VS-ETU3006S-M3, VS-ETU3006--M3 Ultrafast Rectifier, 30 FRED Pt FETURES Low forward voltage drop Ultrafast recovery time 3 D PK (TO-63) ase cathode 3 TO-6 75 C operating junction temperature Low leakage current Designed and qualified according to JEDEC -JESD 47 Meets MSL level, per J-STD-00, LF maximum peak of 45 C Material categorization: for definitions of compliance please see www.vishay.com/doc?999 3 3 N/C node N/C node D PK TO-6 PRIMRY CHRCTERISTICS I F(V) 30 V R 600 V V F at I F.5 V t rr (typ.) 30 ns T J max. 75 C Package D PK (TO-63), TO-6 Circuit configuration Single DESCRIPTION Ultralow V F, soft-switching ultrafast rectifiers optimized for Discontinuous (Critical) Mode (DCM) Power Factor Correction (PFC). The minimized conduction loss, optimized stored charge and low recovery current minimized the switching losses and reduce over dissipation in the switching element and snubbers. The device is also intended for use as a freewheeling diode in power supplies and other power switching applications. PPLICTIONS C/DC SMPS 70 W to 400 W e.g. laptop and printer C adaptors, desktop PC, TV and monitor, games units, and DVD C/DC power supplies. SOLUTE MXIMUM RTINGS PRMETER SYMOL TEST CONDITIONS MX. UNITS Repetitive peak reverse voltage V RRM 600 V verage rectified forward current I F(V) T C = 3 C 30 Non-repetitive peak surge current I FSM T C = 5 C 00 Operating junction and storage temperatures T J, T Stg -65 to +75 C ELECTRICL SPECIFICTIONS (T J = 5 C unless otherwise specified) PRMETER SYMOL TEST CONDITIONS MIN. TYP. MX. UNITS reakdown voltage, blocking voltage V R, V R I R = 00 μ 600 - - I F = 30 -.4.0 Forward voltage V F I F = 30, T J = 50 C -.5.35 V R = V R rated - 0.0 30 Reverse leakage current I R T J = 50 C, V R = V R rated - 30 50 μ Junction capacitance C T V R = 600 V - 0 - pf Series inductance L S Measured lead to lead 5 mm from package body - 8.0 - nh V Revision: 6-Oct-7 Document Number: 9359 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
VS-ETU3006S-M3, VS-ETU3006--M3 Reverse recovery time t rr DYNMIC RECOVERY CHRCTERISTICS (T J = 5 C unless otherwise specified) PRMETER SYMOL TEST CONDITIONS MIN. TYP. MX. UNITS T J = 5 C - 45 - ns I F =, di F /dt = 50 /μs, V R = 30 V - 30 45 T J = 5 C - 00 - Peak recovery current I RRM T I F = 30 J = 5 C - 5.6 - di F /dt = 00 /μs T J = 5 C V R = 00 V - 0 - T J = 5 C - 7 - Reverse recovery charge Q rr T J = 5 C - 580 - nc THERML - MECHNICL SPECIFICTIONS PRMETER SYMOL TEST CONDITIONS MIN. TYP. MX. UNITS Maximum junction and storage temperature range T J, T Stg -65-75 C Thermal resistance, junction-to-case R thjc - 0.95.4 C/W Thermal resistance, junction-to-ambient R thj Typical socket mount - - 70 Thermal resistance, case-to-heatsink R thcs Mounting surface, flat, smooth, and greased - 0.5 - Weight Mounting torque Marking device Case style D PK (TO-63) Case style TO-6 -.0 - g - 0.07 - oz. 6 (5) - (0) ETU3006S ETU3006- kgf cm (lbf in) I F - Instantaneous Forward Current () 000 00 0 T J = 75 C T J = 5 C T J = 50 C 0.0 0.5.0.5.0.5 V FM - Forward Voltage Drop (V) Fig. - Typical Forward Voltage Drop Characteristics I R - Reverse Current (μ) 000 00 0 0. 0.0 75 C 50 C 5 C 00 C 75 C 50 C 5 C 0.00 0 00 00 300 400 500 600 V R - Reverse Voltage (V) Fig. - Typical Values of Reverse Current vs. Reverse Voltage Revision: 6-Oct-7 Document Number: 9359 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
VS-ETU3006S-M3, VS-ETU3006--M3 000 C T - Junction Capacitance (pf) 00 0 0 00 00 300 400 500 600 V R - Reverse Voltage (V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage 0 Z thjc - Thermal Impedance ( C/W) 0. D = 0.5 D = 0. D = 0. D = 0.05 D = 0.0 D = 0.0 Single Pulse (Thermal Resistance) 0.0 E-05 E-04 E-03 E-0 E-0 E+00 t - Rectangular Pulse Duration (s) Fig. 4 - Max. Thermal Impedance Z thjc Characteristics 80 60 llowable Case Temperature ( C) 70 60 50 40 30 0 0 00 DC 90 0 5 0 5 0 5 30 35 40 45 verage Power Loss (W) 50 40 30 0 0 RMS Limit D = 0.0 D = 0.0 D = 0.05 D = 0. D = 0. D = 0.5 DC 0 0 5 0 5 0 5 30 35 40 45 I F(V) - verage Forward Current () I F(V) - verage Forward Current () Fig. 5 - Maximum llowable Case Temperature vs. verage Forward Current Fig. 6 - Forward Power Loss Characteristics Revision: 6-Oct-7 3 Document Number: 9359 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
VS-ETU3006S-M3, VS-ETU3006--M3 t rr (ns) 30 0 0 00 90 80 70 60 50 40 30 I F = 30, 5 C I F = 30, 5 C 0 typical value 0 00 000 Q rr (nc) 800 600 400 00 I F = 30, 5 C 000 800 600 400 I F = 30, 5 C 00 typical value 0 00 000 di F /dt (/μs) di F /dt (/μs) Fig. 7 - Typical Reverse Recovery vs. di F /dt Fig. 8 - Typical Stored Charge vs. di F /dt (3) t rr 0 I F t a tb () I RRM (4) Q rr 0.5 I RRM di (rec)m /dt (5) 0.75 I RRM () di F /dt () di F /dt - rate of change of current through zero crossing () I RRM - peak reverse recovery current (3) t rr - reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through 0.75 I RRM and 0.50 I RRM extrapolated to zero current. (4) Q rr - area under curve defined by t rr and I RRM t rr x I Q RRM rr = (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr Fig. 9 - Reverse Recovery Waveform and Definitions Revision: 6-Oct-7 4 Document Number: 9359 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
VS-ETU3006S-M3, VS-ETU3006--M3 ORDERING INFORMTION TLE Device code VS- E T U 30 06 S TRL -M3 3 4 5 6 7 8 9 - product - Circuit configuration E = single 3 - T = TO-0 4 - U = ultrafast recovery time 5 - Current code (30 = 30 ) 6 - Voltage code (06 = 600 V) 7 - S = D PK (TO-63) - - = TO-6 8 - None = tube (50 pieces) - TRL = tape and reel (left oriented, for D PK (TO-63) package) - TRR = tape and reel (right oriented, for D PK (TO-63) package) 9 - -M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER TUE MINIMUM ORDER QUNTITY PCKGING DESCRIPTION VS-ETU3006S-M3 50 000 ntistatic plastic tube VS-ETU3006--M3 50 000 ntistatic plastic tube VS-ETU3006STRR-M3 800 800 3" diameter reel VS-ETU3006STRL-M3 800 800 3" diameter reel LINKS TO RELTED DOCUMENTS Dimensions D PK (TO-63) www.vishay.com/doc?9664 TO-6 www.vishay.com/doc?9665 Part marking information D PK (TO-63) www.vishay.com/doc?95444 TO-6 www.vishay.com/doc?95443 Packaging information D PK (TO-63) www.vishay.com/doc?9503 SPICE model www.vishay.com/doc?96438 Revision: 6-Oct-7 5 Document Number: 9359 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
DIMENSIONS in millimeters and inches D PK Outline Dimensions Conforms to JEDEC outline D PK (SMD-0) (3) L ()(3) E 4 c (E) (D) (3) Pad layout.00 MIN. (0.43) 9.65 MIN. (0.38) D L x e 3 H () x b x b C Detail 0.00 M M c ± 0.004 M E View - H (3) 7.90 (0.70) 5.00 (0.65).3 MIN. (0.08) Plating.64 (0.03).4 (0.096) (4) b, b3 3.8 MIN. (0.5) ase Metal Gauge plane Lead tip 0 to 8 L3 L L4 Detail Rotated 90 CW Scale: 8: Seating plane (c) (b, b) Section - and C - C Scale: None c (4) SYMOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES 4.06 4.83 0.60 0.90 D 6.86 8.00 0.70 0.35 3 0.00 0.54 0.000 0.00 E 9.65 0.67 0.380 0.40, 3 b 0.5 0.99 0.00 0.039 E 7.90 8.80 0.3 0.346 3 b 0.5 0.89 0.00 0.035 4 e.54 SC 0.00 SC b.4.78 0.045 0.070 H 4.6 5.88 0.575 0.65 b3.4.73 0.045 0.068 4 L.78.79 0.070 0.0 c 0.38 0.74 0.05 0.09 L -.65-0.066 3 c 0.38 0.58 0.05 0.03 4 L.7.78 0.050 0.070 c.4.65 0.045 0.065 L3 0.5 SC 0.00 SC D 8.5 9.65 0.335 0.380 L4 4.78 5.8 0.88 0.08 Notes () Dimensioning and tolerancing per SME Y4.5 M-994 () Dimension D and E do not include mold flash. Mold flash shall not exceed 0.7 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) Datum and to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-63 Revision: 08-Jul-5 Document Number: 95046 For technical questions within your region: Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUJECT TO CHNGE WITHOUT NOTICE. THE PRODUCTS DESCRIED HEREIN ND THIS DOCUMENT RE SUJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9000
Outline Dimensions TO-6 DIMENSIONS in millimeters and inches Modified JEDEC outline TO-6 (Datum ) () (3) E (3) L c E D Seating plane D(3) L C 3 C L () x e 0.00 M M Lead tip 3 x b 3 x b c Lead assignments Diodes. - node (two die)/open (one die)., 4. - Cathode 3. - node Plating c E Section - (4) ase b, b3 metal (b, b) (3) c (4) Section - and C - C Scale: None SYMOL MILLIMETERS INCHES MIN. MX. MIN. MX. NOTES 4.06 4.83 0.60 0.90.03 3.0 0.080 0.9 b 0.5 0.99 0.00 0.039 b 0.5 0.89 0.00 0.035 4 b.4.78 0.045 0.070 b3.4.73 0.045 0.068 4 c 0.38 0.74 0.05 0.09 c 0.38 0.58 0.05 0.03 4 c.4.65 0.045 0.065 D 8.5 9.65 0.335 0.380 D 6.86 8.00 0.70 0.35 3 E 9.65 0.67 0.380 0.40, 3 E 7.90 8.80 0.3 0.346 3 e.54 SC 0.00 SC L 3.46 4.0 0.530 0.555 L -.65-0.065 3 L 3.56 3.7 0.40 0.46 Notes () Dimensioning and tolerancing as per SME Y4.5M-994 () Dimension D and E do not include mold flash. Mold flash shall not exceed 0.7 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) Controlling dimension: inches (6) Outline conform to JEDEC TO-6 except (maximum), b (minimum) and D (minimum) where dimensions derived the actual package outline Document Number: 9549 For technical questions within your region, please contact one of the following: www.vishay.com Revision: 04-Oct-0 Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com
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