Research Article Electromechanical Impedance Analysis on Piezoelectric Smart Beam with a Crack Based on Spectral Element Method

Mathematical Problems in Engineering Volume 15 Article ID 71351 13 pages http://dx.doi.org/1.1155/15/71351 Research Article Electromechanical Impedance Analysis on Piezoelectric Smart Beam with a Crack Based on Spectral Element Method Dansheng Wang Hongyuan Song and Hongping Zhu School of Civil Engineering and Mechanics Huazhong University of Science and Technology Wuhan 4374 China Correspondence should be addressed to Dansheng Wang; danshwang@hust.edu.cn Received 11 April 14; Revised 6 July 14; Accepted 16 July 14 Academic Editor: Kui Fu Chen Copyright 15 Dansheng Wang et al. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use distribution and reproduction in any medium provided the original work is properly cited. An electromechanical impedance (EMI) analysis of a piezoelectric smart beam with a crack is implemented in this paper. Spectral element method (SEM) is used to analyze the EMI response of the piezoelectric smart beam. In this analysis the spectral element stiffness matrices of different beam segments are derived in this paper. The crack is simulated using spring models and the EMI signatures of piezoelectric smart beam with and without crack are calculated using SEM respectively. From the analysis results it is found that the peak position and amplitude of the EMI signatures have significant changes with the change in crack depth especially in higher frequency ranges. Different vibration modes of the piezoelectric smart beam are analyzed and the effect of thickness of the adhesive layer on the admittance is also researched. An experimental study is also implemented to verify the validity of the analysis results using SEM. 1. Introduction The presence of structural damage will result in the changes in the properties of the structure and will also induce the change in the mechanical impedance of the structure. Damage identification can be achieved by comparing the structural mechanical impedances before and after damage. However structural mechanical impedance is difficult to measure in practice. The coupled electromechanical impedance (EMI) of structure with patches bonded to it is convenient to obtain by using impedance analyzer even in the high frequency ranges which is quite sensitive to structural incipient damage. In recent years the EMI-based technique has been applied to structural health monitoring. It has been successfully used to analyze various engineering structures including aerospace structures mechanical structures and civil structures [1 11]. The EMI technique is based on the direct and converse piezoelectric effects of the patch. In order to analyze the EMI of coupled structures the model characterizing electromechanical interaction between thehoststructureandpatchshouldbefirstlyestablished. Liang et al. [1] proposed the first EMI model for a patch bonded onto an intact one-dimensional structure. Zhou et al. [13] extended the impedance method to model a twodimensional EMI structure. Bhalla and Soh also presented an improved D impedance model to characterize the structure electroelastic interactions based on the concept of effective impedance [14]. Annamdas and Soh have examined the three-dimensional interaction of a transducer or multiple transducers with the host structure based on directional sum impedance formulation [15 16]. Wang et al. also proposed an embedded 3D electromechanical impedance model for an embedded transducer by considering the interaction between a square patch and ahoststructure[17]. Spectral element method (SEM) has been proposed to the structural dynamics community as a numerical tool to analyze the dynamic responses of rods beam and plates [18]. Spectral element is represented by an exponential interpolation function which is an exact solution of the wave equation for representative structural element. Therefore other than classical finite element method SEM provides dynamic stiffness matrix of a structure which is more accurate and efficient than the traditional static stiffness matrix

Mathematical Problems in Engineering and allows an increased accuracy in modeling the structural dynamic behavior. Subsequently Palacz and Krawczuk [19] analyzed the dynamic responses of a cracked rod using SEM. The crack is simulated by a rotational spring model and the node displacement and shape function of the cracked rod are derived. Ostachowicz et al. further summarized the researches on spectral element method and derived the spectral element stiffness matrices of Euler beam Timoshenko beam damaged plate and thin-walled shell structures [ 3]. Samaratunga et al. presented a new D wavelet spectral finite element model for studying wave propagation in thin to moderately thick anisotropic composite laminates [4]. Choi and Inman recently presented modeling of a cableharnessed structure by means of SEM and a double beam model was formulated. The presented modeling was applied and compared with the conventional FEM to emulate a cableharnessed structure [5]. Some researchers also focused on identifying the damage from the EMI signatures of the cracked beam with surfacebonded patches using SEM. Park et al. implemented damage identification study on a simple one-dimensional structure by combining SEM and EMI techniques [6 7]. Ritdumrongkul et al. succeeded in quantitative identification of the structure damage based on the SEM and active sensors. In the experiment a bolted aluminum beam is studiedandthedamageissimulatedbyloosenessofthe bolt [8]. Wang and Tang further deduced the stiffness matrix of smart Timoshenko beam and successfully analyzed electric admittances of piezoelectric smart beam using the SEM [9]. Combined with EMI method and nonlinear optimization technique the spectral element model of a simply supported rod was simulated and numerical study on localization and quantitative identification of damage was made by Guo and Sun[3]. Ostachowicz et al. developed their own numerical procedures using SEM in order to calculate damage indexes which were used both for damage detection and for localization. The proposed methods were applied for structural health monitoring of metallic and fibre reinforced structural elements [31]. Kim and Wang proposed an improved impedance-based damage identification method by incorporating a tunable piezoelectric circuitry with the structure to enrich the impedance measurements. Numerical case study on localizing damage in a fixed-fixed beam using SEM was performed to demonstrate the effectiveness of the new method for structural damage identification [3]. In this paper a new spectral element model of a cracked Timoshenko beam is proposed. In the model the crack is modeled accurately by three massless springs that is a shear spring a translational spring and a rotational spring. According to the relationship between dynamic load and displacement the spectral element stiffness matrices of different beam segments are obtained and then the EMI of the piezoelectric coupled beam with a crack is formulized. Subsequently the proposed spectral element model is validated by experimental results. Finally numerical investigations are addressed to analyze the EMI responses of the piezoelectric Timoshenko beam with a crack based on the spectral element model.. Spectral Element Formulations.1. Spectral Element Stiffness Matrix of an Intact Timoshenko Beam. The governing differential equations for a Timoshenko beam are given as κga ( w x φ x )=ρa w t (1) EI φ x +κga( w x φ) =ρi φ t () E u x ρ u t = (3) Q=κGA( w x φ) N=EA u x M=EI φ x where u w and φ are the axial rotational and shear displacements respectively. N Q and M denote the axial force transverse force and bending moment respectively. E is Young s modulus; μ is Poisson s ratio κ = (.87 + 1.1μ) /(1+μ) is the shear correction factor and G = E/(+ μ) is the shear modulus. A ρ and I are the cross-sectional area density and inertia moment of the beam respectively. By solving (1) (4) the spectral solutions of the Timoshenko beam can be expressed as u (x ω) =A 1 e ik 3x +A e k 3(L b x) w (x ω) =A 3 e ik 1x +A 4 e k 1(L b x) +A 5 e ik x +A 6 e k (L b x) φ (x ω) =α 1 A 3 e ik 1x α 1 A 4 e k 1(L b x) +α A 5 e ik x α A 6 e k (L b x) where the length of the beam is L b A i (i = 1...6) is the spectral amplitude ω is the frequency α j = (k j κg ρω )/(ik j κg) j=1andk 1 k andk 3 arewavenumbersof bending mode and stretching mode respectively which can be expressed as (4) (5) k 1 = 1 x 1 ± x1 4x k 3 =ω ρ E (6) where x 1 = ρω [1/(κG) + 1/E] and x = ρω 4 /(EκG) ρaω /(EI). The coefficients A i (i = 1...6) can be calculated as a function of the nodal spectral displacements using the boundary conditions. The nodal spectral forces can be determined by differentiating the spectral displacements with respect to x. Finallyusingrelationbetweenthenodal forces and nodal displacements the spectral element stiffness matrix of an intact Timoshenko beam can be obtained as shown in [18].

Mathematical Problems in Engineering 3 Q 1 M 1 Rotational spring Translational spring Shear spring L Q M N 1 N L 1 Figure 1: Spectral beam element model of cracked beam segment. The continuity conditions at the crack location are u 1 x = u x=l 1 x x= EA u 1 x x=l 1 =k 11 (u x= u 1 x=l 1 ) +k 13 (φ x= φ 1 x=l 1 ).. Spectral Element Stiffness Matrix of a Cracked Timoshenko Beam. The spectral element stiffness matrices of beam segments with and without a crack are similar in form. A spectral beam element model with a transverse open and nonpropagating crack is presented as shown in Figure 1.The crack is simulated by three massless springs namely one rotational spring one translational spring and one shear spring in this paper whose flexibilities are calculated using Castigliano s theorem and the laws of the fracture mechanics. The length of the beam element is L and the crack is located at L 1. The spectral solutions for the left and right parts of the beam divided by the crack are similar to the form of (5) which can be expressed using a local coordinate system as κga ( w 1 x x=l 1 φ 1 x=l1 ) =k (w x= w 1 x=l 1 ) EI φ 1 x x=l 1 =k 31 (u x= u 1 x=l 1 ) w 1 x +k 33 (φ x= φ 1 x=l 1 ) φ 1 x=l1 = w φ x=l 1 x x= x= φ 1 x = φ x=l 1 x x= (9) u 1 (x ω) =A 1 e ik3x +A e k 3(L x) 1 w 1 (x ω) =A 3 e ik1x +A 4 e k 1(L x) 1 +A 5 e ik x +A 6 e k (L x) 1 φ 1 (x ω) =α 1 A 3 e ik1x α 1 A 4 e k 1(L 1 x) +α A 5 e ikx α A 6 e k (L x) 1 x (L 1 ) u (x ω) =A 7 e ik 3(L +x) 1 +A 8 e k 3(L L x) 1 w (x ω) =A 9 e ik 1(L +x) 1 +A 1 e k 1(L L 1 x) (7) where k 11 k 13 k andk 33 are stiffness coefficientsof the three springs respectively. Their values can be obtained by Castigliano s theorem [33]: k 11 k 13 c 11 c 13 k = [ k ] = [ c ] [ k 13 k 33 ] [ c 13 c 33 ] 1 (1) where c 11 c 13 c 31 andc 33 are the flexibility coefficients of the three springs respectively which can be expressed as +A 11 e ik (L 1 +x) +A 1 e k (L L 1 x) φ (x ω) =α 1 A 9 e ik 1(L 1 +x) α 1 A 1 e k 1(L L 1 x) +α A 11 e ik (L 1 +x) α A 1 e k (L L 1 x) x (L L 1 ). Node displacements at the two ends of the spectral cracked beam element are c 11 = π a Eb αf 1 c = πβ a Eb (α) dα αf II (α) dα c 13 = 1π a Ebh αf 1 (α) F (α) dα c 33 = 7π a Ebh αf (α) dα (11) u 1 x= =u e1 w 1 x= =w e1 φ 1 x= =φ e1 u x=l =u e w x=l =w e φ x=l =φ e. (8) where b is the width of the beam and a=h c /h is the ratio between the crack depth h c and the height of the beam h.

4 Mathematical Problems in Engineering Adhesive layer R p Ψ N p u M p θ τ τ R p Ψ N p u M p θ Figure : Smart beam element with surface-bonded. segment with surface-bonded which is a -adhesive layer-beam coupled structural element as shown in Figure must be considered synthetically. Below are the equivalent parameters of the coupled structural element: A e =bh+b a h a +b p h p ρ e A e =ρbh+ρ a b a h a +ρ p b p h p β = 1(1 + μ)/(1 + 11μ) denotes the shearing factor of the Timoshenko beam and F 1 ( α h.75 +. (α/h) +.37[1 sin (πα/h)]3 )= cos (πα/h) F ( α h )= h πα tan πα h.93 +.199[1 sin (πα/h)] 4 cos (πα/h) ρ e I e = ρbh3 1 + ρ ab a 1 [(h a +h) 3 h 3 ]+ ρ pb p 1 [(h p +h a +h) 3 (h+h a ) 3 ] E e I e = Ebh3 1 + E ab a 1 [(h a +h) 3 h 3 ]+ Y 11b p 1 [(h p +h a +h) 3 (h+h a ) 3 ] (16) F II ( α h )= 1.3.65 (α/h) +.37(α/h) +.8(α/h) 3. 1 α/h (1) In addition the boundary conditions of the free-free beam are expressed as N (1) 1 =Q (1) 1 =M (1) 1 =N (n) =Q (n) = M (n) =. After the above analysis the stiffness matrix of the crack can be obtained. By substituting (7)into(8)-(9) the spectral nodal displacements can be written in a matrix form as follows: q = DA (13) where q = [u e1 w e1 φ e1 u e w e φ e ] T D is provided in Appendix A and A = [A 1 A A 3 A 4 A 5 A 6 A 7 A 8 A 9 A 1 A 11 A 1 ] T. By substituting (7)into(4) the spectral nodal forces can be expressed in the matrix form as follows: F = BA (14) where F = [N 1 Q 1 M 1 N Q M ] and B is provided in Appendix B. The spectral force-displacement relation can be derived by eliminating the coefficient matrix A in (13) and(14) as follows: F = BD 1 q = Kq. (15) where A e ρ e E e andi e denote the equivalent cross-sectional area density elasticity modulus and inertia moment of the coupled structure respectively; b h ρ E and I are the width height density elasticity modulus and inertia moment of the base beam respectively; b a h a ρ a E a andi a are the width height density elasticity modulus and inertia moment of the adhesive layer respectively; b p h p ρ p Y 11 andi p are the width height density elasticity modulus and inertia moment of the patch respectively. Substituting these equivalent parameters into (7) the displacement equations of the beam segment with surfacebonded can be obtained. According to the analysis method of cracked beam segment the spectral element stiffness matrix of the beam segment with surface-bonded can be also derived whose form is similar to the cracked beam. As shown in Figure a single is bonded onto the surface of the base beam. The piezoelectric smart beam consists of three layers: piezoelectric layer adhesive layer and base beam. The will produce longitudinal expansion and shrink under voltage excitation. There exist interaction forces between the three layers. The base beam will produce both axial and bending vibration when there is only a single. N p M p andr p denote the forces and moments applied to the base beam which are generated by the driving voltage. u θ and ψ are the corresponding displacements. These forces and moments can be expressed in the spectral form as follows: N p =b p d 31 Y 11 V (ω) K is the frequency-dependent spectral element stiffness matrix of the Timoshenko beam with a crack. Crossing out 4 to 9 columns the spectral stiffness matrixcan be written as asquarematrix(6 6). M p =b p d 31 Y 11 ( h +h a + h p )V(ω) R p =b p d 31 Y 11 h a V (ω). (17).3. Spectral Element Stiffness Matrix of Beam Segment with Surface-Bonded. The vibration properties of beam As shown in Figures 3 and 4 two patches are attached to the top and bottom surfaces of the beam

Mathematical Problems in Engineering 5 R p Ψ M p θ N p u N p u M p θ R p Ψ Adhesive layer R p Ψ M p θ N p u N p u M p θ R p Ψ Figure 3: Smart beam element with collocated patches under the same phase of electrical excitation. R p Ψ M p θ N p u N p u M p θ R p Ψ Adhesive layer R p Ψ M p θ N p u N p u M p θ R p Ψ Figure 4: Smart beam element with collocated patches under the opposite phase of electrical excitation. symmetrically. The vibration in this case is different to the casethatonlyasingleisbonedontothetopsurfaceof thebasebeam. Under the same size and same phase of the electrical excitation bending vibration caused by the two patches willbeoffset;thebasebeamonlyproducesaxialvibration. In this case forces and moments applied to the base beam are only N p. Details of the forces can be seen in Figure 3. On the contrary when the patches are under the samesizebutoppositephaseoftheelectricalexcitationaxial vibration caused by the two patches will be offset; the base beam only produces bending vibration. In this case forces and moments applied to the base beam are M p and R p which can be concluded from Figure 4 clearly..4. Formation of Global Stiffness Matrix. The -adhesive layer-cracked beam coupled structure can be divided into different segments due to the location of patch. The spectral element stiffness matrices of beam segments with and without a crack are similar in form. The spectral element stiffness matrix of beam segments with is also derived. So the stiffness matrix of the beam can be determined. Continuity conditions between different beam segments canbeexpressedas N (i) =N (i+1) 1 Q (i) =Q (i+1) 1 M (i) =M (i+1) 1 u (i) e =u(i+1) e1 w (i) e =wi+1 e1 φ(i) e =φ(i+1) e1 (18) where superscript i denotes the number of the beam segments subscript 1 denotes the left end of the beam segment and subscript denotes the right end of the beam segment. By assembling stiffness matrices of different beam segments through the above continuity conditions the global spectral element stiffness matrix of the piezoelectric smart beamcanbeobtained. In order to analyze the displacement of the piezoelectric smart beam under load restraint conditions at the two ends need to be considered. When one end of the beam is free to the left end as an example there exists N 1 =Q 1 =M 1 =; when it is simply supported then M 1 = u e1 = w e1 = ; when it is fixed then u e1 = w e1 = φ e1 =.Bytaking a different combination of the above restraints different boundary conditions of the piezoelectric smart beam can be simulated. 3. EMI Analysis on Piezoelectric Smart Beam A single patch is bonded onto the top surface of the piezoelectricbeam.relativetothebasebeamthesizeof piezoelectric patch is very small. The is considered as a one-dimensional model and the force generated by piezoelectric patches can be simplified as a pair of axial force. The constitutive equations of the patch are ε 1 = σ 1 +d 31 E 3 Y 11 D 3 = ε 33 E 3 +d 31 σ 1 (19) where ε 1 σ 1 are the strain and stress respectively; Y 11 = Y 11 (1 + ηj) is complex Young s modulus at zero electric field with η denoting the mechanical loss factor; E 3 = V(ω)/h p is the electric field intensity; D 3 is the electric displacement along z direction respectively; ε 33 =ε 33 (1 δj) is the complex dielectric constant at zero stress with η denoting the dielectric loss factor; d 31 is the piezoelectric strain constant. From (19) the electric displacement and the electric displacement can be defined as D 3 =d 31 Y 11 ε 1 +(ε 33 d 31 Y 11)E 3. () The electric current passing through the patch can be obtained from the electric displacement as follows: I (ω) =iω D 3 da = iωd 31 Y 11 b p [U ( h +h a + h p ) θ+h aψ] + iωb p l p (ε 33 d 31 Y 11) V (ω) h p (1)

6 Mathematical Problems in Engineering Adhesive layer Crack 1 3 Figure 5: Piezoelectric smart beam with a crack and a single patch. where l p denotes the length of the patch; U θandψ are the change of axial displacement rotational angle and shear displacement of two ends of the bonded- beam which canbeexpressedas U=u x=lp u x= θ=θ x=lp θ x= ψ=ψ x=lp ψ x=. () The coupled EMI of the piezoelectric smart beam can be described as Z (ω) = V (ω) I (ω). (3) For the piezoelectric smart beam the measured impedance curve is the function of the dynamic characteristic of patch and impedance value of the base beam. It can be found that the impedance of the piezoelectric smart beam has relation with parameters of the beam. When the beam is damaged the impedance curve of the piezoelectric smart beam will change. So change of the electromechanical impedanceofthebeamcanreflectdamageofthebeam. 4. Experimental Verification In this study a free-free Timoshenko beam with a single patch attached to its top surface is investigated. The type of patch is 5A and the is located at x 1 = 136.5 mm x = 163 mm from the left end of the beam and the crack is located at x 3 = 18 mm. Here we consider intact beam and three damage cases which are corresponding to therelativecrackdepthsof1%%and3%respectively. The detailed information is as shown in Figure 5; a single patch is bonded onto the top surfaces of a Timoshenko beam with a crack. The -adhesive layer-cracked beam coupled structure is divided into three segments due to the location of patch. The material constants of the beam adhesive layer andpatcharelistedintable 1. The will produce longitudinal expansion and shrink under 1 voltage excitation and then the base beam will also producevibration.therealimpedancesofintactsmartbeam arecalculatedusingsemintwodifferentfrequencyrangesof 1 3kHzand8 1kHz.Inordertoverifythevalidityof the analysis results using SEM some experimental results for intact smart beam are also used for comparison. Numerical and experimental real impedance curves of smart intact beam and cracked beam are shown in Figures 6 and 7respectively. As shown in Figures 6 and 7 numerical and experimental results are in agreement by and large and the impedance magnitudes are within an order of magnitude. Parts of the wave locations do not match. There are many reasons for this case. There exists error usingfoam to simulate free boundary conditions. Numerical models of piezoelectric patch and adhesive layer are considered too simple which cannot fully reflect the actual vibration conditions. From the analysis results it is found that the peak position and amplitude of the electromechanical impedance curve have significant changes with the crack especially in higher frequency ranges. The experimental results are coincident with those using SEM. Therefore it can be concluded that the SEM can be used to analyze the electromechanical impedance responses of a piezoelectric smart beam effectively. 5. Numerical Analysis 5.1. Different Damage Cases. The crack is simulated by three massless springs namely one rotational spring one translational spring and one shear spring in this paper. In order to certify the effectiveness of the spring model piezoelectric beam under different damage conditions is analyzed. Because the process of vibration with a single is too complicated and the number of axial vibration modes is relatively small therefore the bending mode is taken to analyze the effect of crack depth on the admittance of the beam in this paper. On the other hand the peak of bending vibration mode is more significant than the other two modes so it is more suitable to be applied in structural health monitoring. The real impedances for piezoelectric smart beam with acrackarecalculatedusingsemintwodifferentfrequency ranges of 1 3 khz and 8 1 khz. Numerical EMI signatures of smart beam with different crack sizes are shown in Figure 8. FromFigure 8 it is found that the peak positions and amplitudes of the real impedance curves have significant left shifting trend with the variations of crack size especially in higher frequency ranges. This is because the extension of cracks reduced the overall stiffness of the beam. That is the greater the damage is the more the curve shifts to the left. Thereforebetterresultscanbeachievedusinghighfrequency for damage identification in the health monitoring. 5.. Influence of Adhesive Layer. The impact of the adhesive layer has been considered when analyzing the impedance of the piezoelectric smart beam. When the thickness of the adhesive layer changes the impedance of the piezoelectric beam will also change. In order to analyze the effect of thickness of adhesive layer on the impedance free-free beam without crack is taken as the object. The cumulative admittance shifts (CAS) and the cross correlation coefficients

Mathematical Problems in Engineering 7 Table1:Materialconstants. l b (mm) b b (mm) h b (mm) ρ b (kg/m 3 ) E (1 9 Pa) μ Y 11 (1 9 Pa) d 31 (1 1 m/v) ε 33 (1 8 F/m) 6.5 13.5.5 786 6.16 143 1.311 Adhesive 6.5 13.5. 17 1 Beam 4 15 78 1.3 15 5 1 9 6 4 3 3 1 1 15 5 3 8 85 9 95 1 (a) (b) Figure 6: EMI of the beam without a crack in different frequency ranges (- - -: experimental result : numerical result): (a) 1 3 khz and (b) 8 1 khz. (CC) between two real admittance data are defined as CAS = N i=1 Re (Y i ) Re (Y ) Re (Y ) N 1 [Re (Z i ) Re (Z i )] [Re (Z ) Re (Z )] CC = N 1i=1 σ Re(Zi )σ Re(Z ) (4) where Re(Y i ) and Re(Y ) denote a real part of electric admittance with and without an adhesive layer respectively; N denotes the number of measurements; Re(Z) represents the real impedance; subscript represents initial structural status without adhesive layer; superscript represents themeanofare(z); σ Re(Zi ) and σ Re(Z ) are the standard deviations of the real parts of Z i and Z. As shown in Figure 9 with increasing thickness of the adhesive the index CC is becoming smaller and the change of correlation coefficients in the high frequency is more obvious than in the low frequency. When the adhesive layer thickness increases force and moment applied to the beam become larger; the magnitude of the admittance will also increase. The cumulative admittance shifts (CAS) are used to analyze the change of magnitude of the admittance. The analysis results in two different frequency ranges of 1 3 khz and 8 1kHz can be seen in Figure 9(b). 5.3. Different Vibration Modes. When the patches are pasted with different forms the beam will produce different vibration modes. When pasted with a single patch the beam will produce both bending vibration and axial vibration. When two patches attach to the top and bottom surfaces of the beam symmetrically the vibration is different to the vibration of beam with a single bonded onto it. Detail forces of the three vibration modes of the beam have been analyzed in the previous text. Under the samesizeandsamephaseoftheelectricalexcitationthebase beam only produces axial vibration. Under the same size but opposite phase of the electrical excitation the base beam only produces bending vibration. The three graphs in Figure 1 describe the vibration of the base beam with a single bonded onto it the vibration of the beam with collocated patches under the same phase of electrical excitation and that under the opposite phase of electrical excitation respectively. The parameters of the beam are the same as those shown in Table 1. As shown in Figure 11 the number of modes causing vibration of the base beam with a single is equal to the number of bending vibration plus the number of axial vibration with collocated patches in frequency ranges of 1 3 khz and 8 1 khz. This is because the beam will produce both bending vibration and axial vibration when only a single patch vibrates under the voltage

8 Mathematical Problems in Engineering 15 5 1 9 6 3 4 3 1 1 15 5 3 8 85 9 95 1 (a) (b) Figure 7: EMI of the beam with 1% crack in different frequency ranges (- - -: experimental result : numerical result): (a) 1 3 khz and (b) 8 1 khz. 1 8 9 6 3 6 4 1. 1 15 5 3 1% % 3% 8 85 9 95 1 (a) (b) Figure 8: Real impedance of the smart beam with different crack sizes: (a) 1 3 khz and (b) 8 1 khz. 1 8 1% % 3%.9 6 CC.8 CAS 4.7.6.5 1. 1.5. Thickness of adhesive layer (mm) 1 3 khz 8 1 khz (a) (b) Figure 9: CC and CAS values of the piezoelectric smart beam in different frequency ranges: (a) CC index and (b) CAS index..5 1. 1.5. 1 3 khz 8 1 khz Thickness of adhesive layer (mm)

Mathematical Problems in Engineering 9 E Opposite phase excitation E E + + Same phase excitation E + E + Figure 1: Piezoelectric smart beam with different pasted forms. 8 6 4 1 9 6 3 5 4 3 1 15 5 3 Vibration with a single 1 15 5 3 Bending vibration 1 15 5 3 45 3 15 8 85 9 95 1 Vibration with a single 9 6 3 8 85 9 95 1 Bending vibration 8 6 4 8 85 9 95 1 Axial vibration Axial vibration (a) (b) Figure 11: Real impedance of the free-free beam under different vibration modes: (a) 1 3 khz and (b) 8 1 khz.

1 Mathematical Problems in Engineering 1 Crack 1..95 1 3 4 5 Figure 1: Piezoelectric smart beam with a crack and two patches. CC.9.85.8 15 1 5 1 15 5 3 16 1 8 4 1% (a) % 3% 1 15 5 3 1% (b) % 3% Figure 13: Real impedance of the smart beam with different crack sizes: (a) 1 and (b). excitation; the modes reflect information of bending vibration and axial vibration. On the other hand the number of modes caused by the bending vibration is more than that caused by the axial vibration. This is because the value.75 1 1 3 Damage (%) Figure 14: CC of two patches with different crack sizes in the frequency range of 1 3 khz. of the area moment of inertia is much smaller than the sectional area so in a certain frequency band the interval between bending modes is smaller than the axial vibration modes. 5.4. Smart Beam with Dual Patches. In addition to the above analysis of a free-free beam another beam with differentdamageconditionsandpatchpastedformscanbealso analyzed. As shown in Figure 1 a cantilever Timoshenko beam with two patches attached to its top surface is investigated. The -adhesive layer-cracked beam coupled structure is divided into five segments due to the location of patch. The length width and height of the piezoelectric smart beam are 4 mm mm and 15 mm respectively. 1 is located at x 1 = 73.5 mm and x = 1 mm from the left end of the beam is located at x 1 = 3 mm and x = 36.5 mm from the left end of the beam and the crack is located at x 3 = 15 mm. Here we consider intact beam and three damage cases which are corresponding to the relative crack depths of 1% % and 3% respectively. AsshowninFigures13 and 14therealimpedancecurves of 1 and have significant left shifting trend with the variations of crack size and the left shifting trend of impedance curves of 1 is more significant than that of. That is because the position of 1 is closer tocrackthansotheresultsaremoresensitiveto damage. 6. Conclusions An impedance analysis of a piezoelectric smart beam with a crack and a single patch attached to it is implemented in this paper. The crack is simulated by spring models and the influence of adhesive layer is also considered.

Mathematical Problems in Engineering 11 Different vibration modes of the piezoelectric beam are analyzed in this paper and the effect of thickness of the adhesive layer on the admittance is also researched. In order to depict the effects of the depth of crack and thickness of adhesive layer on impedance curves of patches the damage index cumulative admittance shifts (CAS) and cross correlation coefficient (CC) are defined. An experiment of a cracked beam with free boundary conditions at both ends is presented to verify the validity of the analysis results using SEM. The experimental and numerical results are in agreement by and large. It illustrates that using SEM to analyze the admittance of piezoelectric smart beam is feasible. Structural health monitoring technology based on electromechanical impedance using SEM has a certain application value. Appendices A. Spectral Element Displacement Matrix Consider D 1 m 1 c 1 d α 1 α 1 c α α d ik 3 m ik 3 k 11 m+eaik 3 m k 11 EAik 3 k 13 α 1 c k 13 α 1 k 13 α d k 13 α [k + ξ ( ik 1 α 1 )] c k +ξ(ik 1 +α 1 ) [k + ξ ( ik α )] d k + ξ (ik +α ) = k 13 m k 13 (k 33 EIik 1 )α 1 c ( k 33 EIik 1 )α 1 (k 33 EIik )α d ( k 33 EIik )α ( ik 1 α 1 )c ik 1 +α 1 ( ik α )d ik +α ik 1 α 1 c ik 1 α 1 ik α d ik α [ [ ik 3 m ik 3 n k 11 m k 11 n k 13 α 1 c k 13 α 1 f k 13 α d k 13 α g k c k f k d k g k 13 m k 13 n k 33 α 1 c k 33 α 1 f k 33 α d k 33 α g (ik 1 +α 1 ) c ( ik 1 α 1 ) f (ik +α ) d ( ik α )g ik 1 α 1 c ik 1 α 1 f ik α d ik α g p 1 a 1 b 1 ] α 1 a α 1 α b α ] ξ=κga p=e ik 1L m = e ik 1L 1 n = e ik 1(L L 1 ) a = e ik L b=e ik 3L c = e ik L 1 d = e ik 3L 1 f = e ik (L L 1 ) g=e ik 3(L L 1 ). (A.1)

1 Mathematical Problems in Engineering B. Spectral Element Force Matrix Consider B EAik 3 EAik 3 m ρaω ρaω ρaω ρaω ik 1 ik 1 ik ik EIik = 1 α 1 EIik 1 α 1 c EIik α EIik α d EAik 3 p EAik 3. ρaω a ρaω ρaω b ρaω [ ik 1 ik 1 ik ik ] [ EIik 1 α 1 a EIik 1 α 1 EIik α b EIik α ] (B.1) Conflict of Interests The authors declare that there is no conflict of interests regarding the publication of this paper. Acknowledgments The authors would like to extend their thanks to the joint financial support by the National Natural Science Fund of China (517815) the National Basic Research Program of China (973 Program: 11CB138) and the Fundamental Research Funds for the Central Universities (HUST: 14QN11). References [1] K.K.-H.TsengandA.S.K.Naidu Non-parametricdamage detection and characterization using smart piezoceramic material Smart Materials and Structures vol. 11 no. 3 pp. 317 39. [] G. Park H. Sohn C. R. Farrar and D. J. Inman Overview of piezoelectric impedance-based health monitoring and path forward Shock and Vibration Digest vol. 35 no. 6 pp. 451 463 3. [3]G.ParkA.C.RutherfordH.SohnandC.R.Farrar An outlier analysis framework for impedance-based structural health monitoring Sound and Vibration vol. 86 no. 1- pp. 9 5 5. [4] V. Giurgiutiu and A. Zagrai Electro-mechanical impedance method for crack detection in metallic plates in International Society for Optical Engineeringvol.4335ofProceedings of SPIE pp. 131 14 Newport Beach Calif USA 1. [5] V. Giurgiutiu and A. N. Zagrai Embedded self-sensing piezoelectric active sensors for on-line structural identification Vibration and Acoustics Transactions of the ASME vol. 14 no. 1 pp. 116 15. [6] V. Giurgiutiu and A. Zagrai Damage detection in thin plates and aerospace structures with the electro-mechanical impedance method Structural Health Monitoring vol. 4 no. pp. 99 118 5. [7] B. S. Divsholi and Y. Yang Health monitoring of steel structures using sub-frequency electromechanical impedance technique Nondestructive Evaluation vol. 31 no. 3 pp. 197 7 1. [8] J. Min S. Park C. Yun C. Lee and C. Lee Impedance-based structural health monitoring incorporating neural network technique for identification of damage type and severity Engineering Structuresvol.39pp.1 1. [9] D. S. Wang H. Y. Song and H. P. Zhu Numerical and experimental studies on damage detection of a concrete beam based on admittances and correlation coefficient Construction and Building Materialsvol.49pp.564 57413. [1] H. Song H. J. Lim and H. Sohn Electromechanical impedance measurement from large structures using a dual piezoelectric transducer Sound and Vibration vol. 33 no.5 pp. 658 6595 13. [11] S. Talakokula S. Bhalla and A. Gupta Corrosion assessment of reinforced concrete structures based on equivalent structural parameters using electro-mechanical impedance techniq JournalofIntelligentMaterialSystemsandStructuresvol.5no.4 pp.484 514. [1] C. Liang F. P. Sun and C. A. Rogers Coupled electromechanical analysis of adaptive material systemsdetermination of the actuator power consumption and system energy transfer Intelligent Material Systems and Structuresvol.5no.1pp.1 1994. [13] S. Zhou C. Liang and C. A. Rogers An impedance-based system modeling approach for induced strain actuator-driven structures Vibration and Acoustics Transactions of the ASMEvol.118no.3pp.33 3311996. [14] S. Bhalla and C. K. Soh Structural health monitoring by piezoimpedance transducers. I: modeling Aerospace Engineeringvol.17no.4pp.154 1654. [15] V. G. M. Annamdas and C. K. Soh Three-dimensional electromechanical impedance model I: formulation of directional sum impedance Aerospace Engineering vol. no. 1pp.53 67. [16] V. G. M. Annamdas and C. K. Soh Three-dimensional electromechanical impedance model for multiple piezoceramic transducers-structure interaction Aerospace Engineeringvol.1no.1pp.35 448.

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