LEDTECH ELECTRONICS CORP NANYA ROAD,MUGANG ZHAOQING CITY GUANGDONG CHINA TEL:86-758-2875541,2870651,2877464,2876185,2877017 FAX:86-758-2878014 Http://wwwledtechcomtw SPECIFICATION PART NO : LN(M)5673-11-M1 EWRN 056"(1422mm) THREE DIGIT Approved by Checked by Prepared by Tung Andy CJ
056" THREE DIGIT Dimensions 127 127 8 80 05 DIA 13 1422 190 1524 813 168 DIA 377 MARK 50±05 254 5=127 DIGIT 1 DIGIT 2 DIGIT 3 Notes: 1 The slope angle of any PIN may be ±50 Max 2 All dimensions are in mm, tolerance is ±025mm unless otherwise noted Internal Circuit Diagram LN5673-11-M1 PIN 12 PIN 9 DIGIT 1 DIGIT 2 A B C D E F GDP A B C D E F GDP PIN 8 DIGIT 3 A B C D E F GDP PIN 11 7 4 2 1 10 5 3 PIN 6 : NO CONNECTION LM5673-11-M1 DIGIT 1 DIGIT 2 DIGIT 3 A B C D E F GDP A B C D E F GDP PIN 12 PIN 9 PIN 8 A B C D E F GDP PIN 11 7 4 2 1 10 5 3 PIN 6 : NO CONNECTION VER: 01 Date: 2008/6/20 Page: 1/5
056" THREE DIGIT Description Part No LED Chip Face Color Material Emitting Color Surface Segments LN5673-11-M1 EWRN AlGaAs/GaAs Super Red Grey White LM5673-11-M1 EWRN AlGaAs/GaAs Super Red Grey White Absolute Maximum Ratings at Ta=25 Parameter Symbol Rating Unit Power Dissipation Per Segment PD 66 mw Pulse Current(1/10Duty Cycle,01ms Pulse Width) Per Chip IFP 100 ma Forward Current Per Chip IF 30 ma Reverse (Leakage)Current Per Chip Ir 100 ua Reverse Voltage Per Chip VR 4 V Operating Temperature Range Topr -25 to +85 Storage Temperature Range Tstg -40 to +100 Soldering Temperature Tsol Dip Soldering: 260 for 5 sec Hand Soldering: 350 for 3 sec VER: 01 Date: 2008/6/20 Page: 2/5
056" THREE DIGIT Electrical and Optical Characteristics: Parameter Symbol Condition Min Typ Max Unit Luminous Intensity Per Segment IV If=10mA/seg 37 77 mcd Forward Voltage Vf If=20mA/seg 18 22 V Peak Wavelength λp If=20mA/seg 660 nm Dominant Wavelength λd If=20mA/seg 643 nm Reverse Current Per Chip (Leakage Current Per Chip) Ir Vr=4V 100 µa Spectrum Line Halfwidth λ If=20mA/seg 30 nm Response Time T ----------- 250 ns Note: Customer s special requirements are also welcome VER: 01 Date: 2008/6/20 Page: 3/5
056" THREE DIGIT Typical Electrical/Optical Characteristic Curves (25 Ambient Temperature Unless Otherwise Noted) Relative Intensity 10 05 Ratio of Maximum Operating Peak Current to Temperature Derated DC Current 100 10 OPERATION IN THIS REGION REOUIRES TEMPERATURE DERATING OF IDC MAXIMUM 600 640 680 720 Wavelength (nm) Fig1 RELATIVE INTENSITY VS WAVELENGTH IF PEAK IDC MAX 1 1 10KHZ 3KHZ 1KHZ 10 100 1000 tp - Pulse Duration - s Fig2 MAXIMUM TOLERABLE PEAK CURRENT VS PULSE DURATION 300HZ 100HZ 10000 50 50 Forward Current IF(mA) 40 30 20 10 Forward Current IF(mA) 40 30 20 10 14 16 18 20 22 24 Forward Voltage VF(V) Fig 3 FORWARD CURRENT VS FORWARD VOLTAGE PER CHIP 0 20 40 60 80 100 Ambient Temperature Ta ( C) Fig4 FORWARD CURRENT VS DERATING CURVE 15 Relative Luminous Intensity Normalized at 10mA 12 9 6 3 0 10 20 30 40 Forward Current (ma) Fig5 RELATIVE LUMINOUS INTENSITY VS FORWARD CURRENT Relative Luminous Intensity 20 10 05 02 01-30 -20-10 0 10 20 30 Ambient Temperature Ta ( C) Fig6 LUMINOUS INTENSITY VS AMBIENT TEMPERATURE 40 50 60 70 VER: 01 Date: 2008/6/20 Page: 4/5
056" THREE DIGIT Precautions in Use: PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY 1 Do not bend the lead Bending leads could cause breakage of leads or the degradation of the chip When bending is unavoidable, strictly follow the cautionary instruction below (1)Bend the leads before soldering (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part (3) The lead bending point must be more than 16mm away from the edge or the resin part (4)When a pin is tested for its endurance, bending degree should be repeated no more than two times 2 Setting a product by using tool such as a holder should be avoided When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc 3 The hole pitch of a circuit board must fit into the lead pitch of products 4 When soldering, care the followings: (1)Do not heat a product under any stress (ie: twist) to leads (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part (3)The temperature of a product should not exceed the specified maximum storage temperature (4)Soldering with PC Board should be conducted with following conditions (a) For dip soldering Pre-heating : 90 Max for within 60 Sec Soldering Max : 260 5 (Solder Temp) for within 5 Sec (b) Soldering iron : 350 (Soldering iron tip) for within 3 Sec 5 Flux could corrode the leadsuse flux that contains as little chlorine as possible (RA, RMA, less than 02 wt%) and need not be washed way When, however, washing is necessary, partially wash around the leads, instead of the entire LED, by the following conditions Cleaning agent : Methyl Alcohol Max Cleaning time : 30Sec Max 6 Minimum amount of soldering flux should be used Soldering flux should be applied only to the pin portion 7 The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product VER: 01 Date: 2008/6/20 Page: 5/5