TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LHRF3333-PF/TBS-X DATA SHEET DOC. NO : REV. : QW95- LHRF3333-PF/TBS-X B DATE : 6- Jun. - 28
Page 1/6 Package Dimensions P2 ΔH H2 H1 W2 L W W1 W3 D P1 F - + P T LHRF3333-PF 5. 5.9 7.6 8.6 1.5MAX.5 TYP 25.MIN 2.54TYP + - MIN Note : 1.All dimension are in millimeter tolerance is ±.25 unless otherwise noted. 2.Specifications are subject to change without notice.
Page 2/6 Absolute Maximum Ratings at Ta=25 Parameter Symbol Ratings HRF UNIT Forward Current IF 3 ma Peak Forward Current Duty 1/1@1KHz IFP 9 ma Power Dissipation PD 75 mw Reverse Current @5V Ir 1 μa Electrostatic Discharge( * ) ESD 2 V Operating Temperature Topr -4 ~ +85 * Storage Temperature Tstg -4 ~ +1 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recoended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL COLOR Dominant wave length λdnm Spectral halfwidth λnm Forward voltage @2mA(V) Luminous intensity @2mA(mcd) Viewing angle 2θ 1/2 (deg) Emitted Lens Min. Max. Min. Typ. LHRF3333-PF/TBS-X AlGaInP Red Water Clear 63 2 1.5 2.4 22 5 2 Note : 1.The forward voltage data did not including ±.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Dimension Symbol Information Page 3/6 SYMBOL ITEMS Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width REMARK:TBS=Tape And Box Straight Leads Dimensions Symbol Information Description Symbol minimum OPTION CODE SYMBOL D H 3.8 17.5 21.5 22.5 19.9 Minimum.15 F 2.3.9 TBS-1 TBS-2 TBS-3 TBS-5 TBS-6.69.85 25.5 SPECIFICATIONS.89.78 Maximum 4.2 2. 18.5 22.5 26.5 23.5 2.9.17 3..12.8.73.89 4.93.82 TBS-7 24..94 25..98 H1 TBS-8 24.5.96 25.5 TBS-9 TBS-1 TBS-11 TBS-12 TBS-13 Specification H2 L 19. 18.4 2 18. W.75.72.83 2.5.81 4.4 5.1.71 P 12.4.49 maxmum P1 P2 T W W1 W2 W3 8.5 14.5 17.5.17.2.33.57.69 Package Dimensions 2. 19.4 22. 21.5 19. 36 11 5.8 7.7 1.42 9.75 15.5 4. 19.79.76.87.85.75 1.42.43 13.51.23.3.6.38.61.16.75 Overall Length L 33 13. 34 13.4 Overall Width W 265 1.4 275 1.8 Overall Thickness H 5 1.97 6 2.4 Quantity/Box 2PCS
Page4/6 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1 3.5 Forward Current(mA) 1 1.1 1.5 Relative Intensity Normalize @2mA 2. 2.5 3. 1 3. 2.5 2. 1.5.5 1 1 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3. Forward Voltage@2mA Normalize @25 1.1.9.8-4 -2-2 4 6 8 1 Relative Intensity@2mA Normalize@25 2.5 2. 1.5.5-4 -2-2 4 6 8 1 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@2mA.5 55 6 65 7-6 1% -3 75% 5% 25% 3 6 25% 5% 75% 1% Wavelength (nm)
Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:3W Max Temperature 35 C Max Soldering Time:3 Seconds Max(One time only) Distance:2 Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 12 C Max Preheat time: 6seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:26 C Max Dipping Time:3 seconds Max Distance:2 Min(From solder joint to body) Temp( C) 26 26 C3sec Max 5 /sec max 12 2 /sec 25 max 5 Preheat 6 Seconds Max 1 15 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=2mA 3.t=1 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-75: 126 MIL-STD-883: 15 JIS C 721: B-1 High Temperature Storage Test 1.Ta=15 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:18 JIS C 721: B-1 Low Temperature Storage Test 1.Ta=-4 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 721: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=9%~95% 3.t=24hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-22:13B JIS C 721: B-11 Thermal Shock Test 1.Ta=15 ±5 &-4 ±5 (1min) (1min) 2.total 1 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-22: 17D MIL-STD-75: 151 MIL-STD-883: 111 Solder Resistance Test 1.T.Sol=26 ±5 2.Dwell time= 1 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-22: 21A MIL-STD-75: 231 JIS C 721: A-1 Solderability Test 1.T.Sol=23 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-22: 28D MIL-STD-75: 226 MIL-STD-883: 23 JIS C 721: A-2