DATA SHEET DEVICE NUMBER: SHEET 1 2 3 4 5 6 7 CONTENTS DATE 26.11.15 1. 1. 1. 1. 1. 1. 1. Original Released 佰鴻工業股份有限公司 台北縣板橋市和平路 19 號 3 樓 3F., No. 19, Ho Ping Road, Pan Chiao City, Taipei, Taiwan, R. O. C. Tel: 886-2-295919 Fax: 886-2-295476/2955889 www.brtled.com. APPROVED 唐 26.11.15 小峰 DRAWER 孫 26.11.15 秀梅
Features: 1. Emitted Color : Super Blue Package Dimensions: 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 1.6x.8x.6mm(63) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn t contain restriction Substance, comply ROHS standard. Applications: 1. Automotive: Dashboards, stop lamps, turn signals. 2. Backlighting: LCDs, Key pads advertising. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±.1mm (.4 ) unless otherwise specified. 3.Specifications are subject to change without notice. 3. Status indicators: Comsumer & industrial electronics. 4. General use. Absolute Maximum Ratings(Ta=25 ) Parameter Symbol Rating Unit Power Dissipation Pd 12 mw Forward Current I F 3 ma Peak Forward Current *1 I FP 1 ma Reverse Volage V R 5 V Operating Topr -25 ~8 - Storage Tstg -3 ~85 - Soldering Tsol See Page 6 - *1 Condition for IFp is pulse of 1/1 duty and.1msec width. Ver.1. Page 1 of 7
Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf I F =5mA - 2.8 3.2 V Luminous Intensity Iv I F =5mA 8.2 2 - mcd Reverse Current I R V R =5V - - 1 µa Peak Wave Length λp I F =5mA - 47 - nm Dominant Wave Length λd I F =5mA 47-475 nm Spectral Line Half-width Δλ I F =5mA - 3 - nm Veiwing Angle 2θ 1/2 I F =5mA - 12 - deg Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength Fig.2 Forward current derating curve vs. ambient temperature 1. 6 5 Relative radiant intensity.5 4 3 2 1 42 47 52 2 4 6 8 1 Wavelength (nm) Ambient temperature Ta( C) 5 Fig.3 Forward current vs. forward voltage 3. Fig.4 Relative luminous intensity vs. ambient temperature 4 2.5 Forward current (ma) 3 2 1 Relative luminous intensity (Normalized @ 2mA) 2. 1.5 1..5 1 2 3 4 5-4 -2 2 4 6 Forward voltage(v) Ambient A temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current 2. Fig.6 Radiation diagram 1 2 3 Relative luminous intensity (@2mA) 1.5 1..5 1 2 3 4 5 RELATIVE RADIANT INTENSITY 1..9.8.7.5.3.1.2.4.6 4 5 6 7 8 9 Forward current (ma) Ver.1. Page 2 of 7
Tapping and packaging specifications(units: mm) Package Method(unit: mm)vacuum 12 bag/box 3 pcs/reel Bar Code Label 2 245 22 22 Aluminum Foil Bag 185 645 6 box/carton 21 47 Ver.1. Page 3 of 7
Bin Limits Intensity Bin Limits (At 5mA) BIN CODE Min. (mcd) Max. (mcd) J 8.2 12.3 K 12.3 18.5 L 18.5 28. M 28. 42. Tolerance for each Bin limit is ±15%. Color Bin Limits (At 5mA) BIN CODE Min. (nm) Max. (nm) 5 47 475 Tolerance for each Bin limit is ±1nm. V F Bin Limits (At 5mA) BIN CODE Min.(v) Max.(v) E 2.4 2.6 F 2.6 2.8 G 2.8 3. H 3. 3.2 Tolerance for each Bin limit is ±.5V. BIN: x x x V F BIN CODE Color BIN CODE Intensity BIN CODE Ver.1. Page 4 of 7
Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-75:126 MIL-STD-883:15 Connect with a power If=2mA Ta=Under room temperature /2 JIS-C-721 :B-1 Test time=1,hrs High Ta=+65 ±5 MIL-STD-22:13B RH=9%-95% High Humidity JIS-C-721 :B-11 Test time=24hrs /2 Storage Endurance Test Environmental Test High Storage Low Storage Cycling MIL-STD-883:18 JIS-C-721 :B-1 JIS-C-721 :B-12 MIL-STD-22:17D MIL-STD-75:151 MIL-STD-883:11 JIS-C-721 :A-4 Thermal Shock MIL-STD-22:17D MIL-STD-75:151 MIL-STD-883:111 Solder Resistance MIL-STD-22:21A MIL-STD-75:231 JIS-C-721 :A-1 High Ta=+85 ±5 Test time=1,hrs /2 Low Ta=-35 ±5 Test time=1,hrs /2-35 ~ +25 ~ +85 ~ +25 6min 2min 6min 2min Test Time=5cycle -35 ±5 ~+85 ±5 2min 2min Test Time=1cycle Preheating: 14-16,within 2 minutes. Operation heating: 26 (Max.), within 1seconds. (Max.) /2 /2 /2 Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage V F ( V) I F =2mA Over Ux1.2 Reverse current I R (ua) V R =5V Over Ux2 Luminous intensity Iv ( mcd ) I F =2mA Below SX.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1. Page 5 of 7
Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 3 (572 ) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 14 ~16 ±5,within 2 minutes. Operation heating : 26 (Max.) within 1 seconds.(max) Gradual Cooling (Avoid quenching). 1 SEC. MAX. 26 MAX. 14~16 4 /SEC. MAX. OVER 2 MIN. 4 /SEC. MAX. Time 3. DIP soldering (Wave Soldering) : Preheating : 12 ~15,within 12~18 sec. Operation heating : 245 ±5 within 5 sec.26 (Max) Gradual Cooling (Avoid quenching). Soldering heat Max. 26 12~15 Preheat 12~18 sec. 245 ±5 within 5 sec. Handling : Time Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1. Page 6 of 7
Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) : 5-3 (41 )Humidity : RH 6 % Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 3% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 6 ±3. Package and Label of Products: (1) Package: Products are packed in one bag of 3 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date Manufacture Location x xx xx xx Year Month Day Ver.1. Page 7 of 7