EE115C Digital Electronic Circuits Homework #5

Similar documents
CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING DIGITAL INTEGRATED CIRCUITS FALL 2002

Interconnect (2) Buffering Techniques. Logical Effort

EE115C Digital Electronic Circuits Homework #6

EE115C Digital Electronic Circuits Homework #4

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University

COMP 103. Lecture 10. Inverter Dynamics: The Quest for Performance. Section 5.4.2, What is this lecture+ about? PERFORMANCE

EECS 141: SPRING 09 MIDTERM 2

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )

Digital Integrated Circuits A Design Perspective

Digital Integrated Circuits A Design Perspective

Very Large Scale Integration (VLSI)

9/18/2008 GMU, ECE 680 Physical VLSI Design

VLSI Design, Fall Logical Effort. Jacob Abraham

EECS 151/251A Homework 5

Integrated Circuits & Systems

Lecture 9: Interconnect

EE141-Fall Digital Integrated Circuits. Announcements. Lab #2 Mon., Lab #3 Fri. Homework #3 due Thursday. Homework #4 due next Thursday

Lecture 12 CMOS Delay & Transient Response

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

CMPEN 411 VLSI Digital Circuits Spring 2012

Logic Gate Sizing. The method of logical effort. João Canas Ferreira. March University of Porto Faculty of Engineering

Digital Integrated Circuits (83-313) Lecture 5: Interconnect. Semester B, Lecturer: Adam Teman TAs: Itamar Levi, Robert Giterman 1

Capacitance - 1. The parallel plate capacitor. Capacitance: is a measure of the charge stored on each plate for a given voltage such that Q=CV

Lecture 5: DC & Transient Response

Static CMOS Circuits. Example 1

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Oldham Fall 1999

EECS 151/251A Spring 2018 Digital Design and Integrated Circuits. Instructors: Nick Weaver & John Wawrzynek. Lecture 12 EE141

Properties of CMOS Gates Snapshot

EE141. Administrative Stuff

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: 1st Order RC Delay Models. Review: Two-Input NOR Gate (NOR2)

Homework Assignment #5 EE 477 Spring 2017 Professor Parker

5.0 CMOS Inverter. W.Kucewicz VLSICirciuit Design 1

Lecture 6: Logical Effort

EECS 312: Digital Integrated Circuits Midterm Exam 2 December 2010

EE213, Spr 2017 HW#3 Due: May 17 th, in class. Figure 1

CHAPTER 15 CMOS DIGITAL LOGIC CIRCUITS

ECE429 Introduction to VLSI Design

Homework #2 10/6/2016. C int = C g, where 1 t p = t p0 (1 + C ext / C g ) = t p0 (1 + f/ ) f = C ext /C g is the effective fanout

EE M216A.:. Fall Lecture 4. Speed Optimization. Prof. Dejan Marković Speed Optimization via Gate Sizing

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

EE 447 VLSI Design. Lecture 5: Logical Effort

The Wire. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

Logical Effort. Sizing Transistors for Speed. Estimating Delays

! Crosstalk. ! Repeaters in Wiring. ! Transmission Lines. " Where transmission lines arise? " Lossless Transmission Line.

ECE 546 Lecture 10 MOS Transistors

CMOS logic gates. João Canas Ferreira. March University of Porto Faculty of Engineering

Lecture 5: DC & Transient Response

EECS 141: FALL 05 MIDTERM 1

! Dynamic Characteristics. " Delay

EE141-Fall 2012 Digital Integrated Circuits. Announcements. Homework #3 due today. Homework #4 due next Thursday EECS141 EE141

CPE/EE 427, CPE 527 VLSI Design I L13: Wires, Design for Speed. Course Administration

LECTURE 28. Analyzing digital computation at a very low level! The Latch Pipelined Datapath Control Signals Concept of State

PASS-TRANSISTOR LOGIC. INEL Fall 2014

ENEE 359a Digital VLSI Design

Announcements. EE141- Spring 2003 Lecture 8. Power Inverter Chain

Digital Integrated Circuits. The Wire * Fuyuzhuo. *Thanks for Dr.Guoyong.SHI for his slides contributed for the talk. Digital IC.

Integrated Circuits & Systems

Integrated Circuits & Systems

Integrated Circuits & Systems

EE 330 Lecture 6. Improved Switch-Level Model Propagation Delay Stick Diagrams Technology Files

Designing Information Devices and Systems II Fall 2017 Miki Lustig and Michel Maharbiz Homework 1. This homework is due September 5, 2017, at 11:59AM.

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power

Next, we check the race condition to see if the circuit will work properly. Note that the minimum logic delay is a single sum.

EE141Microelettronica. CMOS Logic

VLSI GATE LEVEL DESIGN UNIT - III P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT

ECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter

The CMOS Inverter: A First Glance

EEC 118 Lecture #6: CMOS Logic. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

Interconnects. Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. ECE 261 James Morizio 1

ECE 342 Electronic Circuits. Lecture 35 CMOS Delay Model

EE241 - Spring 2000 Advanced Digital Integrated Circuits. Announcements

DC and Transient. Courtesy of Dr. Daehyun Dr. Dr. Shmuel and Dr.

7. Combinational Circuits

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

Lecture 14 - Digital Circuits (III) CMOS. April 1, 2003

Lecture 6: DC & Transient Response

EECS 312: Digital Integrated Circuits Midterm Exam 2 December 2010

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

The Wire EE141. Microelettronica

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

EE5780 Advanced VLSI CAD

2007 Fall: Electronic Circuits 2 CHAPTER 10. Deog-Kyoon Jeong School of Electrical Engineering

Interconnects. Introduction

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

Assignment 3 ELEC 312/Winter 12 R.Raut, Ph.D.

Lecture 4: DC & Transient Response

Name: Grade: Q1 Q2 Q3 Q4 Q5 Total. ESE370 Fall 2015

CMOS Transistors, Gates, and Wires

Topics to be Covered. capacitance inductance transmission lines

EE371 - Advanced VLSI Circuit Design

EECS 427 Lecture 8: Adders Readings: EECS 427 F09 Lecture 8 1. Reminders. HW3 project initial proposal: due Wednesday 10/7

EEC 116 Lecture #5: CMOS Logic. Rajeevan Amirtharajah Bevan Baas University of California, Davis Jeff Parkhurst Intel Corporation

EE M216A.:. Fall Lecture 5. Logical Effort. Prof. Dejan Marković

Errata of K Introduction to VLSI Systems: A Logic, Circuit, and System Perspective

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

Lecture 1: Gate Delay Models

ECE321 Electronics I

Transcription:

EE115C Digital Electronic Circuits Homework #5 Due Thursday, May 13, 6pm @ 56-147E EIV Problem 1 Elmore Delay Analysis Calculate the Elmore delay from node A to node B using the values for the resistors and capacitors given in the table below. Verify your answers with simulation using SPECTRE. Resistor Value (Ohms) Capacitor Value (ff) R1 0.06 C1 60 R2 0.06 C2 180 R3 0.12 C3 60 R4 25 C4 60 R5 0.06 C5 250 R6 0.25 C6 60 R7 0.18 C7 120 R8 250 C8 60 Shared resistance between selected node and resistance between A and B R AC AB R 1 = 0.06 R AD AB R 1 = 0.06 R AE AB R 1 + R 3 = 0.18 R AF AB R 1 = 0.06 R AG AB R 1 + R 3 = 0.18 R AH AB R 1 +R 3 +R 6 = 0.43 R AI AB R 1 +R 3 = 0.18 R AB R 1 +R 3 +R 6 +R 8 = 250.43

For each node, we find common resistance between the node and path from node A to node B, as shown in the table above. Using Eq. (4.13) from the textbook, we obtain τ= 15.147ps. The propagation delay is given by: t p = 0.69 τ = 10.45 ps For Spectre simulation, we first construct the schematics as in the following figure: A Transient Analysis is ran with a pulse input source having the pulse-width of ~50ps. The simulation result is shown below: The propagation delay from Simulation is 10.51 ps (very close to 10.45 ps )

Problem 2 Wire Length and its Capacitance Electrical Engineering Department Spring 2010 A standard CMOS inverter drives an aluminum metal-1 wire. Assume R n =1KΩ, R p =1.5KΩ. Also, assume that the output capacitance of the unloaded gate is negligible compared to the wire we are driving. The wire is 0.2μm wide with the resistivity of 0.05 Ω/. Use the lumped RC model in your analysis. a) What is the "critical length" of the wire? (Hint: see Chapter 4, page 158) (Note: Eq. 4.20 uses the distributed RC model) R s = (1kΩ + 1.5kΩ)/2 = 1.25 kω t p_gate = 0.69 1.25k (C wire ) t p_wire = 0.69 R wire (C wire ) (lumped RC model) In order to make t p_gate = t p_wire R wire = 1.25k Also R wire = 0.05 L critical / 0.2μm L critical = R wire / R W wire = 1.25k / 0.05 0.2 μm L critical = 5 mm b) What is the equivalent capacitance of a wire of this length? For the wire capacitance calculation, assume C pp = 20aF/μm 2, C fringe = 30aF/μm. C pp = 0.02fF/μm 2 (0.2 μm) (5000 μm) = 20 ff C fringe = 2 0.03 F/μm 5000 μm = 300 ff C wire = C pp + C fringe = 320 ff Problem 3 Propagation Delay & Gate Sizing Consider the circuit in Fig. 3. At the output of the first stage, fanout is b 1 = 2 identically sized (x) inverters. At the output of the third stage, fanout is b 2 = 4 identically sized (z) inverters. Hint: Since there are so many inverters, you may use the hierarchical design methods. (Tutorial 2) b 1 =2 b 2 =4 V in 1 x y z V out 256 Fig. 3 a) Determine scaling factors x, y, z to minimize the delay. Path branching effort is the product of per-stage branching factors

B = 2 1 4 1=8 Electrical Engineering Department Spring 2010 The ratio of the external load of input capacitance is F = 256 / 1 = 256 The overall logical effort is G = 1 1 1 1 = 1 To minimize the delay, all stages should have the same effort f. Stage Effort = f = = 4 * 256 8 6.73 2x f = 6.73 =, x = 6.73 / 2 = 3.36 1 y f = 6.73 =, y = 6.73 3.36 = 22.65 x 4z f = 6.73 =, z = 6.73 22.65/4 = 38.11 y x =3.36, y = 22.65, z =38.11 b) Calculate the delay assuming t p0 =7ps and C int = C gate (γ = 1). Verify your results in SPECTRE and comment on the differences. In SPECTRE validation, assume unit-sized inverter with following transistor parameters: W p = 480nm, W n = 240nm, L n = L p = 100nm. Hint: Since there are so many inverters, you may use the hierarchical design methods. (Tutorial 2) Hand calculation: t p = t p0 4 (1+ 6.73 ) = 7ps 4 7.73 = 216.4 ps Simulation: The delay is simulated using the schematic below (extra capacitances, representing load to the load, may be used to suppress Miller kick-back). t p = (t plh + t phl )/2 = (221.4 + 217 )/2 = 219.2 ps

Comparison: Hand calculation 216.4ps, Simulation 219.2ps (1) The difference between the two values is about 2%, which is quite close. (2) t p0 can be calibrated more precisely (γ 1). (3) We assume the inverters with W p = 2W n to have the same pull-up and pull-down capability, which is not quite true. It may contribute a few percent. Problem 4 Logic and Logical Effort a) A three-input XNORT gate (see insert above) works like a two-input NOR as long as input A is high; otherwise, the output is stuck high. Implement the XNORT gate in complementary CMOS, and size all transistors such that the worst-case delay is equal to that of a minimum sized 2/1 inverter. Find the logical effort associated with each input. 1.5fF 54fF Fig 4: XNORT path. The complementary CMOS implementation is to the left. Logical effort is defined as the ratio of input capacitance of a gate (considering only one input) to the input capacitance of an inverter with the same output current. This gives us: g A = (2+2)/(2+1) = 4/3 g B = (4+2)/(2+1) = 2 g C = (4+2)/(2+1) = 2

b) Assuming all input combinations are equally likely, what is the transition activity (probability) of a XNORT gate? Averaged over many cycles, will a XNORT gate typically consume more or less power than a two-input NOR gate, if they both drive equally large output loads? What about a two-input XOR? The transition probability of the gate is P(F:0 1) = P(F=0)P(F=1) = 3/8 5/8 = 15/64 = 0.23 The transition probability of a two-input NOR (again with all inputs assumed equally likely) is 3/16 0.19, lower than the XNORT. With the simplifying assumption that the output load is large (which lets us forget about differences in intrinsic capacitance), we can confidently assert that the XNORT will on average consume more dynamic power. The transition probability of a two-input XOR is 0.25, which is slightly more than the XNORT. Therefore, we would expect the XNORT to consume less power, on average. P(F:0 1) = 0.23 c) For the logic path from node (1) to node (2) shown in the Fig. 4, find the path branching effort, path electrical effort, path logical effort, and total path effort. What is the optimum effort per stage for minimizing delay? The path branching effort (product of stage branching efforts, which are the ratios of total driven capacitance to capacitance driven on the path) is: B path = 1 3 1 2 1 = 6 The path electrical effort (ratio of output capacitance to input capacitance) is: H path = C L /C in = 54fF/1.5fF = 36 The path logical effort (product of stage logical efforts), using results from both the lectures and earlier in this problem, is: G path = g inv g xnort,a g nand g xnort,b g nor = 1 4/3 4/3 2 5/3 = 160/27 The total path effort is then F= G path B path H path = 160/27 36 6 = 1280 The optimum effort per stage for this five-stage path is f* = F 1/5 = 4.18

d) Find the input capacitances {w, x, y, z} necessary for each of the gates in the path in order to achieve the optimum effort per stage. The effort for the stage is f = b g h C in = g C out b / f Input capacitance of the NOR gate (last gate in the path) is: z = b g nor C L / f = 1 (5/3) 54fF / 4.18 = 21.5fF The stage effort for the second XNORT is: f = 2 g xnort,b 21.5fF / y y = b 21.5fF g xnort,b / f = 2 21.5fF 2 / 4.18 = 20.6fF. Fanout of the NAND gate is: h = 20.6fF / x x = b 20.6fF g nand / f = 1 20.6fF (4/3) / 4.18 = 6.6fF Fanout (electrical effort) for the first XNORT is: h = 6.6fF / w w = 3 6.6 ff g xnort,a / f = 3 6.6fF (4/3) / 4.18 = 6.3fF As a check, we see that the first stage effort is f = b g inv h = 1 1 6.3fF / 1.5fF = 4.2, which closely matches our calculated optimum effort per stage. z = 21.5 ff, y = 20.6 ff, x = 6.6 ff, w = 6.3 ff