DURL COLOR LED LAMPS Pb Lead-Free Parts LHRF9UG3392/P1-PF/TBS-8 DATA SHEET DOC. NO : QW95-LHRF9UG3392/P1-PF/TBS-8 REV. : A DATE : 5 - Jan. - 29
Page 1/7 Package Dimensions P2 ΔH H3 H2 H1 L W 1.3 W2 W3 W1 D F F + - + P1 P 9UG HRF + 1-2 + 3 T 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED LHRF9UG3392/PF-PF 5. 5.9 7.6 8.6 1± MAX TYP MIN 2.54TYP 1 2 3 2.54TYP 18.MIN MIN 9UG + 1-2 + 3 HRF 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED Note : 1.All dimension are in millimeter tolerance is ±.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Page2/7 Absolute Maximum Ratings at Ta=25 Parameter Symbol HRF Ratings 9UG UNIT Forward Current Peak Forward Current Duty 1/1@1KHz Power Dissipation IF 3 3 ma IFP 9 6 ma PD 75 75 mw Electrostatic Discharge( * ) ESD 2 V Reverse Current @5V Ir 1 μa Operating Temperature Topr -4 ~ +85 Storage Temperature Tstg -4 ~ +1 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL Emitted COLOR Lens Dominant wave length λdnm Spectral halfwidth λnm Forward voltage @2mA(V) Min. Max. Luminous intensity @2mA(mcd) Min. Typ. Viewing angle 2θ 1/2 (deg) LHRF9UG3392/P1-PF/TBS-8 AlGaInP Red White Diffused 63 2 2.4 22 35 7 AlGaInP Green 574 2 1.7 2.6 12 22 7 Note : 1.The forward voltage data did not including ±.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Page 3/7 Dimension Symbol Information SYMBOL ITEMS OPTION CODE SYMBOL SPECIFICATIONS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8.15 4.2.17 Component Lead Pitch F 2.3.9.12 Front-To-Rear Deflection H.8 Feed Hole To Bottom Of Component TBS-8 H1 24.5.96 25.5 Feed Hole To Overall Component Height H2 36 1.42 Feed Hole To Tie Bar Bottom Component H3 18.15.71 19.15.75 Lead Length After Component Height L W 11.43 Feed Hole Pitch P 12.4.49 13 1 Lead Location P1 4.4.17 5.8.23 Center Of Component Location P2 5.1.2 7.7.3 Overall Taped Package Thickness T 1.42.6 Feed Hole Location W 8.5.33 9.75.38 Adhesive Tape Width W1 14.5 7 15.5.61 Adhesive Tape Position W2 4..16 Tape Width W3 17.5.69 19.75 REMARK:TBS = Tape And Box Straight Leads Dimensions Symbol Information Package Dimensions Specification Description Symbol minimum mm inch maxmum mm inch W L Overall Length L 33 1 34 13.4 Overall Width W 265 1.4 275 1.8 H Overall Thickness H 5 1.97 6 2.4 Quantity/Box 2PCS
Page 4/7 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1 3.5 Forward Current(mA) 1 1 Relative Intensity Normalize @2mA 2.5.1 2.5 1 1 1 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 Forward Voltage@2mA Normalize @25 1.1.9.8-4 -2-2 4 Relative Intensity@2mA Normalize@25 2.5 6 8 1-4 -2 2 4 6 8 1 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@2mA 55 6 65 7-3 3-6 6 1% 75% 5% 25% 25% 5% 75% 1% Wavelength (nm)
Page 5/7 Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1 Forward Current(mA) 1 1 Relative Intensity Normalize @2mA 2.5.1 4. 5. 1 1 1 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@2mA Normaliz @25 1.2 1.1.9.8-4 -2 2 4 6 8 1 Relative Intensity @2mA Normalize @25 2.5-4 -2 2 4 6 8 1 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity @2mA 5 55 6 65-3 3-6 6 1% 75% 5% 25% 25% 5% 75% 1% Wavelength (nm)
Page 6/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:3W Max Temperature 35 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 12 C Max Preheat time: 6seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:26 C Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) 26 26 C3sec Max 5 /sec max 12 25 Preheat 6 Seconds Max 2 /sec max 5 1 15 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
Page 7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=2mA 3.t=1 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-75: 126 MIL-STD-883: 15 JIS C 721: B-1 High Temperature Storage Test 1.Ta=15 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:18 JIS C 721: B-1 Low Temperature Storage Test 1.Ta=-4 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 721: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=9%~95% 3.t=24hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-22:13B JIS C 721: B-11 Thermal Shock Test 1.Ta=15 ±5 &-4 ±5 (1min) (1min) 2.total 1 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-22: 17D MIL-STD-75: 151 MIL-STD-883: 111 Solder Resistance Test 1.T.Sol=26 ±5 2.Dwell time= 1 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-22: 21A MIL-STD-75: 231 JIS C 721: A-1 Solderability Test 1.T.Sol=23 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-22: 28D MIL-STD-75: 226 MIL-STD-883: 23 JIS C 721: A-2