ELEC516 Digital VLSI System Design and Design Automation (spring, 2010) Assignment 4 Reference solution

Similar documents
! Memory. " RAM Memory. ! Cell size accounts for most of memory array size. ! 6T SRAM Cell. " Used in most commercial chips

EE141-Fall 2011 Digital Integrated Circuits

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

! Charge Leakage/Charge Sharing. " Domino Logic Design Considerations. ! Logic Comparisons. ! Memory. " Classification. " ROM Memories.

Digital Integrated Circuits A Design Perspective

Semiconductor Memories

Clock Strategy. VLSI System Design NCKUEE-KJLEE

EE115C Digital Electronic Circuits Homework #4

Power Dissipation. Where Does Power Go in CMOS?

EE241 - Spring 2000 Advanced Digital Integrated Circuits. References

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

A novel Capacitor Array based Digital to Analog Converter

Topics. Dynamic CMOS Sequential Design Memory and Control. John A. Chandy Dept. of Electrical and Computer Engineering University of Connecticut

Chapter 8. Low-Power VLSI Design Methodology

Semiconductor memories

Lecture 25. Semiconductor Memories. Issues in Memory

Digital Integrated Circuits A Design Perspective. Semiconductor. Memories. Memories

Name: Answers. Mean: 83, Standard Deviation: 12 Q1 Q2 Q3 Q4 Q5 Q6 Total. ESE370 Fall 2015

EE241 - Spring 2001 Advanced Digital Integrated Circuits

EE241 - Spring 2000 Advanced Digital Integrated Circuits. Announcements

GMU, ECE 680 Physical VLSI Design 1

CPE100: Digital Logic Design I

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

SEMICONDUCTOR MEMORIES

EE141Microelettronica. CMOS Logic

Pipelined multi step A/D converters

Semiconductor Memory Classification

Semiconductor Memories. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic Paolo Spirito

PAST EXAM PAPER & MEMO N3 ABOUT THE QUESTION PAPERS:

CMOS Digital Integrated Circuits Lec 13 Semiconductor Memories

EECS 312: Digital Integrated Circuits Final Exam Solutions 23 April 2009

Lecture 8-1. Low Power Design

Energy Delay Optimization

A Novel LUT Using Quaternary Logic

Fault Modeling. 李昆忠 Kuen-Jong Lee. Dept. of Electrical Engineering National Cheng-Kung University Tainan, Taiwan. VLSI Testing Class

Next, we check the race condition to see if the circuit will work properly. Note that the minimum logic delay is a single sum.

9/18/2008 GMU, ECE 680 Physical VLSI Design

CMPEN 411 VLSI Digital Circuits Spring 2012 Lecture 17: Dynamic Sequential Circuits And Timing Issues

ECE 407 Computer Aided Design for Electronic Systems. Simulation. Instructor: Maria K. Michael. Overview

Adders, subtractors comparators, multipliers and other ALU elements

CS 152 Computer Architecture and Engineering

Vectorized 128-bit Input FP16/FP32/ FP64 Floating-Point Multiplier

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components

Low Latency Architectures of a Comparator for Binary Signed Digits in a 28-nm CMOS Technology

ECE520 VLSI Design. Lecture 23: SRAM & DRAM Memories. Payman Zarkesh-Ha

University of Toronto. Final Exam

MODULE 5 Chapter 7. Clocked Storage Elements

CMPEN 411 VLSI Digital Circuits Spring Lecture 14: Designing for Low Power

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Total Power. Energy and Power Optimization. Worksheet Problem 1

EE247 Lecture 16. Serial Charge Redistribution DAC

LOGIC CIRCUITS. Basic Experiment and Design of Electronics. Ho Kyung Kim, Ph.D.

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University

Digital Integrated Circuits A Design Perspective

Chapter 5. Digital Design and Computer Architecture, 2 nd Edition. David Money Harris and Sarah L. Harris. Chapter 5 <1>

Lecture 9: Sequential Logic Circuits. Reading: CH 7

CMSC 313 Lecture 25 Registers Memory Organization DRAM

Design for Manufacturability and Power Estimation. Physical issues verification (DSM)

Very Large Scale Integration (VLSI)

Nyquist-Rate A/D Converters

Chapter 5 CMOS Logic Gate Design

Lecture 9: Clocking, Clock Skew, Clock Jitter, Clock Distribution and some FM

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

COMP 103. Lecture 16. Dynamic Logic

University of California at Berkeley College of Engineering Department of Electrical Engineering and Computer Sciences

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

Semiconductor Memories

Performance, Power & Energy. ELEC8106/ELEC6102 Spring 2010 Hayden Kwok-Hay So

Chapter 7. Sequential Circuits Registers, Counters, RAM

GMU, ECE 680 Physical VLSI Design 1

Lecture 7 Circuit Delay, Area and Power

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp

Timing Issues. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolić. January 2003

Testability. Shaahin Hessabi. Sharif University of Technology. Adapted from the presentation prepared by book authors.

9. Datapath Design. Jacob Abraham. Department of Electrical and Computer Engineering The University of Texas at Austin VLSI Design Fall 2017

NTE74HC165 Integrated Circuit TTL High Speed CMOS, 8 Bit Parallel In/Serial Out Shift Register

Nyquist-Rate D/A Converters. D/A Converter Basics.

A Mathematical Solution to. by Utilizing Soft Edge Flip Flops

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ECE251. VLSI System Design

Magnetic core memory (1951) cm 2 ( bit)

MTJ-Based Nonvolatile Logic-in-Memory Architecture and Its Application

LH5P8128. CMOS 1M (128K 8) Pseudo-Static RAM PIN CONNECTIONS

CMPEN 411 VLSI Digital Circuits Spring Lecture 19: Adder Design

ECE 3060 VLSI and Advanced Digital Design. Testing

EECS 141: FALL 05 MIDTERM 1

Where Does Power Go in CMOS?

School of EECS Seoul National University

EE241 - Spring 2003 Advanced Digital Integrated Circuits

Lab 3 Revisited. Zener diodes IAP 2008 Lecture 4 1

MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Sciences

9/18/2008 GMU, ECE 680 Physical VLSI Design

GMU, ECE 680 Physical VLSI Design

Design of Sequential Circuits

NTE74HC173 Integrated Circuit TTL High Speed CMOS, 4 Bit D Type Flip Flop with 3 State Outputs

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Midterm. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. Pass Transistor Logic. Restore Output.

Adders, subtractors comparators, multipliers and other ALU elements

Integrated Circuits & Systems

Transcription:

ELEC516 Digital VLSI System Design and Design Automation (spring, 010) Assignment 4 Reference solution 1) Pulse-plate 1T DRAM cell a) Timing diagrams for nodes and Y when writing 0 and 1 Timing diagram of pulse-plate 1T DRAM cell Vdd WL PL Vdd Y Write 0 Vdd-Vth Write 1 (vdd) Write 0 (0) Initial store 1 in Ccell Vdd-Vth Vdd-Vth Y Vdd-Vth Write 1 Initial store 0 in Ccell b) From figures in (a), to store 0 in this DRAM cell, voltage of node Y is 0;while writing 1, this voltage changes to V dd V th. The voltage difference between 1 and 0 state increases by ( V V ) compared with normal 1T-DRAM architecture. The dd th profit brought by larger voltage difference includes better noise tolerance, easier design for sense amplifier and smaller leakage etc.

c) is pre-discharged to 0 in read operation. When reading 0, since voltage on node Y is zero initially, after asserting WL for read operation V = 0. When reading 1, from charge sharing equation, we ve: ( V V V ) C + 0 C = C V + ( V V ) C dd t dd cell dd cell ( Vdd Vth) Ccell V = Ccell + C d) From equation in c), we can have: ΔV 50mV C > 13.89 ff ) DRAM with divided bit-line structure a) C is contributed by dummy and DRAM cells as well as the input capacitance of sense amplifier (considering the pre-charge transistor also): Cbit = 56 8 ff + 50 ff + 8 ff =.114 pf (note: if ignoring the pre-charge transistor, Cbit = 56 8 ff + 50 ff + 8 ff =.106 pf) b) Timing diagram is as follows: cell

Normally, C is adopted to be close to C, since we want to V d bit pre ( V V ) C = C + C dd th bit d bit close to V dd. c) From charge balance equations, for each side of sense amplifier: C V + C V = ( C + C ) ( V +Δ V) pre c store c pre Cc ( Vstore Vpre) Δ V = C + C To read 0, V store _0 = 0 ; to read 1, Vstore _1 = Vdd Vth ; 1 1 In ideal, we want to Δ Vstore _0 =Δ Vstore _1; Vpre = ( Vstore _1 Vstore _0) = ( Vdd V th) The voltage difference seen by sense amplifier thus can be represented as: 1 Cc 1 Cc Vdd V Vpre = ( Vdd Vth ) 60mV C + C C + C C c 51.98 ff c c 3) Column Decoder design Consider implementing the design using a hybrid way: (Assume pre-decode x bits) x 4 4 x N = N + N + N = ( x+ 1) + + ( 1) ; dec pre pass tree Since the number of serial pass transistors are restricted to 3. thus x can be,3,4; x= Ndec = 46 x= 3 Ndec = 50 x= 4 N = 96 Thus, the most efficient implementation is pre-decoding bits: The reference schematic is as follows: dec c Pre-decoder

4) MSE Processing Element design a) two s complement subtraction on 8bit data: sign Xin Yin 8-bit adder Zout 1 b) One possible design can be as follows: Delay: D = d + d + d + d + d = ns inv 8 bit _ adder inv EX OR 1 bit _ adder 7.6

According to timing requirement: T T + D+ T = 0.3+ 7.6 + 0.1 = 8ns This corresponds to 15MHz. clk Q setup c) PM = SC V f d) For pipelining case, since we reduce the critical path, the maximum clock frequency can be increased. On the other hand, if we maintain the same clock frequency which corresponds to a fixed performance requirement. We can reduce the supply voltage to still meet the delay requirement. From c), by reducing supply voltage, power reduction can be obtained. For parallel case, although SC increases due to duplicating some hardware in the design. The throughput also increases. For the fixed performance requirement, we can reduce clock frequency and supply voltage. From c), we can observe P decreases. e) For design in b), we have : P = ( C + 9 C + 8 C + C + 39 C ) V f M 8 bit _ adder inv xor 1 bit _ adder reg 15 6 PM = (100 + 180 + 40 + 000 + 1560) 10 5 15 10 = 16.mW M f) The new design is supposed to be as follows: Pipeline stage added here sign Xin Yin 8-bit adder 4bit 0 1 bit adder C 1 8 XoR array A Delay in stage one is: D1 = tinv + t8 bit _ adder + tinv + txor = 0.4 +.8 + 0.4 = 3.6ns Delay in stage two is: D = t1 _ = 4ns bit adder Maximum clock frequency is : Tclk max( D1, D) + tsetup + tck q = 4.4ns If we still want to run in 15MHz, the new voltage is : Vnew 4.4ns = Vnew =.75V 5V 8ns

The new power consumption thus can be formulated: P = SC V f = ( SC + 0 C ) V M _ new new new old reg new + = (5180 800).75 15 5.65 mw f 5) Design for testability a) Test vector (X,X,0,0,0) b) The stuck-at-1 fault of node y can also be found by same vector 6) Low Power design a) For transition based encoding, (Assume initial state is 0000000000) Data vector Transition based code 0000100100 0000100100 ( transitions) 1110101011 1110001111 (7 transitions) 0110010100 1000111111 (4 transitions) 0110100100 0000110000 (5 transitions) 0111010100 0001110000 (1 transitions) 1000101001 1111111101 (6 transitions) 0101000100 1101101101 ( transitions) 1010011000 1111011100 (4 transitions) 1010010000 0000001000 (6 transitions) Total number of transitions are : 37 1 1 37 1 1 18.5 E = CV SW = pf V = pj b) For active high coding: Total number of transitions are : 45 1 1 E = CV SW = 45 1pf 1V =.5 pj c) For redundant coding:

Data vector Redundant code Inv bit 0000100100 0000100100 0 ( transitions) 1110101011 0001010100 1 (4 transitions) 0110010100 0110010100 0 (4 transitions) 0110100100 0110100100 0 ( transitions) 0111010100 0111010100 0 (3 transitions) 1000101001 0111010110 1 ( transitions) 0101000100 0101000100 0 (4 transitions) 1010011000 0101100111 1 (4 transitions) 1010010000 0101101111 1 (1 transitions) Total number of transitions : 6 ; 1 1 E = CV SW = 6 1pf 1V = 13pJ ; 4.% energy saving can be obtained (block diagram of encoder and decoder)