ECE Semiconductor Device and Material Characterization

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ECE 4813 Semiconductor Device and Material Characterization Dr. Alan Doolittle School of Electrical and Computer Engineering Georgia Institute of Technology As with all of these lecture slides, I am indebted to Dr. Dieter Schroder from Arizona State University for his generous contributions and freely given resources. Most of (>80%) the figures/slides in this lecture came from Dieter. Some of these figures are copyrighted and can be found within the class text, Semiconductor Device and Materials Characterization. Every serious microelectronics student should have a copy of this book!

Welcome Welcome to ECE4813 Semiconductor Device and Material Characterization. This is a most useful course if You are working with semiconductor materials or devices You are involved with measurements You are looking for a job (answer interview questions) It will give you a good overview of most of the characterization techniques in the semiconductor industry Electrical measurements Optical measurements Electron and ion beam measurements X-ray and probe measurements The prerequisite for this course is a previous course in semiconductor device physics, e.g., ECE3040, 3080, or 4751 You should be familiar with the basic semiconductor devices: pn junctions, metal-semiconductor devices, and MOS devices

Learning Objectives The objective of this course is an understanding of most of the characterization techniques used in the semiconductor industry The major emphasis will be on electrical characterization, since these characterization techniques are most frequently used However, optical techniques, as well as electron beam, ion beam, and X-ray methods will also be discussed. Where necessary, device physics will be outlined to understand certain techniques

Your Responsibility It is your responsibility to master the material I will assign homework so that you have to apply the course material and reinforce learning The textbook is one of the best reference books available, Dr. Dieter Schroder s text Semiconductor Device and Materials Characterization. Every Serious Microelectronics Person should keep a copy of this book. An excellent complement to this book is: W.R. Runyan and T.J. Shaffner, Semiconductor Measurements and Instrumentation, McGraw-Hill, 1998. Occasionally I will provide a paper to read

References D.K. Schroder, Semiconductor Material and Device Characterization, 3 rd ed., Wiley Interscience, 2006. W.R. Runyan and T.J. Shaffner, Semiconductor Measurements and Instrumentation, McGraw-Hill, 1998. T.J. Shaffner, Semiconductor Characterization and Analytical Technology, Proc. IEEE, 88, 1416-1437, Sept. 2000. C.R. Brundle, C.A. Evans, Jr. and S. Wilson, Eds., Encyclopedia of Materials Characterization, John Wiley & Sons, 1992. R.E. Whan, K. Mills, J.R. Davis, J.D. Destefani, D.A. Dieterich, G.M. Crankovic, H.J. Frissell, D.M. Jenkins, W.H. Cubberly, R.L. Stedfeld, eds. Materials Handbook Ninth Edition: Vol. 10 Materials Characterization, American Society for Metals, 1986. A.C. Diebold, ed., Handbook of Silicon Semiconductor Metrology, Marcel Dekker, New York, 2001. S. Cristoloveanu and S. S. Li, Electrical Characterization of Silicon-on- Insulator Materials and Devices, Kluwer Academic, Boston, 1995.

Course Outline Electrical Characterization 0. Basic Electrical Measurement Theory, Probe and Instrumentation 1. Resistivity 2. Carrier/Doping Densities 3. Contact Resistance 4. Series Resistance 5. Schottky Barriers 6. MOSFET Channel Length 7. Threshold Voltage 8. Defects, Impurities 9. MOS Capacitors 10. Oxide Charges 11. Interface States 12. Carrier Lifetime 13. Mobility 14. Charge-based Measurements 15. Probe Microscopy 16. Reliability 17. Failure Analysis

Course Outline Optical Characterization 1. Optical Microscopy 2. Ellipsometry 3. Transmission, Reflection 4. Photoluminescence 5. Emission Microscopy

Course Outline Physical/Chemical Characterization 1. Scanning Electron Microscopy 2. Auger Electron Spectroscopy 3. Transmission Electron Microscopy 4. Voltage Contrast 5. Secondary Ion Mass Spectrometry 6. Rutherford Backscattering 7. X-Ray Fluorescence 8. X-Ray Photoelectron Spectroscopy

Approximate Course Schedule Week 1 Introduction, Resistivity Week 2 Sheet Resistance Week 3 Doping Profiling Week 4 Series, Contact Resistance Week 5 Diodes Week 6 Threshold Voltage Channel Length Week 7 Defects Week 8 MOS Charges Week 9 Recombination Mobility Week 10 Charge-based Probes Week 11 Optical Electron Beam Week 12 Ion Beam X-Rays Week 13 Reliability (time permitting or presentations) Week 14 Failure Analysis (time permitting or presentations)

Material/Device Parameters Contact/Series Resistance Gate Length/Width Threshold Voltage S G Oxide Thickness Oxide Charges L D Junction Depth Doping Profile Resistivity Impurities Defects p-type n + n + Mobility Generation/ Recombination Lifetime IBM's POWER 6 7.9x10 8 transistors 4.7 GHz, 2007