon Drive Durham, N.C 27703 1.50[.059] D1 1.50[.059] D1 Phone (919) 313-5300 Fax (919) 313-5558 XM 5050 CRRIER TPE B 12 UNLESS OTHERWISE SPECIFIED DIMENSIONS RE IN INCHES ND FTER FINISH. TOLERNCE UNLESS SPECIFIED:.XX ±.01.XXX ±.005 X ±.5 FOR SHEET METL PRTS ONLY.X ±.06.XX ±.03.XXX ±.010 X ±.5 12.00[.472] NOMINL 12.00[.472] NOMINL CREE REFERENCE DRWING FOR TEK-PK DRWING 018275 DRWN BY D. CRONIN CHECK PPROVED MTERIL FINL PROTECTIVE FINISH 4/23/10 3.0 5.40[.213] Bo DRWING SCLE 1 / SURFCE FINISH: 63 1 3 2 1 TITLE SIZE SCLE.36[.014] T DRWING NO. 2402-00011 4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 Fax (919) 313-5558 XM 5050 CRRIER TPE SHEET OF REV. C B 12.4 +.2.0 MESURED T HUB 330 +.25 -.75 16.4 +0.2.0 MESURED T HUB 1.9±.4 21±.4 13.1 ±.2 12.4 +1.0 -.5 MESURED T EDGE 60 60 11
Packaging Vacuum-Sealed Moisture Vacuum-Sealed Barrier Bag Moisture Barrier Bag CREE Label Bin with CodeCree Bin & Code, Barcode Qty, Label Lot # Label with with Customer Cree Bin Code, P/N, Qty, Qty, Lot #, Lot PO ## Patent Label Label with Customer Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # 12