Analysis of Thermal Stress in Fatigue Fracture Specimen using Lock-in Thermography

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Analysis of Thermal Stress in Fatigue Fracture Specimen using Lock-in Thermography Won-Tae Kim*, Man-Yong Choi**, Jung-Hak Park** * Major of Bio-mechanical Engineering, Kongju National University, Chungnam, Korea, 340-702 ** Safety Measurement Group, Korea Research Institute of Standards and Science, Daejeon, Korea, 305-600 Abstract This paper aims to describe the thermal stress analysis using Lock-in thermography as a nondestructive testing(ndt. Applying the method of IR thermographic measurement would significantly reduce the necessary specimens and testing duration. As this technology is based on the thermal elastic effects, it can be used only under dynamic loading conditions, but not under static conditions. This study examined the distribution of stresses in a specimen by applying the principle of thermal elasticity. From the relationship between strength and stress, it was found that changes of temperature caused by measured stresses camera were consistent with the applied loads. Key Words: Infrared(IR) Thermography, Thermal Stress, Nondestructive Testing(NDT), Fatigue Fracture, Lock-in 1. Introduction Extensive studies have been conducted on the fatigue damage analysis for long time. Today s industries are faced with the needs to develop new products within a shorter period of time by shortening the design cycles. To fulfill such needs in the field of nondestructive testing, stress analysis methods using lock-in thermography are considered as a faster technology at the stage of design development.[1-4] The recent significant progress in thermography technologies allowed developing equipment for noncontact full-field stress analysis.[5] A lock-in system contains a thermography camera, which measures the infrared emissions from the surface of a specimen under cyclic loading, and a lock-in module, which in real-time collects the loading signals of a fatigue tester from the thermography camera and noises and detects the detailed changes in temperature. Using a lock-in thermography system, this study examined the distribution of stresses in specimens by applying the principle of thermal elasticity.[6, 7] Further studies should be undertaken to resolve this limitation. Using a lock-in thermography system, this study examined the distribution of stresses in specimens by applying the principle of thermal elasticity. 2. Theoretical Background Due to the first and second principles of thermodynamics, there is a relationship between temperature and mechanical behavior laws.[8] The relationship between thermal stress and strain in an isotropic, elastic element is given by ( 1 2ν ) Δσ (1) Δε = + 3αΔT E where, Δε is the change of main strains summation, Δσis the change of main strains summation, E is Young s modulus, υ is Poisson s ratio, α is linear dilatation coefficient, and ΔT is difference of temperature. When a force is applied to the specimen, the thermodynamic analysis of reversible and adiabatic behaviors of an elastic element is given by the linear thermo-elastic relation from Lord Kelvin equation(1850). 3 TαKΔε (2) ΔT = ρ C V where, ΔT is Temperature difference, T is absolute temperature, K is Bulk modulus, ρ is density, and C V is the heat capacity at constant volume. Here, is the expansion of volume. If an element has no change in volume, the temperature will not change. Using the known relationship among the C V, the thermal capacity under constant pressure, and the C P, Equations (1) and (2) are combined to obtain an equation below describing the thermal elastic effects: Temperature changes is inversely proportional to the increase of stresses.

ΔT α = ρc P T ( σ1+ σ 2 + σ 3) This relationship is effective only under an adiabatic condition. In the analysis of thermal elastic stresses,[9] the adiabatic condition can be obtained by applying cyclic stresses to a load-bearing member (>3Hz): the dynamic equilibrium (reversible condition) is maintained between the mechanical and thermal energies. Equation (3) is a typical thermodynamic equation quantitatively describing the temperature change caused by the applied loads. The minus symbol indicates that the tension decreases the temperature while the compression increases the temperature. Under an adiabatic condition, the change in temperature will be proportional to the variation of the sum of the principal stresses. The thermal elastic modulus is given by (4) K M α = ρc P where K m is the thermo-elastic coefficient. From materials engineering book, the typical K m values of common engineering materials are shown in Table 1. Table 1 Typical values of common engineering materials Material α (K -1 ), 10-5 ρ (kg/m 3 ) C P (KJ/Kg K) K M (MPa -1 ) Steel 1.20 7800 400 3.14E-06 Cast iron 1.00 7800 500 3.56E-06 Titanium 8.55 4428 545 3.54E-06 Inox 1.20 7800 918 3.08E-06 Alu 42100 6.70 2735 441 2.67E-06 Iron 1.21 7870 1040 3.49E-06 Epoxy 3.50 1170 1700 2.88E-06 Polyester 8.00 1140 1700 4.13E-06 Alumina 7.70 3000 900 1.99E-06 3. Lock-in Thermography This study used a thermography camara (made by CEDIP Infrared System; JADE 550M model) equipped with a two-dimensional Focal Plane Array (FPA) infrared detection device. Its resolution was 320 x 240 pixels, and the wavelength band was 3-5 _. The infrared detection device used InSb or MCT and was cooled by a stirling cooler. The Noise Equivalent Temperature Differential (NETD) was 0.02_ at 30_, which was the best among the commercial thermography cameras. As infrared stress analysis requires a better NETD level, 2,000 images were continuously collected and calculated at the frame rate of 100 Hz for 20 seconds using the lock-in method as shown in Figure 1. Using the lock-in system at the frame rate at regular intervals, the thermographic data were continuously collected from specimens under cyclic loading and calculated to obtain the maximum temperature difference, _T, and then thermographic images. Contrast to conventional thermographic (3) Loading signal Phase of thermal wave Time pattern of an IR camera Thermal wave at pixel (x, Frame rate Integration time S1 S2 S3 S4 Sn φ( x, = tan 1 S ( x, 4 2 S ( x, 1 3 Amplitude of thermal wave 2 [ S ( x, ] + [ S ( x, ] 2 A( x, = y ) 1 3 2 4 Fig. 1 Signal processing in Lock-in thermography

http://dx.doi.org/10.21611/qirt.2006.099 IR camera Detecting range: 3.6 ~ 5.1 _m Infra-red wave Frame rate control Temperature signal UTM Force = f(t) TSA response Lock-in Analyzer Loading signal (Reference signal) Fig. 2 Experimental set-up for Lock-in thermography methods showing only the distribution of temperatures, this lock-in thermography combines the each phase of the loading signals from the fatigue tester with the temperature data from the thermography camera to calculate the thermographic data. 4. Experiments 4.1 Experimental set-up As shown in figure 2, the specimen (FFC(T) SS400) was installed on the MTS fatigue tester to measure thermal stresses. To avoid any reflection from the specimen to the thermography camera, the specimen surface was sprayed for anti-reflection. The thermography camera was placed 1 meter in front of the installed specimen, and the lock-in module was set up so as to synchronize the loading signals from the fatigue tester and the temperature data from the IR thermography camera in real-time. To provide an adiabatic condition, heat sources were all removed from the laboratory. (a) schematic of specimen (b) specimen mounted to MTS Fig. 3 Specimen for the testing Table 2 Dimensioning of the specimen; unit, mm Width(W) 50.89 Notch Length(ao) 22.07 Thickness(B) 25.47 Net Thickness(BN) 25.47 COD Half gage Length 1.25 COD Distance from Load Line 15.74 Table 3 Properties of the specimen Young s Module(E) 200 GPa Yield Strength 368.4 MPa Poisson s Ratio 0.3 Figure 3 shows the FFC(T) as specimen and the photo mounted by installation to the MTS fatigue

tester. And, tables 2 and 3 describes the geometry and properties, respectively 4.2 Experimental Procedures First of all the thermal elastic effects were examined: the changes in temperature were measured at the specimens under a constant load, and then the stress images taken by the IR thermography camara under cyclic stresses were analyzed. The relationship between the applied loads and stresses was also examined with actual tests. The IR thermographic images were taken by the thermography camera for 5 seconds at the rate of 100 images per second. Strength (N) = Force F ΔF t T ΔT t Change of volume = change of density of free energy Change of density of energy = minute change of temperature Fig. 4 Thermo-elastic effect in Lock-in thermography

http://dx.doi.org/10.21611/qirt.2006.099 (a) Thermal patterns on specimen during dynamic (b) Temperature change at the spot with loading max. temperature change Fig. 5 Thermography imaging and temperature on loading 4.3 Stress Experiments From figures 4, temperature changes due to the change of volume under loading conditions and total energy is constant. The biggest temperature difference was 0.50_: the highest and lowest were 28.60_ and 28.10_, respectively. It was also found that the temperature decreased in tension and increased in compression in a cyclic pattern. 5. Results and Discussions 5.1. Stress Analysis Figures 5 (b) show the changes in temperature when the fatigue tester is applied to cyclic loads in compression and tension, respectively. As the changes in temperature measured by the IR thermography camera are proportional to the principal stresses as described in Equation (3), the stresses can be (a) Stress spot from thermal image applying elastic (b) stress map of the area showing stress effect concentration Fig. 6 Stress spot and map in Lock-in thermography

Fig. 7 Stress profile around the spot of maximum stress value obtained by multiplying the temperature difference (_T) and the thermal elastic modulus (Km) of the material to show the stresses at all the pixels on a stress image as shown in figure 5. ~ 7 show a stress map and a stress profile zoomed-in at the stress-concentrated point, respectively. The stress-concentrated point was consistent with the expected one. 5. 2. Relation between loading condition and stress In order to examine the relationship between the applied loads and stresses, a constant load was applied to the specimen at the interval of 10 Hz by increasing the load from 11 kn to 29 kn with an incremental of 6 kn to obtain the thermographic images at each load. The stress values (MPa) in the thermographic images were calculated by multiplying the temperature difference, _T, in Equation (3) and the thermal elastic modulus, 3.14 x 10-6, in Table 1. As shown in Figure 9, analyzing each thermographic image for the maximum stress at the stressconcentrated point indicates that the stresses measured by the thermography camera are proportional to the applied loads. The analysis of the linear relationship between the strength and stress found in this study also implies that the changes in temperature caused by the measured stresses from the thermography camera were consistent with the applied loads. (a) 343 MPa(11 KN) (b) 547 MPa(17 KN) (c) 763 MPa(23 KN) (d) 1010 MPa(29 KN) Fig. 8 Thermo-elastic effect in Lock-in thermography 1200 1000 Stress 800 600 400 200 0 11 17 23 29 Strength 6. Conclusions and Remarks Fig. 9 Relationship between applied strength and stress The analysis of stresses in specimens using lock-in thermography was possible because the NETD levels of IR thermography cameras were dramatically improved. This technology can be used for the analysis of stresses or the prediction of fatigue limits in a non-destructive and non-contact way within a short time, so that users can obtain a stress map immediately from the nondestructive testing. As using this technology allows detecting any damaged or weak point, it is better than other conventional photoelastic or ESPI methods. Applying this thermographic measurement to fatigue testing would significantly reduce the necessary specimens and testing duration. As this technology is based on the thermal elastic effects, however, it can be used only under dynamic loading conditions, but not under static loading conditions. Further studies should be undertaken to resolve this limitation.

References 1. D. Wu and G. Busse. Lock-in thermography for nondestructive evaluation of materials, Rev. Gen. Therm. 17 (1998) 693-703. P. Bremond and P. Potet. Application of Lock-in thermography to the measurement of stress and to the determination of damage in material and structures, QIRT conferences (2000) 3. P. Bremond and P. Potet. Lock-in Thermography, A tool to analyze and locate thermo-mechanical mechnism in materials and structure, Thermosence XXIII April (2001) 4. M. P. Luong. Fatigue limit evaluation of metals using an infrared thermographic technique, Mechanics of materials 28 (1998) 155-163. 5. W. T. Kim, M. Y. Choi, Jung H. Park. Diagnosis of defect points in materials using infrared thermography, Key Engineering Materials, Vols. 297~300 (2005) 2169~2173. 6. J. H. Park, M. Y. Choi, W. T. Kim. Infrared thermography and modeling to the concrete deck with internal defects as a non-destructive testing, Key Engineering Materials, Vols. 270~273, (2004) 7. 938~943. V. Vavilov. Thermal nondestructive testing: short history and state-of-art. In: Balageas D, Busse G, Carlomagno GM, editors Proc. of the QIRT 1992, Eurotherm Series 27. EETI ed., (1992) 179-93. 8. D. Wu, A. Salerno, B. Schonbach, H. Hallin, C. Busse. Phase-sensitive modulation thermography and its applications for NDE, Proc. SPIE, Vol. 3056, (1997) 176~182.