Features: 1. Emitted Color : and. Package Dimensions: 2. Lens Appearance : Water Clear 3. Bicolor type. 4. 1.6x1.25x.4mm(65) standard package.15 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase.2.35 reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn t contain restriction Substance, comply ROHS standard. Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±.1mm (.4 ) unless otherwise specified. 3.Specifications are subject to change without notice. 3. Status indicators : Comsumer & industrial electronics. 4. General use. Absolute Maximum Ratings(Ta=25 ) Parameter Symbol Unit Power Dissipation Pd 1 1 mw Forward Current I F 3 3 ma Peak Forward Current *1 I FP 1 1 ma Reverse Volage V R 5 V Operating Topr 25 ~8 Storage Tstg 3 ~85 Soldering Tsol See Page6 *1 Condition for IFp is pulse of 1/1 duty and.1msec width. Ver.1. Page 1 of 7
Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Color Min. Typ. Max. Unit Forward Voltage Vf I F =2mA Luminous Intensity Iv I F =2mA Reverse Current I R V R =5V Peak Wave Length λp I F =2mA Dominant Wave Length λd I F =2mA Spectral Line Halfwidth Δλ I F =2mA Veiwing Angle 2θ 1/2 I F =2mA Typical ElectroOptical Characteristics Curves 1.6 5.5 1.6 1.6 3. 1 2. 2. V mcd 1 µa 566 615 57 63 3 17 nm 576 625 nm nm 12 deg 1. Fig.1 Relative intensity vs. wavelength (G) (R) 6 Fig.2 Forward current derating curve vs. ambient temperature 5 Relative radiant intensity.5 Forward Current (ma) 4 3 2 1 2 4 6 8 1 47 57 Wavelength (nm) 67 77 Ambient temperature Ta( C) 5 Fig.3 Forward current vs. forward voltage (G,R) 3. Fig.4 Relative luminous intensity vs. ambient temperature 4 2.5 Forward current (ma) 3 2 1 Relative luminous intensity (Normalized @ 2mA) 2. 1.5 1..5 1 2 3 4 5 4 2 2 4 6 Forward voltage(v) Ambient A temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current Fig.6 Radiation diagram 2. (G) 1 2 Relative luminous intensity (@2mA) 1.5 1..5 5 1 2 3 (R) 4 5 Relative radlant intensity 1..9.8.7.5.3.1.4.2.6 3 4 5 6 7 8 9 Forward current (ma) Ver.1. Page 2 of 7
Tapping and packaging specifications(units: mm) USER DIRECTION OF FEED 1.4 ±.5 ±.5.5 13.±.5 CATHODE ANODE.5 5.3 ± START 4. 4. ±.1.1 1.5±.1 ±± 2.±.5 END.1 3.5.5 ± 1.75.3 8. ±.3.5 1.75± 71.± 1 FIXING TAPE TRAILER 13.±.5 179± 1 LEADER NOTE: 3 pcs PER REEL Package Method:(unit:mm) 1 bag/box 3 pcs/reel Bar Code Label 215 245 23 22 Aluminum Foil Bag 167 645 6 box/carton 23 334 Ver.1. Page 3 of 7
Bin Limits Intensity Bin Limits (At 2mA) (GE) BIN CODE Min. (mcd) Max. (mcd) E 1.4 2.8 F 2.1 4.2 G 3.2 6.3 H 4.8 9.4 Color Bin Limits (At 2mA) (GE) BIN CODE Min. (nm) Max. (nm) 4 565 569 5 567 571 6 569 573 7 571 575 8 573 577 Intensity Bin Limits (At 2mA) (JE) BIN CODE Min.(v) Max.(v) H 4.8 9.4 J 7. 14. K 11. 21. L 16. 32. BIN: x x x Intensity BIN CODE(JE) Color BIN CODE(GE) Intensity BIN CODE(GE) Ver.1. Page 4 of 7
Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MILSTD75:126 MILSTD883:15 Connect with a power If=2mA Ta=Under room temperature /2 JISC721 :B1 Test time=1,hrs High Ta=+65 ±5 MILSTD22:13B RH=9%95% High Humidity JISC721 :B11 Test time=24hrs /2 Storage Endurance Test Environmental Test High Storage Low Storage Cycling MILSTD883:18 JISC721 :B1 JISC721 :B12 MILSTD22:17D MILSTD75:151 MILSTD883:11 JISC721 :A4 Thermal Shock MILSTD22:17D MILSTD75:151 MILSTD883:111 Solder Resistance MILSTD22:21A MILSTD75:231 JISC721 :A1 High Ta=+85 ±5 Test time=1,hrs /2 Low Ta=35 ±5 Test time=1,hrs /2 35 ~ +25 ~ +85 ~ +25 6min 2min 6min 2min Test Time=5cycle 35 ±5 ~+85 ±5 2min 2min Test Time=1cycle Preheating: 14 16,within 2 minutes. Operation heating: 235 (Max.), within 1seconds. (Max.) /2 /2 /2 Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage V F ( V) I F =2mA Over Ux1.2 Reverse current I R (ua) V R =5V Over Ux2 Luminous intensity Iv ( mcd ) I F =2mA Below SX.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1. Page 5 of 7
Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 3 (572 ) and Soldering within 3 seconds per solderland is to be observed. 2. Reflow Soldering Preheating : 14 ~16 ±5,within 2 minutes. Operation heating : 235 (Max.) within 1 seconds.(max) Gradual Cooling (Avoid quenching). 1 SEC. MAX. 235 MAX. 14~16 4 /SEC. MAX. OVER 2 MIN. 4 /SEC. MAX. Time 3. DIP soldering (Wave Soldering) : Preheating : 12 ~15,within 12~18 sec. Operation heating : 245 ±5 within 5 sec.26 (Max) Gradual Cooling (Avoid quenching). Soldering heat Max. 26 12~15 Preheat 12~18 sec. 245 ±5 within 5 sec. Handling : Time Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1. Page 6 of 7
Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) : 5 3 (41 )Humidity : RH 6 % Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vaporphase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 3% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 6 ±3. Package and Label of Products: (1) Package: Products are packed in one bag of 3 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date Manufacture Location x xx xx xx Year Month Day Ver.1. Page 7 of 7