NPGN-150R. FEATURES Halogen, antimony, and red phosphorous free Flammability meets UL 94 V-0 NAN YA PLASTICS CORPORATION

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NAN YA PLASTICS CORPORATION Issured : 2010-09-01 flame retardant copper clad laminate Flammability meets UL 94 V-0 Excellent long term reliability UV blocking type NPGN-150R Reactive type flame retardants High Tg and lower C.T.E will provide excellent through-hole reliability Superior CAF-Resistance (Anti-migration) haracteristics Unit Conditioning Typical Values SPEC Test Method Volume resistivity MΩ-cm C-96/35/90 5 x10 8 ~ 5x10 9 10 6 2.5.17 Surface resistivity MΩ C-96/35/90 5 x10 6 ~ 5x10 7 10 4 2.5.17 Permittivity 1MHZ - C-24/23/50 4.6-4.8 5.4 2.5.5.9 Permittivity 1GHZ - C-24/23/50 4.1-4.3-2.5.5.9 Loss Tangent 1MHZ - D-24/23/50 0.013-0.015 0.035 2.5.5.9 Loss Tangent 1GHZ - D-24/23/50 0.011-0.013-2.5.5.9 Arc resistance SEC D-48/50+D-0.5/23 120 60 2.5.1 Dielectric breakdown KV D-48/50 60 40 2.5.6 Moisture absorption % D-24/23 0.05-0.10 0.35 2.6.2.1 Flammability - C-48/23/50 94V0 94V0 UL94 Peel strength 1 oz lb/in 288 x10 solder floating 8-10 6 2.4.8 Thermal stress SEC 288 solder dipping 300 10 2.4.13.1 Pressure cooker (2 atm 120 ) Flexural strength 1/2 hr SEC 288 dipping 300 N/A - 1 hr SEC 288 dipping 300 N/A - 2 hr SEC 288 dipping 300 N/A - LW N/mm 2 A 430-500 415 2.4.4 CW N/mm 2 A 350-420 345 2.4.4 Dimensional stability X-Y axis % E-0.5/170 0.005-0.030 0.050 2.4.39 Coefficient of thermal expansion X-Y axis Z-axis before Tg Z-axis after Tg 9-13 30-50 200-230 N/A 2.4.24 Glass transition temp DSC 150± 5 N/A 2.4.25 47 NOTE: The average value in the table refers to samples of.062 1/1. Test method per IPC-TM-650

Issured : 2010-09-01 NAN YA PLASTICS CORPORATION flame retardant copper clad laminate NPGN-150TL Flammability meets UL 94 V-0 Excellent long term reliability UV blocking type Reactive type flame retardants High Tg and lower C.T.E will provide excellent through-hole reliability Superior CAF-Resistance (Anti-migration) Characteristics Unit Conditioning Typical Values SPEC Test Method Volume resistivity MΩ-cm C-96/35/90 5.0 x10 9 10 6 2.5.17 Surface resistivity MΩ C-96/35/90 5.0 x10 7 10 4 2.5.17 Permittivity 1 MHZ - C-24/23/50 4.2-4.4 5.4 2.5.5.9 Permittivity 1 GHZ - C-24/23/50 3.8-4.0-2.5.5.9 Loss Tangent 1 MHZ - C-24/23/50 0.013-0.015 0.035 2.5.5.9 Loss Tangent 1 GHZ - C-24/23/50 0.011-0.013-2.5.5.9 Arc resistance SEC D-48/50+D-0.5/23 120 60 2.5.1 Dielectric breakdown KV D-48/50 60 40 2.5.6 Moisture absorption % D-24/23 0.20-0.30 0.35 2.6.2.1 Flammability - C-48/23/50 94V0 94V0 UL94 Peel strength 1 oz Ib/in 288 x10 solder floating 8-10 6 2.4.8 Thermal stress SEC 288 solder dipping 300 10 2.4.13.1 Glass transition temp DSC 150 ± 5 N/A 2.4.25 Dimensional stability X-Y axis % E 4/105 0.01-0.03 0.05 2.4.39 Coefficient of thermal expansion X-Y axis Z-axis before Tg Z-axis after Tg 9-13 30-50 200-230 N/A 2.4.24 NOTE: The average value in the table refers to samples of.020 1/1. Test method per IPC-TM-650 48

CONSTRUCTION: mm mil CONSTRUCTION 0.05 2 106 1 PLY 0.08 3 2112 1PLY 0.10 4 1080 2 plies 0.11 4 2116 1 ply 0.13 5 1080 2 plies 0.13sp 5 2116 1 ply 0.15 6 1506 1 ply 0.16 6 2112 2 plies 0.21 8 7628 1 ply 0.26 10 2116 2 plies 0.30 12 2116 3 plies 0.30sp 12 1506 2 plies mm mil CONSTRUCTION 0.35 14 7628 2 plies 0.38 15 7628 2 plies 0.45 18 7628x2+1080x1 0.50 20 7628 3 plies 0.53 21 7628 3 plies 0.60 24 7628 3 plies 0.77 31 7628 4 plies 0.8 32 7628 4 ples 0.9 36 7628 5 plies 1.0 39 7628 5 plies 1.1 43 7628 6 plies 1.2 47 7628 6 plies 1.2, 1.1, 1.0, 0.9 0.77 mm INCLUDE CLADDING, ALL OTHERS EXCLUDE CLADDING PRODUCT SIZE & INCH(mm) COPPER CLADDING OZ (μm) INCH SIZE mm TOLERANCE 0.004 (0.1) to 0.039 (1.0) H (17) 2.0 (70) 1.0 (35) 3.0 (105) 48.8 x 36.6 1240 x 0930 48.8 x 40.5 1240 x 1030 48.8 x 42.5 1240 x 1080 IPC-4101C SPEC CLASS C/M Keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards. Grain direction is shown on the Certificate of Conformance. 49

Issured : 2010-09-01 flame retardant prepreg NAN YA PLASTICS CORPORATION NPGN-150B PREPREG Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance. Higher Tg: 150±5 Other properties are similar to standard FR-4 Specification : IPC-4101C is applicable Glass style RC% RF% GT sec VC% After Pressed Thickness (per ply) (170 ) mm Mil 7628HR 50 ± 3 27 ± 5 0.193 ± 0.01 7.6 ± 0.4 7628MR 47 ± 3 22 ± 5 0.183 ± 0.01 7.2 ± 0.4 7628 43 ± 3 17 ± 5 0.173 ± 0.01 6.8 ± 0.4 1506MR 52 ± 3 30 ± 5 0.157 ± 0.01 6.2 ± 0.4 1506 48 ± 3 23 ± 5 0.145 ± 0.01 5.7 ± 0.4 2116HR 58 ± 3 38 ± 5 0.120 ± 0.01 4.7 ± 0.4 2116MR 54 ± 3 30 ± 5 0.109 ± 0.01 4.3 ± 0.4 2116 50 ± 3 25 ± 5 0.097 ± 0.01 3.8 ± 0.4 2113 56 ± 3 35 ± 5 160 ± 20 1.5 0.081 ± 0.01 3.2 ± 0.4 2112 60 ± 3 35 ± 5 0.069 ± 0.008 2.7 ± 0.3 1080HR 68 ± 3 44 ± 5 0.064 ± 0.008 2.5 ± 0.3 1080MR 65 ± 3 40 ± 5 0.061 ± 0.008 2.4 ± 0.3 1080 62 ± 3 35 ± 5 0.058 ± 0.008 2.3 ± 0.3 106 68 ± 3 33 ± 5 0.046 ± 0.008 1.8 ± 0.3 * 1086 62 ± 3 35 ± 5 0.066 ± 0.008 2.6 ± 0.3 * 1067 68 ± 3 34 ± 5 0.049 ± 0.008 1.9 ± 0.3 * 1078 62 ± 3 35 ± 5 0.058 ± 0.008 2.3 ± 0.3 *Laser drillable prepreg Storage Stability Storage Condition : 20 50% RH for 3 months : Max 5 for 6 months 50

Recommended press cycles: Suggestions: 1. Heating rate of material between 70 (158 ) and 140 (284 ). 1-3 /min (1.8~5.4 /min) is acceptable. 1.5-2.5 /min (2.7~4.5 /min) would be better. 2. Temperature of material over 170 (338 ) must be held for at least 60 min to allow resin to fully cure. 3.The pressure should be kept below 100psi during cooling to ambient temperature. 4. Cooling rate of material should be kept under 2.5 /min (4.5 /min) when the temperature of material is over 100 (212 ), in order to avoid introducing twist. CERTIFICATION UL UL File No.:E98983 ANSI TYPE: FR-4 UL 746 Recognition Minimum Clad cond. Max. Material Thickness Area Thickness min. max. Diameter Max. Sold Lts UL 94 Inch mils mils inch Operating Temp Time Flame (mm) (mic) (mic) (mm) Temp sec class 0.002 (0.051) 0.67 4.02 (17) (102) 2.0 (50.8) 130 288 30 94V-0 51