MULTILAYER CERAMIC CAPACITORS 1. INTRODUCTION MLCC Consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. Calchip GUQ series MLCC is used at high frequencies and generally have a small temperature coefficient of capacitance, typical within the +/-3ppm/C required for NPO (COG) classification and have excellent conductivity internal electrode. Thus, Calchip GUQ series MLCC will be with the feature of low EST and high Q characteristics. 2. FEATURES a. High Q and low ESR performance at high frequency. b. Ultra low capacitance to.. c. Can offer high precision tolerance to ±.5pF. d. Quality improvement of telephone calls for low power loss and better performance. 3. APPLICATIONS a. Telecommunication products & equipments: Mobile phone, WLAN, Base station. b. RF module: Power amplifier, VCO. c. Tuners. HOW TO ORDER GUQ 1 CG 11 J 25 N T SERIES SIZE DIELECTRIC CAPACITANCE TOLERANCE VOLTAGE TERMINATION PACKAGING GUQ=Ultra High Q & Low ESR 2=21 4=42 1=63 21=85 CG = NP (CG) Two significant digits followed b no. of zeros. An R is in place of decimal point. eg.: R5=.5pF 1R=1.pF 1=1pF A=±.5pF B=±. C=±.25pF D=±.5pF F=±1% G=±2% J=±5% Two significant digits followed by no. of zeros. And R is in place of decimal point. 25=25 VDC 5=5 VDC 1=1 VDC 25=25 VDC N=Cu/Ni/Sn T=7 T = 7" reeled TD = 13 reel
5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) T (mm)/symbol Remark M B (mm) L 21 (63).6±.3.3±.3.3±.3 L #.15±.5 T 42 (15) 1.±.5.5±.5.5±.5 N #.25+.5/-.1 W 63 (168) 1.6±.1.8±.1.8±.7 S.4±.15 M B M B 85 (212) 2.±.2 1.25±.2.85±.1 T.5±.2 # Reflow soldering only is recommended. Fig. 1 The outline of MLCC 6. GENERAL ELECTRICAL DATA Dielectric NP Size 21, 42, 63, 85 Capacitance* 21:. to 33pF; 42:. to 22pF; 63:.3pF to 47pF; 85:.3pF to 1pF Cap 5pF: A (±.5pF ), B (±.), C (±.25pF) Capacitance tolerance 5pF<Cap<1pF: B (±.), C (±.25pF), D (±.5pF) Cap 1pF: F (±1%), G (±2%), J (±5%) Rated voltage (WVDC) 6.3V, 1V, 25V, 5V, 1V, 25V Q* Cap 3pF, Q 1; Cap<3pF,Q 4+2C Insulation resistance at Ur 1GΩ Operating temperature -55 to +125 C Capacitance change ±3ppm/ C; 21Cap 22pF, ±6ppm/ C Termination Ni/Sn (lead-free termination) * Measured at the conditions of 25 C ambient temperature and 3~7% related humidity. Apply 1.±.2Vrms, 1.MHz±1% for Cap 1pF and 1.±.2Vrms, 1.kHz±1% for Cap>1pF.
7. CAPACITANCE RANGE DIELECTRIC SIZE 21 42 63 85 RATED VOLTAGE (VDC) 6.3 1 25 5 1 5 1 25 5 1 25 Capacitance NP Tolerance. (R1) L L L N N B.2pF (R2) L L L N N A, B.3pF (R3) L L L N N S S S T T T A, B.4pF (R4) L L L N N S S S T T T A, B.5pF (R5) L L L N N S S S T T T A, B, C.6pF (R6) L L L N N S S S T T T A, B, C.7pF (R7) L L L N N S S S T T T A, B, C.8pF (R8) L L L N N S S S T T T A, B, C.9pF (R9) L L L N N S S S T T T A, B, C 1.pF (1R) L L L N N S S S T T T A, B, C 1.2pF (1R2) L L L N N S S S T T T A, B, C 1.5pF (1R5) L L L N N S S S T T T A, B, C 1.8pF (1R8) L L L N N S S S T T T A, B, C 2.2pF (2R2) L L L N N S S S T T T A, B, C 2.7pF (2R7) L L L N N S S S T T T A, B, C 3.3pF (3R3) L L L N N S S S T T T A, B, C 3.9pF (3R9) L L L N N S S S T T T A, B, C 4.7pF (4R7) L L L N N S S S T T T A, B, C 5.6pF (5R6) L L L N N S S S T T T B, C, D 6.8pF (6R8) L L L N N S S S T T T B, C, D 8.2pF (8R2) L L L N N S S S T T T B, C, D 1pF (1) L L L N N S S S T T T F, G, J 1 (11) L L L N S S S T T T F, G, J 12pF (12) L L L N S S S T T T F, G, J 13pF (13) L L L N S S S T T T F, G, J 15pF (15) L L L N S S S T T T F, G, J 16pF (16) L L L N S S S T T T F, G, J 18pF (18) L L L N S S S T T T F, G, J 2pF (2) L L L N S S S T T T F, G, J 22pF (22) L L L N S S S T T T F, G, J 24pF (24) L L L S S S T T T F, G, J 27pF (27) L L L S S S T T T F, G, J 3pF (3) L L L S S S T T T F, G, J 33pF (33) L L L S S S T T T F, G, J 36pF (36) S S S T T T F, G, J 39pF (39) S S S T T T F, G, J 43pF (43) S S S T T T F, G, J 47pF (47) S S S T T T F, G, J 56pF (56) T T T F, G, J 68pF (68) T T T F, G, J 82pF (82) T T T F, G, J 1pF (11) T T T F, G, J 1. The letter in cell is expressed the symbol of product thickness. 2. CCE WTC provide E96 (IEC-63) product range with which capacitance 1pF. 3. For more information about products with special capacitance or other data, please contact WTC CCE local representative. 8. PACKAGING DIMENSION AND QUANTITY Size Thickness (mm)/symbol Paper tape 7 reel 13 reel 21 (63).3±.3 L 15k 7k 42 (15).5±.5 N 1k 5k 63 (168).8±.7 S 4k 15k 85 (212).85±.1 T 4k 15k Unit: pieces
9. ELECTRICAL CHARACTERISTICS 1 GUQ4, RF15, NPO, NP, 5V 1.5pF ESR (Ω).1 3.3pF 6.8pF.1 1 1, 1, Frequency (MHz) Fig. 2 ESR vs. Frequency 1 GUQ4, RF15, NP, NPO, 5V 5V 1 Q 1 1 1.5pF 6.8pF 1 1 1, 1, Frequency (MHz) Fig. 3 Q vs. Frequency 1 GUQ4, RF15, NP, NPO, 5V 5V 1 IZI (Ω) 1 1 1 1.5pF 3.3pF 6.8pF 1 1 1 1 1, 1, Frequency (MHz) Fig. 4 Impedance vs. Frequency
Self resonance frequency (GHz) 3 25 2 15 1 5 GUQ2, NPO, 25V RF3, NP, 25V.1 1 1 1 Capacitance (pf) Measured data (<8.5GHz) Simulation data Fig. 5 Self resonance frequency vs. Capacitance (21 size) Self resonance frequency (GHz) 25 2 15 1 5 GUQ4, RF15, NPO, NP, 5V 5V.1 1 1 1 Capacitance (pf) Measured data (<8.5GHz) Simulation data Fig. 6 Self resonance frequency vs. Capacitance (42 size) GUQ2, RF3, NP, NPO, 25V 25V Comparison GUQ4, RF15, NPO, NP, 5V Comparison.5pF.5pF -2-2 S11 (db) -4-6 2pF S11 (db) -4-6 2p F 1 pf -8-8 -1.1 1 1 Frequency (GHz) -1.1 1 1 Frequency (GHz) Fig. 7 S11 vs. frequency. (21 size) Fig. 8 S11 vs. frequency. (42 size) GUQ2, RF3, NPO, NP, 25V Comparison GUQ4, RF15, NPO, NP, 5V Comparison 2pF 2pF -2-2.5pF.5pF S21 (db) -4-6 S21 (db) -4-6 -8-8 -1.1 1 1 Frequency (GHz) -1.1 1 1 Frequency (GHz) Fig. 9 S21 vs. frequency. (21 size) Fig. 1 S21 vs. frequency. (42 size)
1. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Conditions Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance 1.±.2Vrms, 1MHz±1% * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) At 25 C ambient temperature. * Cap 3pF, Q 1; Cap<3pF,Q 4+2C 4. Dielectric Strength 5. Insulation Resistance 6. Temperature Coefficient * To apply voltage: 1V, 25% of rated voltage. 25V, 2% of rated voltage. * Duration: 1 to 5 sec. * Charge and discharge current less than 5mA. To apply rated voltage for max. 12 sec. With no electrical load. Operating temperature: -55~125 C at 25 C * No evidence of damage or flash over during test. 1GΩ * Capacitance change: within ±3ppm/ C; 21Cap 22pF, within ±6ppm/ C 7. Adhesive * Pressurizing force: * No remarkable damage or removal of the terminations. Strength of Termination 21: 2N 42 & 63: 5N >63: 1N * Test time: 1±1 sec. 8. Vibration Resistance * Vibration frequency: 1~55 Hz/min. * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) 9. Solderability * Solder temperature: 235±5 C 95% min. coverage of all metalized area. * Dipping time: 2±.5 sec. 1. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.% or ±.5pF whichever is larger. the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to * Solder temperature: 27±5 C Soldering Heat * Dipping time: 1±1 sec * Preheating: 12 to 15 C for 1 minute before immerse the capacitor in a eutectic solder. * Cap change: within ±2.5% or ±.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * 25% max. leaching on each edge. 12. Temperature Cycle * Conduct the five cycles according to the temperatures and time. * Cap change:within ±2.5% or ±.25pF whichever is larger. Step Temp. ( C) Time (min.) * Q/D.F., I.R. and dielectric strength: To meet initial requirements. 1 Min. operating temp. +/-3 3±3 2 Room temp. 2~3 3 Max. operating temp. +3/- 3±3 4 Room temp. 2~3
No. Item Test Condition Requirements 13. Humidity (Damp Heat) Steady State * Test temp.: 4±2 C * Humidity: 9~95% RH * Test time: 5+24/-hrs. * Cap change: within ±5.% or ±.5pF whichever is larger. * Q/D.F. value: Cap 3pF, Q 35; 1pF Cap<3pF, Q 275+2.5C Cap<1pF; Q 2+1C * I.R.: 1GΩ. 14. Humidity (Damp Heat) Load * Test temp.: 4±2 C * Humidity: 9~95%RH * Test time: 5+24/- hrs. * To apply voltage:rated voltage * Cap change: within ±7.5% or ±.75pF whichever is larger. * Q/D.F. value: Cap 3pF, Q 2; Cap<3pF, Q 1+1/3C * I.R.: 5MΩ. 15. High Temperature Load (Endurance) * Test temp.: 125±3 C * To apply voltage: 2% of rated voltage. * Test time: 1+24/- hrs. * Cap change: within ±3.% or ±.3pF whichever is larger. * Q/D.F. value: Cap 3pF, Q 35 1pF Cap<3pF, Q 275+2.5C Cap<1pF, Q 2+1C * I.R.: 1GΩ. 16. ESR The ESR should be measured at room temperature and tested 21, 42 63 at frequency 1±.1 GHz..5pF Cap : < 35mΩ.3pF Cap : < 15mΩ <Cap 5pF: < 3mΩ <Cap 1pF: < 25mΩ 5pF<Cap 22pF: < 25mΩ 1pF<Cap 47pF: < 2mΩ APPENDIXES Tape & reel dimensions Fig. 11 The dimension of paper tape Size 21 42 63 85 Thickness L N S T A.37±.3.62±.5 1. +.5/-.1 1.5±.1 B.67±.3 1.12±.5 1.8±.1 2.3±.1 T.42±.3.6±.5.95±.5.95±.5 K - - - - W 8.±.1 8.±.1 8.±.1 8.±.1 P 4.±.1 4.±.1 4.±.1 4.±.1 1xP 4.±.1 4.±.1 4.±.2 4.±.2 P 1 2.±.5 2.±.5 4.±.1 4.±.1 P 2 2.±.5 2.±.5 2.±.5 2.±.5 D 1.55±.5 1.55±.5 1.55±.5 1.55±.5 D 1 - - - - E 1.75±.5 1.75±.5 1.75±.5 1.75±.5 F 3.5±.5 3.5±.5 3.5±.5 3.5±.5 Fig. 12 The dimension of reel Size 21, 42, 63, 85 Reel size 7 13 C 13.+.5/-.2 13.+.5/-.2 W 1 8.4+1.5/- 8.4+1.5/- A 178.±1. 33.±1. N 6.+1./- 1±1.
Cross Description Reference of customer label Walsin a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Constructions No. Name NP 1 Ceramic material BaTiO 3 based 2 Inner electrode Cu 3 Inner layer Cu 4 Termination Middle layer Ni 5 Outer layer Sn (Matt) Fig. 13 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 4 C ambient temperature and 2 to 7%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. Don t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization of electrode, which easily be resulted in poor soldering. b. To store products on the shelf and avoid exposure to moisture. c. Don t expose products to excessive shock, vibration, direct sunlight and so on.
Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N 2 within oven are recommended. 4 / sec max Fig. 14 Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste. Over 6sec at least by natural cooling Fig. 15 Recommended wave soldering profile for SMT process with SnAgCu series solder.