LED ARRAY LA92B/E.Y-2 DATA SHEET DOC. NO : QW0905-LA92B/E.Y-2 REV. : A DATE : 04 - Jan - 2005
Package Dimensions LIITEK ELECTRONICS CO.,LTD. Page 1/6 7.0 11.72 E,Y 9.02 5.08 2.9 TYP 1 2 3 2.3 3.3 0.3 9.65 4TYP 4TYP E,Y 5.08 4 1-2 3 + - 1.CATHODE RED OR YELLOW 2.COMMON ANODE 3.CATHODE REEN LE2692/R12 LY2692/R12 2.9 3.1 3.3 4.3 6.45 MAX TYP 1 2 3 18.0MIN E.Y MIN 4TYP MIN 4TYP 1 2 3 1.CATHODE RED OR YELLOW 2.COMMON ANODE 3.CATHODE REEN Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without not ice.
Page 2/6 Absolute Maximum Ratings at Ta=25 Parameter Symbol E Ratings Y UNIT Forward Current IF 30 20 30 ma Peak Forward Current Duty 1/@KHz IFP 120 80 120 ma Power Dissipation PD 0 60 0 mw Reverse Current @5V Ir A Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +0 Soldering Temperature Tsol Max 260 for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL COLOR Peak wave length Pnm Spectral Forward halfwidth voltage nm @20mA(V) Luminous intensity @ma(mcd) Viewing angle 2 1/2 (deg) Emitted Lens Min. Max. Min. Typ. LA92B/E.Y-2 aasp/ap Orange 635 45 1.7 2.6 0.8 1.2 36 White Duffused ap reen 565 30 1.7 2.6 1.2 36 aasp/ap Yellow 585 35 1.7 2.6 1.8 4.5 36 White Duffused ap reen 565 30 1.7 2.6 1.2 36 Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
Page 3/6 Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 00 0 0.1 Relative Intensity Normalize @20mA 4.0 5.0 0 00 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 Forward Voltage@20mA 1.1 0.9 0.8-40 -20 0 20 40 60 0 80-40 -20 0 20 40 60 80 0 Fig.5 Relative Intensity vs. Wavelength 550 600 650 700 750 Wavelength (nm)
Page 4/6 Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 00 0 0.1 Relative Intensity Normalize @20mA 4.0 5.0 0 00 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA 1.2 1.1 0.9 0.8-40 -20 0 20 40 60 80 0-40 -20 0 20 40 60 80 0 Fig.5 Relative Intensity vs. Wavelength 500 550 600 650 700 Wavelength (nm)
Page 5/6 Typical Electro-Optical Characteristics Curve CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 00 3.5 0 0.1 Relative Intensity Normalize @20mA 4.0 5.0 0 00 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA 1.2 1.1 0.9 0.8-40 -20 0 20 40 60 80 0-40 -20 0 20 40 60 80 0 Fig.5 Relative Intensity vs. Wavelength 500 550 600 650 Wavelength (nm)
Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=00 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 26 MIL-STD-883: 05 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=5 2.t=00 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:08 JIS C 7021: B- Low Temperature Storage Test 1.Ta=-40 5 2.t=00 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 2.RH=90 %~95% 3.t=240hrs 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:3B JIS C 7021: B-11 Thermal Shock Test 1.Ta=5 5 &-40 (min) (min) 2.total cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 7D MIL-STD-750: 51 MIL-STD-883: 11 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 2A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2