Enhanced Thermal Conductance of ORU Radiant Fin Thermal Interface using Carbon Brush Materials

Similar documents
International Journal of Advance Engineering and Research Development

IN-PLANE THERMAL CONDUCTIVITY OF FLAT PLATES UTILIZING THE FOURIER HEAT CONDUCTION LAW

Solar Flat Plate Thermal Collector

PHYS102 Previous Exam Problems. Temperature, Heat & The First Law of Thermodynamics

CRYOGENIC CONDUCTION COOLING TEST OF REMOVABLE PANEL MOCK-UP FOR ITER CRYOSTAT THERMAL SHIELD

EXPERIMENTAL INVESTIGATION OF HIGH TEMPERATURE THERMAL CONTACT RESISTANCE WITH INTERFACE MATERIAL

Chapter 17 Temperature and heat

Optimization of Heat Spreader. A thesis presented to. the faculty of. In partial fulfillment. of the requirements for the degree.

Documentation of the Solutions to the SFPE Heat Transfer Verification Cases

If there is convective heat transfer from outer surface to fluid maintained at T W.

1. Mark the correct statement(s)

Maximum Heat Transfer Density From Finned Tubes Cooled By Natural Convection

Peltier Application Note

INVESTIGATION OF AN ATMOSPHERIC PRESSURE THERMOACOUSTIC COOLING SYSTEM BY VARYING ITS OPERATING FREQUENCY

Introduction to Heat and Mass Transfer. Week 5

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010

Thermal characteristic evaluation system to evaluate. heat transfer characteristics of mounted materials

Analog Technologies. High Stability Miniature Thermistor ATH10K0.1%1R25

MIL-STD-883E METHOD THERMAL CHARACTERISTICS

Power Resistors, for Mounting onto a Heatsink Thick Film Technology

Pre-AP Physics Review Problems

Thermal Interface Materials (TIMs) for IC Cooling. Percy Chinoy

Carbonized Electrospun Nanofiber Sheets for Thermophones

International Journal of Engineering Research and General Science Volume 3, Issue 6, November-December, 2015 ISSN

Lobster-Eye Hard X-Ray Telescope Mirrors

Physical Properties Testing Technical Bulletin

Thermal Coatings for In-vacuum Radiation Cooling LIGO-T C R. Abbott, S. Waldman, Caltech 12 March, 2007

Supplementary Information for On-chip cooling by superlattice based thin-film thermoelectrics

Project PAJ2 Dynamic Performance of Adhesively Bonded Joints. Report No. 3 August Proposed Draft for the Revision of ISO

P5 Heat and Particles Revision Kinetic Model of Matter: States of matter

Temperature Scales. Temperature, and Temperature Dependent on Physical Properties. Temperature. Temperature Scale

NORMAL STRESS. The simplest form of stress is normal stress/direct stress, which is the stress perpendicular to the surface on which it acts.

OCEAN/ESS 410. Class 3. Understanding Conductive Cooling: A Thought Experiment. Write your answers on the exercise sheet

COVENANT UNIVERSITY NIGERIA TUTORIAL KIT OMEGA SEMESTER PROGRAMME: MECHANICAL ENGINEERING

The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1

Effective Thermal Conductivity of High Temperature Insulations for Reusable Launch Vehicles

SECTION 1 - WHAT IS A BTU METER? BTU's = Flow x ΔT Any ISTEC BTU Meter System consists of the following main components:

Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped

MCS 7 Chia Laguna, Cagliari, Sardinia, Italy, September 11-15, 2011

MECHANICS OF MATERIALS. Prepared by Engr. John Paul Timola

Circle one: School of Mechanical Engineering Purdue University ME315 Heat and Mass Transfer. Exam #1. February 20, 2014

High Tech High Top Hat Technicians. An Introduction to Solid Mechanics. Is that supposed to bend there?

Radiant Heating Panel Thermal Analysis. Prepared by Tim Fleury Harvard Thermal, Inc. October 7, 2003

A New Dielectrophoretic Coating Process for Depositing Thin Uniform Coatings on Films and Fibrous Surfaces

Attempt ALL QUESTIONS IN SECTION A and ANY TWO QUESTIONS IN SECTION B Graph paper will be provided.

Tflex HD700 Thermal Reliability Report

University of Colorado at Boulder

THERMAL EXPANSION PRACTICE PROBLEMS

CPO Science Foundations of Physics. Unit 8, Chapter 27

Types of Forces. Pressure Buoyant Force Friction Normal Force

Study of Effect of Fin Geometry on Rate of Heat transfer for a 150cc, 4-stroke IC Engine

Failure analysis of serial pinned joints in composite materials

Thermal Management In Microelectronic Circuits

3.0 FINITE ELEMENT MODEL

A Study of Friction Behavior in Ultrasonic Welding (Consolidation) of Aluminum

Thermal Contact Conductance at Low Contact Pressures

Phys2120 Spring 2017 Practice Exam 1. Chapters Name

TEST METHOD FOR DETERMINING BREAKAWAY FORCE OF A MAGNET

Coefficient of Friction

Kapitza resistance and thermal conductivity of Mylar at superfluid helium temperature

Investigation of Compliant Layer in SuperGLAST CTE Mismatch Problem

Thermal Characterization of Packaged RFIC, Modeled vs. Measured Junction to Ambient Thermal Resistance

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4

UNIVERSITY PHYSICS I. Professor Meade Brooks, Collin College. Chapter 12: STATIC EQUILIBRIUM AND ELASTICITY

DESIGN AND APPLICATION

EXPERIMENT ET: ENERGY TRANSFORMATION & SPECIFIC HEAT

Imaging Methods: Scanning Force Microscopy (SFM / AFM)

ENSC 388. Assignment #8

Lecture 9 Thermal Analysis

The Development of a High-Temperature PRT Calibration Process Based On Dry- Block Calibrators

The Characterization of Thermal Interface Materials using Thermal Conductivity for Within Sample and Batch to Batch Variation Analysis

Name Date Time to Complete

NTC Thermistor:TTF Type

Chapter 3: Steady Heat Conduction. Dr Ali Jawarneh Department of Mechanical Engineering Hashemite University

Module 3 - Thermodynamics. Thermodynamics. Measuring Temperatures. Temperature and Thermal Equilibrium

Keep Your Own Weather Journal Every meteorologist needs to keep a good weather journal. Remember, good observations make good forecasts.

Heat Dissipation Design

Thin Wafer Handling Challenges and Emerging Solutions

Blower Motor 3P Connector

THE ECONOMICS OF DIE ATTACH VOIDING IN LED ASSEMBLIES

3. LED THERMAL. a) b) 3.1. Introduction Heat transfer introduction LED ACADEMY/LED THERMAL

Name : Applied Physics II Exam One Winter Multiple Choice ( 7 Points ):

Data sheet FIXED CHIP RESISTORS; RECTANGULAR TYPE & WIDE TERMINATION. AEC-Q200 qualified. RoHS COMPLIANCE ITEM Halogen and Antimony Free

Senior Design Group May14-03

Development of cryogenic silicon detectors for the TOTEM Roman pots

Automatic Level Maintenance Manual SAL-XX W/ AIR DAMPENED COMPENSATOR

Home-built Apparatus for Measuring Thermal Conductivity of Glass and Polymer Materials

Experimental investigation on up-flow boiling of R1234yf in aluminum multi-port extruded tubes

Component & Board Level Cooling.

VACUUM SUPPORT FOR A LARGE INTERFEROMETRIC REFERENCE SURFACE

PROPRIETARY. VXS 6U Chassis. Thermal Analysis Report. Prepared for: NASA Langley. Prepared By: Richard Regan, NOVA Integration

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

Supporting Information. Interfacial Shear Strength of Multilayer Graphene Oxide Films

Handout 10: Heat and heat transfer. Heat capacity

Solar Thermal Power System for Oxygen Production from Lunar Regolith

PHYS 272 Fall 2010 Thursday, December 16, 2010

Solar Energy Cooking with the Sun

Experiment EF Electrostatic Force

Chapter 23: Magnetic Flux and Faraday s Law of Induction

EHP-AX08EL/UB01H-P01/B7B8/F3

Transcription:

To appear in the Proceedings of Space Technology & Applications Forum (STAIF-99), Jan 31 Feb 4, 1999 in Albuquerque, NM Enhanced Thermal Conductance of ORU Radiant Fin Thermal Interface using Carbon Brush Materials Christopher L. Seaman, Brett M. Ellman, and Timothy R. Knowles Energy Science Laboratories Inc., 6888 Nancy Ridge Dr., San Diego, CA 92121-2232, (619) 552-239 Abstract. ESLI has developed a highly compliant carbon brush thermal interface with good conductive heat transfer during a Phase 2 SBIR contract with NASA JSC. This lightweight brush can be retrofitted to the radiant fin thermal interface (RFTI), baselined as the interface for the International Space Station (ISS) Orbital Replaceable Units (ORU s), without changing the fin structure. Radiant heat transfer is thereby augmented by conductive heat transfer, dramatically increasing total thermal conductance of the interface. ESLI is now addressing critical issues concerning its actual use on the ISS in a Phase 3 program. These issues include carbon fiber debris, mechanical and thermal integrity, mechanical insertion and removal forces, and optimization for best thermal performance. Results thus far are encouraging. In this paper, thermal conductance and insertion/extraction force measurements on prototype specimens are presented. INTRODUCTION Space station batteries and other electronic components must be easily replaceable due to finite lifetimes. These components are packaged as orbital replaceable units (ORU s), replaceable by the crew or through the use of robotics. ORU s generally require thermal contact with the ISS thermal control system in order to maintain component temperatures within required limits. The radiant fin thermal interface (RFTI) has been selected as the ORU thermal interface on the ISS because it is lightweight, separates easily, and avoids the possibility of cold welding in the vacuum of space. The RFTI, developed at Rocketdyne and thermally tested by Peterson and Fletcher (199), consists of two finned aluminum plates (FAP), which intermesh to exchange heat radiatively. One is mounted on the ISS thermal control system. The mating FAP is mounted on the heat-dissipating ORU. The fins on each plate are 3-mil (.76 mm) thick, stand 2 (5.8 mm) high, and are spaced.25 (6.35 mm) apart. A highemissivity coating enhances radiation exchange. The vacuum thermal conductance between the intermeshed FAP s at normal operating temperatures is low, h ~ 7 W/m 2 K, (Peterson and Fletcher, 199), leading to a large temperature difference ( T ~ 2 K) across the interface during normal operation. This gradient can be substantially reduced by modest conduction between the fins. A lower T would result in lower operating temperatures and longer component lifetimes. Alternatively, smaller area radiators, with corresponding weight savings, could be used. ESLI has engaged in an SBIR program with NASA JSC to develop novel thermal interface materials that are lightweight, compliant, and demonstrate high thermal conductance even for non-flat surfaces. Presently, materials are being evaluated and qualified for use on the ISS under a Phase 3 contract. A rugged, highly compliant brush interface with medium thermal conductance is being tailored for the ISS ORU interface, where the highest conduction materials are not necessary. ESLI s approach is to enhance the RFTI thermal conductance by filling the void between mating fins with a compliant carbon brush to facilitate heat transfer by conduction. Measurements of thermal conductance h on prototype carbon brush enhanced RFTI s yield vacuum h values that approach the maximum possible (~ 66 W/m 2 K) with current RFTI architecture. By changing the RFTI geometry, e.g. using shorter, thicker Al fins, substantially higher h values could be attained while at the same time reducing fabrication costs.

FIGURE 1. ESLI carbon fiber brush with vinyl backing. BRUSH FIN THERMAL INTERFACE (BFTI) The carbon brush thermal interface consists of numerous PAN carbon fibers (7-µm diameter) oriented perpendicular to the substrate, attached by an adhesive, as shown in Fig. 1. The brush is retrofitted to one of the finned aluminum plates by attaching it to the inside surfaces of the fins with adhesive. The brush interface is lightweight, adding only ~ 3 kg/m 2 to the finned aluminum plates, which is 6 % of the mass of the RFTI (Stobb and Limardo, 1992). This brush-enhanced FAP is then intermeshed with the mating FAP by sliding them together, forming what we refer to as a brush fin thermal interface (BFTI). A certain amount of force is required to intermesh because of sliding friction between the fibers and the FAP surface. The fibers must be long enough to span the 2.4-mm distance between intermeshed FAP s, thereby allowing conduction of heat through the carbon fibers. The springy fibers keep the fins of the mating FAP in the center of the gap. A photo of a sample interface, partially intermeshed, is shown in Fig. 2. FIGURE 2. Small sample brush fin thermal interface (BFTI), consisting of a partially intermeshed FAP pair, one of which has brush attached. The Al fins on each FAP are spaced.25 (6.35 mm) apart; each fin has dimensions.3 (.76 mm) thickness x 1 (25.4 mm) width x 2 (5.8 mm) length extension from the plate. 2

2 T (K) 1 2 6 1 BRUSH THERMAL CONDUCTANCE, h brush (W/m 2 K) FIGURE 3. Temperature difference in degrees Kelvin (Celsius) across the BFTI as a function of brush thermal conductance between adjacent fins, h brush in W/m 2 K. The solid line represents the theoretical analytical solution of the heat flow model described in the text. The dashed line represents the asymptotic limit of 2 K as h brush. THEORETICAL MODEL We have found an analytical solution for a model of the BFTI thermal conductance h BFTI in terms of the thermal conductance h brush of the carbon brush itself between adjacent fins of the intermeshed BFTI. The model assumes anisotropic thermal conductance of the brush with zero conductance in the direction perpendicular to the fibers, and total conductance h brush (including contact conductance) in the direction parallel to the fibers. The solution is: sinhφ h = n h κt, hbrush BFTI brush φ = L, (1) coshφ + φ sinhφ κt where n is the number of fins per length, κ is the fin thermal conductivity, t is the fin thickness, and L is the fin length. Shown in Fig. 3 is a plot of the temperature difference T between baseplates of the FAP s, calculated as T = q/h BFTI and assuming a heat flux density of q = 14 W/m 2. For a perfectly conducting brush (h brush ), T = 2 K, which is essentially limited by the 24% fill fraction of the Al fins (κ = 15 W/mK) in the 5.8-mm gap between the baseplates. For radiant heat transfer between the fins without the carbon brush enhancement, T = 2 K, using the measured value h BFTI = 7 W/m 2 K (Peterson and Fletcher, 199). As demonstrated below, a carbon brush with only modest conductance, e.g. h brush = 8 W/m 2 K, results in T = 3.7 K. Such a brush interface improves conductance by a factor of ~ 5, approaching the 2 K limit for T, and resulting in a significant 16 K lower temperature of the heat-dissipating ORU and attached components. TABLE 1. Properties of PAN carbon fibers used for brush interface samples. Values were taken from manufacturers specifications. Fiber Property Low-κ PAN High-κ PAN Diameter, D (µm) 7.4 6.4 Thermal Conductivity, κ (W/mK) 2 267 Tensile Modulus, E (GPa) 227 436 3

TABLE 2. Sample configurations used in testing. Sample 1 Sample 2 Sample 3 Sample 4 Fiber type Low-κ PAN Low- κ PAN Low- κ PAN High- κ PAN Fiber length, L (mm) 2.3 2.5 2.8 2.5 Packing density, φ (%) 1. 1.2 1.1 1.4 EXPERIMENT Sample Fabrication Figure 2 shows the geometry of the BFTI samples made. The fins and plate are made of 661-T6 Al alloy. The fins are.3 (.76 mm) thick x 1. (25.4 mm) wide x 2.25 (57.2 mm) long. They are bonded into 6.4-mm slots machined into the 12.7-mm thick Al base plate with thermally conductive Stycast epoxy such that they extend 2. (5.8 mm) from the plate. The mating FAP s consist of 3 and 4 fins, respectively. The carbon brush material was fabricated at ESLI by electroflocking precision-cut (typically within ±5 µm) carbon fibers into an appropriate adhesive sprayed onto a release liner. After curing, the resulting brush was retrofit to the 4-finned aluminum plate. Two types of commercial PAN carbon fibers were used, one with low thermal conductivity (κ ~ 2 W/mK) and one with higher thermal conductivity (κ ~26 W/mK). In general, higher-κ carbon fibers have a higher modulus and break more easily than lower-κ fibers. Thus, the optimum configuration will be a compromise between the best thermal and mechanical properties. Fiber properties are listed in Table 1. Several sample configurations were made, as summarized in Table 2. The space between evenly spaced, intermeshed fins is.95 (2.41 mm). The fibers of Sample 1, which are 2.3-mm long with ~.1.2 mm adhesive bondline, barely contact the opposing fins. However, this sample was expected to require a minimum amount of force to intermesh. Longer fibers were chosen for the other samples in order to investigate how the thermal conductance and insertion force vary with fiber length. Thermal Conductance The thermal conductance of the fully intermeshed samples was measured using a standard cut-bar steady-state conduction technique. Results were obtained in 1 atm air and in high vacuum (~3 x 1-6 torr = 4 x 1-4 Pa). Two 25.4 x 25.4 square 661 Al cut bars were used as heat flux meters, one above and one below the sample. The assembly was placed on a water-cooled cold plate that maintained the bottom of the assembly near room temperature. An etched-foil heater mounted at the top of the assembly produced a heat flux of 15.5 kw/m 2. Platinum resistance thermometers (RTD s) (1 mm diameter x 25 mm long) were inserted into small diameter holes drilled into the flux meters and in each of the FAP base plates. Thermal grease was used on the RTD s to ensure good thermal contact. The thermal conductance of the BFTI was determined as h BFTI = q/ T, where q is the heat flux (in W/m 2 ) measured by the flux meters and T is the temperature difference between the FAP base plates. A correction factor of 8/6 was used to account for the fact that the sample BFTI s have only 6 interfaces instead of 8 per inch for the actual ORU thermal interface. Measured values of h BFTI in air and in vacuum for Samples 1-4 are presented in Table 3. Also shown is T BFTI, calculated assuming an operating heat flux density of 14 W/m 2 ( T BFTI = q/h BFTI ), and h brush, derived from the analytical solution described above. Results for radiant heat exchange from measurements by Peterson and Fletcher (199) are also shown for comparison. It is clear that all 4 sample configurations provide a significant improvement over that of radiation alone. The value of h brush is the result of 3 thermal resistance contributions: 1/h brush = 1/h fibers + 1/h adh + 1/h tips, where h fibers = κφ/l is the bulk conductance of the fiber brush (values given in Tables 1 and 2), h adh is the conductance of the adhesive interface which bonds the fibers to the fins, and h tips is the interface conductance between the free fiber tips and the opposing fins. It is this last contribution which depends sensitively on the atmospheric conditions (air or TABLE 3. Thermal conductance results. Uncertainty is approx. ±1%. Sample 1 Sample 2 Sample 3 Sample 4 Radiant h BFTI (W/m 2 K) in air/vac 39/17 4/3 35/25 58/54 7 T BFTI (K) in air/vac 3.6/8.2 3.5/4.7 4./5.6 2.4/2.6 2 h brush (W/m 2 K) in air/vac 85/16 93/43 62/3 9/46 5 4

TABLE 4. Estimates of contributions to h brush. Sample 1 Sample 2 Sample 3 Sample 4 h brush (W/m 2 K) in vac 16 43 3 46 h fibers (W/m 2 K) 87 95 8 147 h adh (W/m 2 K) 26 26 26 26 h tips (W/m 2 K) in vac 2 ± 5 8 ± 3 5 ± 16 9 ± 2 vacuum). Rough estimates of the 3 contributions for the thermal vacuum measurements (summarized in Table 3) are given in Table 4. Uncertainty values given for h tips were calculated assuming h brush and h fiber uncertainties of 2%. It is seen that h tips is the largest barrier to heat conduction through the carbon brush thermal interface. The h tips contribution for Sample 1 may be particularly low because in this case the mean fiber length (2.3 ±.5 mm) plus adhesive bondline thickness (~.15 mm) barely exceeds the fin spacing (2.4 mm). Fibers that are shorter than the mean will not touch the opposing fins, leading to an insulating vacuum gap between fiber tip and fin. Virtually all fibers of Samples 2 4 should touch the opposing fins. Values of h tips for Samples 2 and 3 are the same within their uncertainties. Sample 4, which consists of higher-κ PAN fibers, shows a much higher value of h tips, about an order of magnitude. This is expected considering the formula for a circular spot contact resistance R c between two materials of thermal conductivities κ 1 and κ 2 : R c = F(a/b)/2aκ, (2) where a is the radius of the contact area, b is the dimension of the materials, which we take to be the fiber radius (~4 µm), F(a/b) is the constriction alleviation factor which approaches 1 for a<<b, and κ is the harmonic mean of the thermal conductivities κ = 2κ 1 κ 2 /(κ 1 +κ 2 ) (Madhusudana, 1996). The harmonic mean for the high-κ fibers against Al is 6 times higher than for low-κ fibers against Al. In addition, the higher-κ fibers are stiffer by a factor of 2, causing them to exert about twice as much pressure against the opposing Al fins as the softer lower-κ fibers. This higher pressure results in a higher average area of contact for each fiber (Madhusudana, 1996), and therefore a higher thermal contact conductance by about another factor of 2. 2 PRESSURE (kpa) -2-4 -6 1 2 3 4 5 PENETRATION (mm) FIGURE 4. Pressure required to insert and separate Sample 2 as a function of depth of penetration into mating finned interface. Data are shown for insertion to 13, 25, and 45 mm. 5

TABLE 5. Maximum pressure required to fully intermesh finned aluminum plates (5-mm penetration) against sliding frictional force, and to remove by backing straight out against fiber buckling resistance force. Sample 1 Sample 2 Sample 3 Sample 4 Max. Insertion pressure (kpa) 5 8 1 8 Max. Removal pressure (kpa) 3 6 45 5 Mechanical Properties The amount of pressure (force per BFTI area) needed to intermesh and separate the FAP sample pairs was measured using an Instron materials testing machine. Shown in Figure 4 is pressure as a function of the interpenetration distance as one FAP was inserted into the other and then removed, at a rate of ~.8 mm/s. Shown are data for Sample 2 for three different penetration depths: 13, 25, and 45 mm. The pressure initially increases rapidly from to 1.4 kpa within the first.5 mm as the fibers resist bending until the opposing fins penetrate and start sliding. After that, the pressure increases linearly with penetration depth with slope ~14 Pa/mm. In this case, the maximum pressure required to fully insert the two fins 5 mm is ~8.3 kpa. As the fins are backed out, the pressure changes sign (since they are being pulled in the opposite direction) and rapidly increases in magnitude, reaching a peak value before decreasing and returning to the value expected for sliding. The resulting large, sharp peak is due to the pressure required to buckle the fibers in order to change the fiber bias direction. Notice that the pressure actually goes positive as the buckled fibers help push the FAP s apart before reaching their preferred bent shape when sliding past the fins being withdrawn. Fiber buckling can be easily avoided by shifting one of the FAP s in the perpendicular direction before pulling them apart. The shift need be only a fraction of the fiber length (~2.5 mm). In this way, the fibers always slide in the direction of motion. If this is not possible, then the maximum force required is that needed to overcome buckling in order to withdraw the pair. The peak buckling pressure in Fig. 4 is seen to increase approximately linearly with penetration depth with slope ~12 Pa/mm, which is ~8 times larger than for sliding. A fully inserted 5-mm long fin configuration would require ~6 kpa to remove them. Both the sliding and buckling forces are approximately proportional to the area of brush coverage and can therefore be reduced by applying the carbon brush on only a fraction of the fin area. Similar data were obtained for Samples 1, 3, and 4, with similar features. The main results are given in Table 5. 2 6 T (K) 16 12 8 4 5 4 3 2 1 Max Buckling Pressure (kpa) 1 2 3 4 5 DEPTH OF COVERAGE (mm) FIGURE 5. Temperature drop and maximum buckling pressure as a function of fin coverage for Sample 2. Temperature drop is for a heat flux of 1.4 kw/m 2. 6

2 15 3 1 T (K) 1 5 4 2 1 2 3 4 5 6 Maximum Buckling Pressure (kpa) FIGURE 6. Temperature gradient across the thermal interface for Samples 1-4, plotted as a function of maximum buckling pressure required to remove it. The implicit variable for each curve is the percent coverage of the fins with brush material. The right endpoint of each curve represents performance with full 5.8-mm coverage. The horizontal dashed line represents the lower limit ( T = 2 K) achieved by a perfectly conducting brush (h brush ). SUMMARY Figure 5 shows both T and maximum buckling pressure as a function of coverage for Sample 2. We see that there is a trade-off between obtaining low T and low buckling force. The optimum configuration can be chosen with the aid of Fig. 6 which shows T vs maximum buckling pressure, with coverage as an implicit parameter. The design engineer should first determine the maximum pressure that can be applied to install/remove the ORU. The approximate T can be read from Fig. 6, and will correspond to one (or more) of the brush configurations. ACKNOWLEDGMENTS We are grateful to John Oldson, Phong Liu, and Thomas Bier of ESLI for their technical assistance, and to John Cornwell of NASA JSC for helpful discussions. Work funded by NASA JSC under contracts NAS9-18844, NAS9-196, and NAS9-9711. REFERENCES Madhusudana, Thermal Contact Conductance, Springer, New York, 1996. Peterson, G. P. and Fletcher, L. S., Determination of the Thermal Contact Conductance and Adhesion Characteristics of Coldplate Thermal Test Pads, P.O. R97PLA-8927182, Test Report to Rocketdyne Div. of Rockwell Int. Corp., April 6, 199. Stobb, C. A. and Limardo, J. G., Overall Contact Conductance of a Prototype Parallel Fin Thermal Interface, AIAA-92-2846, 1992. 7