A Guide to Reticle Design on the Autostep 200 Edward Tang 6/4/04

Similar documents
Title: ASML PAS 5500 Job Creation Semiconductor & Microsystems Fabrication Laboratory Revision: D Rev Date: 09/20/2012

Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010

Visual Test Light Scattering Reticle. Users Guide

GCA AS200 Job Preparation

Microsystems Technology Laboratories i-stepperthursday, October 27, 2005 / site map / contact

R I T. Title: GCA Stepper Operations. Semiconductor & Microsystems Fabrication Laboratory Revision: F Rev Date: 08/09/ SCOPE

STANDARD: SPECIFICATION FOR PROTECTIVE ENCLOSURE AND CARRIER SYSTEMS USED TO TRANSPORT AND STORE ( INCH EUV RETICLES

Effects of Chrome Pattern Characteristics on Image Placement due to the Thermomechanical Distortion of Optical Reticles During Exposure

Photomasks. Photolithography Evolution 9/11/2004 ECE580- MPE/MASKS/PHOTOMASKS.PPT

Registration Error Terms: Grid: Wafer Terms and Field IFD

Strain Measurement Techniques for Composite Coupon Testing

Sample Alignment (2D detector) Part

Coordinate Measuring Machines Coordinate INDEX Measuring Machines Coordinate Measuring Machines New Products

Chapter 3 : ULSI Manufacturing Technology - (c) Photolithography

Carlson CR Robotic/Reflectorless Total Station

PROCESS CONTROL BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS

RS 1700/1900/2300/2900 High Density Reticle Stockers

Figure 1 below shows the generic process flow of an LELE method of double patterning.

Chromeless Phase Lithography (CPL)

DISCONTINUED PRECISION MEASURING FOWLER CALIPERS 1 - VERNIER CALIPERS 4 - ELECTRONIC CALIPERS

Our Drop Counter sensor now features housing for two electrode sensors, an anti-twist mechanism, an indicator LED and two cable guides.

0. Table of contents. Author: Jaap Snijder

DLP Technology-Driven, Optical Neural Network Results and Future Design. Emmett Redd Professor Missouri State University

RS-C Flexible Reticle Stocker

custom reticle solutions

Sample Alignment Part

HFM 100 Series. Thermal Conductivity Meter for measurement of insulation and construction materials.

Characterization of Optical Proximity Correction Features

High Optical Density Photomasks For Large Exposure Applications

C4 PLUS RIFLESCOPES User Guide

Wenzhou Tripod Instrument Manufacturing Co., Ltd.

Solder Self-assembly for MEMS

Impact of Pellicle on Overlay in Double Patterning Lithography

CUSTOM RETICLE SOLUTIONS

St art. rp m. Km /h 1: : : : : : : : : : : : :5 2.5.

CAL GAUSS CALIBRATION MAGNET

ic-wg BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION

Practical Considerations and Solutions for Temperature-Dependent S-Parameter Measurement for Accurate Parameter Extraction of

IS181 DESCRIPTION FEATURES

Improved Method for Measuring and Assessing Reticle Pinhole Defects for the 100nm Lithography Node

The Waferstepper Challenge: Innovation and Reliability despite Complexity

Carrier Transport by Diffusion

NIST DTSA-II ( Son of DTSA ): Step-by-Step

CBRD30CP3 & BOWRD30CP INSTRUCTION MANUAL

Applications of Non-Contact Magnetising on Ring Shaped Components

Colour Images from Compound Semiconductor Radiation Detectors Chapter 3. Alan Owens

WE RE HERE TO HELP: 1 (844) LIGHTCLOUD

ic-wg BLCC WGC PACKAGE SPECIFICATION

Quick Start Guide. The ieq45 GoTo German Equatorial Mount # 8000C

1


Fiducial Marks for EUV mask blanks. Jan-Peter Urbach, James Folta, Cindy Larson, P.A. Kearney, and Thomas White

Atom Structure Teacher s Guide

Modular Microscope Accessory

EM-30AX is very good space utilization

Portable type TXRF analyzer: Ourstex 200TX

Experimental Design and Data Collection

Fine Alignment of the ATF Damping Ring

Solving Linear Equations (in one variable)

ENERGY DISTRIBUTION ANALYSIS IN A LOW HEAD FRANCIS TURBINE DURING THERMODYNAMIC EFFICIENCY MEASUREMENTS

Introduction to Fourier Transform Infrared Spectroscopy

Algorithm User Guide:

LIBSlab ANALYZERS ANALYZERS

Reliable Test Results

x Builders Level Service Manual

Coordinate Measurement Machine

National Optical & Scientific Instrument Inc Tri-County Parkway Schertz, Texas Phone (210) Fax (210)

MEMS Metrology. Prof. Tianhong Cui ME 8254

DATA SHEET. Thermocouple module with digital I²C-Interface - THMOD-I²C. Characteristic features. Areas of application. Features.

ONYX -MCE MULTI-CHANNEL OPTICAL FIBER PYROMETERS WITH ACTIVE EMISSIVITY COMPENSATION PRECISION TEMPERATURE MEASUREMENT FOR DEMANDING INDUSTRIAL

MEMORANDUM. Focal-Point: Point on the focal plane where the sharpest PSF is located.

Modular Microscope Solutions and Components Modular Microscope Solutions and Components Modular Microscope Solutions and Components Modular

Geography 281 Map Making with GIS Project Four: Comparing Classification Methods

ic-wg BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION

EUVL Readiness for High Volume Manufacturing

The scanning microbeam PIXE analysis facility at NIRS

MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary

Practical 1P4 Energy Levels and Band Gaps

Application of Micro-Flow Imaging (MFI TM ) to The Analysis of Particles in Parenteral Fluids. October 2006 Ottawa, Canada

Practical 1P4 Energy Levels and Band Gaps

Design Considerations for a Variable Angle Absolute Reflectance Accessory For the LAMBDA 950/850/650 UV/Vis/NIR and UV/Vis Spectrophotometers

Lecture 16 Instrumentation for ICP AES-VIII-Instruments

A Reticle Correction Technique to Minimize Lens Distortion Effects

Illuminated Reticle Technologies for Rifle Scopes. Illuminated Reticle Technologies for Riflescopes

Defining quality standards for the analysis of solid samples

Introduction to Uncertainty and Treatment of Data

DIGITAL ABBE REFRACTOMETER INE-WYA-2S OPERATING INSTRUCTION PLEASE READ THIS MANUAL CAREFULLY BEFORE OPERATION

Single Pass Die to Database Tritone Reticle Inspection Capability

Optimized Stepping for Fan-out Wafer and Panel Packaging P.10

EA-10/13. EA Guidelines on the Calibration of Temperature Block Calibrators. Publication Reference PURPOSE

(12) United States Patent (10) Patent No.: US 6,882,745 B2

Thermo Scientific ELEMENT GD PLUS Glow Discharge Mass Spectrometer. Defining quality standards for the analysis of solid samples

Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given

Your partner in Science!

IDENTIFICATION STS400

Lead time reduction by optimal test sequencing

RGS08 Linear Rails: RGS08 Non-Motorized With and Without Guide Screw. RGS08 Non-Motorized Linear Rails

MEMORANDUM. Focal-Point: Point on the focal plane where the sharpest PSF is located.

3-D MEASUREMENT OF THE NSCL POSITION-SENSITIVE GAMMA RAY DETECTOR ARRAY

EE 434 Lecture 7. Process Technology

Transcription:

A Guide to Reticle Design on the Autostep 200 Edward Tang 6/4/04 1

Table of Contents Introduction Section 1 Reticle Management System (RMS): Introduction Section 2- Global Alignment System Global Scan Reference Scan Fine Scan Section 3 Local Alignment Systems Section 4 Alignment Target CAD Layout Introduction Constant Reticle Perimeter Data RMS Reticle Alignment Windows INSITU Reticle Alignment Target Placement Specification Alignment Target Placement Strategy Global Alignment Alignment Target Spacing 2

Introduction: This guide will introduce reticle design concepts for use on the AS200 stepper, and will explain the basic concepts of reticle management and global alignment. The information required for CAD layout will be discussed and provided later. Section 1 Reticle Management System (RMS): Introduction The AS200 uses RMS alignment windows to align the reticle to the platen chuck and to the X and Y-axis stages of the wafer stepper system. The alignment windows are typically located in the center of the reticle, or offset 11mm from the center position to eliminate possible pattern generation interference, as shown below. Figure 2.1 - Typical Alignment Window Locations The standard reticle phase and alignment window is negative. A negative phase indicates that the alignment window is a clear opening in the chrome background of the reticle as shown below. Positive phase reticles exist, but are not commonly used. The RMS is capable of using either positive or negative phase reticles. The position of the alignment window corresponds to RMS aligner detectors. The detector observes the position of the window with respect to the aligner fiducial. 3

Section 2 Global Alignment System Global alignment is an important first step in aligning the entire wafer to the wafer stepper system. This alignment can be performed by 1 of 2 methods, by the operator manually or automatically by the Automatic Wafer Aligner/Digital (AWA/D). The AWA/D performs automatic global alignment in a more consistent, fast, and reliable method than the typical operator. Global Scan A global scan of the AWA/D is used to determine the general location of the wafer alignment mark by scanning the whole digitized video image. The wafer mark is shown below. Figure 3.2 Typical Wafer Alignment Mark 4

Reference Scan A reference scan of the AWA/D is used to determine the precise location of the center of the wafer alignment microscope reference mark within the digitized video image. The wafer alignment microscope reference marks are located on a reticle within the wafer alignment microscope as shown below. Figure 3.3 Wafer Alignment Microscope Reference Mark 5

Fine Scan A fine scan of the AWA/D is used to determine the precise location of the wafer alignment mark and the wafer alignment microscope reference mark by scanning the video image within two regions about the center of the alignment area. The wafer alignment microscope reference mark and the wafer alignment mark should be aligned well to each other after a successful fine scan as shown below. Figure 3.4 Wafer Alignment Mark and Wafer Alignment Microscope Reference Mark Aligned after Fine Scan. 6

Section 3 Local Alignment Systems This section will be available in the future. 7

Section 4 Alignment Target CAD Layout Introduction This section will provide the necessary information needed to create a reticle set. It will include specification and placement requirements for RMS alignment windows, global alignment targets, local alignment targets (future), and INSITU alignment targets. Constant Reticle Perimeter Data The constant reticle perimeter data will be consistent for all reticle sets generated for a specific configuration. The periphery data includes: RMS alignment windows, DFAS reticle windows, and INSITU alignment targets as shown below. Figure 5.2 - Constant Reticle Perimeter Data 8

RMS Reticle Alignment Windows The reticle alignment windows are used to align the reticle to the platen chuck of the wafer stepper system. The window phase is typically negative, which consists of a square hole in the chrome. The reticle aligner assemblies in the platen casting observe the edge of the reticle alignment window in the chrome. When there is a balance of illumination in the fiducial between window and chrome at the top and bottom of the reticle, the reticle is considered to be aligned as shown below. Figure 5.3 Alignment of a Negative Phase Reticle 9

The offset alignment window option is offered to eliminate interference problems in the manufacture of reticles. One of the fiducials is offset from center by 11mm, removing possible pattern generation interferences. The location and dimensions for RMS alignment marks should comply with the figure below. Figure 5.4 Standard Reticle Artwork Location and Dimensions. 10

INSITU Reticle Alignment Target Placement Specification To ensure optimum overlay, it is important that the alignment of the product reticle in relation to the previous alignment of the calibration reticle be determined accurately. In order to achieve this, upon completion of the reticle loading and the alignment by the RMS, the alignment strategy uses INSITU to accurately determine the product reticle position by aligning to the INSITU reticle windows located at fixed positions on the product reticle. The location and dimensions of the INSITU reticle windows should comply with the figures below. Figure 5.11 DFAS Reticle Alignment Window 11

Figure 5.12 INSITU Reticle Window Locations 12

Alignment Target Placement Strategy There are two alignment techniques which are available on the wafer stepper system, they are: Global, which is performed manually or automatically by the AWA/D, and local (will be discussed in the future) which is performed by the Micro DFAS. The alignment marks are to be placed above your device area in a 200 micron scribe street. The 1 st mark will be placed at the upper right, and the 2 nd mark will be placed at a determined offset left of the 1 st mark. Global Alignment By aligning 2 global alignment marks on either side of the wafer for X, Y and theta, total overlay may be achieved for less critical alignments as shown in the figure below: Figure 5.13 X, Y-axis and Theta Wafer Alignment Target Locations 13

The global alignment target is used to align the entire wafer during the global alignment process. The marks located at 45 and 135 degree are used for the automatic global alignment performed by the AWA/D while the 90 and 180 degree marks are typically used during manual operator alignment. The global alignment target shown below is a typical target used for either manual or automatic wafer global alignment. Figure 5.20 Typical Wafer Alignment Target for Operator or AWA/D 14

Figure 5.29 Global Alignment Target The design of the wafer alignment target is critical to optimize the use of the target as shown in the figure above. The following includes guidelines that should be followed when designing wafer alignment marks: Line width of target should be 1.0 to 2.4 microns (1.6 is standard) Maintain a minimum separation of 25 microns in the X-axis and 12 microns in the Y-axis between the ends of the target lines and any other geometry. The AWA/D aligns better to solid targets rather than hollow targets. Positive and negative phase targets may be used however, depending on the process level, the target that provides the best optical contrast is preferred. 15

Alignment Target Spacing The spacing of the alignment target in the wafer alignment microscope is fixed at 76.2mm. If you only use one alignment target on your level for stepping, it would not generate the necessary 2 alignment keys at 76.2mm apart. For example, if your step size was 11mm, as shown below, the alignment targets would fall at 0, 11, 22,, 66, 77mm, none of them would fall at 76.2mm. Figure 5.21 Alignment Target Spacing Example At first it would appear that the only way to get your alignment target to fall at 76.2mm is to step only in stepping distances that can evenly be divided into 76.2mm, which is unacceptable. The solution is to add a 2 nd alignment target in your design slightly offset from the 1 st alignment so that the 2 nd target will fall 76.2mm from your first target. For example, if in the case above we add a 2 nd alignment target at 0.8mm left of the first, there is an alignment target located exactly 76.2mm apart. 16

Figure 5.22 2 nd Alignment Target Example The procedure can be generalized in a few simple equations. To determine the correct offset for the 2 nd alignment target from the 1 st target, use these equations: Formula 1: [76.2mm / Step Distance (mm)] = X X has a whole integer, and a decimal remainder. Formula 2: Step distance (Remainder x Step Distance) = the 2 nd alignment target offset to the left of the 1 st alignment target The following is an example of a Global Alignment Target Cell with all levels, and a break down of each level. Please note: If your step size divides almost evenly into 76.2mm, you will have limited space to place alignment targets. If this is the case, you may choose to adjust your step size so that it does divide exactly into 76.2mm evenly. 17

Figure 5.32 Global Alignment Target Cell Example with Breakdown Descriptions 18