Week 3, Lectures 6-8, Jan 29 Feb 2, 2001

Similar documents
Electrical Characteristics of MOS Devices

Lecture 4 - PN Junction and MOS Electrostatics (I) Semiconductor Electrostatics in Thermal Equilibrium. February 13, 2003

Lecture 4 - PN Junction and MOS Electrostatics (I) Semiconductor Electrostatics in Thermal Equilibrium September 20, 2005

Lecture 7 - PN Junction and MOS Electrostatics (IV) Electrostatics of Metal-Oxide-Semiconductor Structure. September 29, 2005

Lecture 8 PN Junction and MOS Electrostatics (V) Electrostatics of Metal Oxide Semiconductor Structure (cont.) October 4, 2005

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure

Lecture 7 - Carrier Drift and Diffusion (cont.) February 20, Non-uniformly doped semiconductor in thermal equilibrium

Semiconductor Physics Problems 2015

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Microelectronic Devices and Circuits Lecture 9 - MOS Capacitors I - Outline Announcements Problem set 5 -

Section 12: Intro to Devices

Lecture 04 Review of MOSFET

Lecture 17 - p-n Junction. October 11, Ideal p-n junction in equilibrium 2. Ideal p-n junction out of equilibrium

Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.)

Electronic Devices and Circuits Lecture 5 - p-n Junction Injection and Flow - Outline

Semiconductor Junctions

EECS130 Integrated Circuit Devices

Lecture 8 - Carrier Drift and Diffusion (cont.) September 21, 2001

Lecture 3 Semiconductor Physics (II) Carrier Transport

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

Midterm I - Solutions

Lecture 6 - PN Junction and MOS Electrostatics (III) Electrostatics of pn Junction under Bias February 27, 2001

Lecture 22 Field-Effect Devices: The MOS Capacitor

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

The Devices. Jan M. Rabaey

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS

EECS130 Integrated Circuit Devices

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.

Lecture 15 - The pn Junction Diode (I) I-V Characteristics. November 1, 2005

Lecture 12: MOS Capacitors, transistors. Context

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

Lecture 11: MOS Transistor

Section 12: Intro to Devices

Schottky Rectifiers Zheng Yang (ERF 3017,

Long Channel MOS Transistors

Device Models (PN Diode, MOSFET )

Semiconductor Physics fall 2012 problems

Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Due on Feb. 15, 2018 by 7:00 PM

Lecture 13 - Carrier Flow (cont.), Metal-Semiconductor Junction. October 2, 2002

UNIVERSITY OF CALIFORNIA, BERKELEY College of Engineering Department of Electrical Engineering and Computer Sciences

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

EE105 Fall 2015 Microelectronic Devices and Circuits: Semiconductor Fabrication and PN Junctions

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

MOS Transistor I-V Characteristics and Parasitics

Long-channel MOSFET IV Corrections

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn )

Lecture #27. The Short Channel Effect (SCE)

Integrated Circuits & Systems

Sample Exam # 2 ECEN 3320 Fall 2013 Semiconductor Devices October 28, 2013 Due November 4, 2013

Device Models (PN Diode, MOSFET )

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

VLSI Design and Simulation

ECE 340 Lecture 39 : MOS Capacitor II

EE5311- Digital IC Design

Extensive reading materials on reserve, including

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region

Lecture 22 - The Si surface and the Metal-Oxide-Semiconductor Structure (cont.) April 2, 2007

an introduction to Semiconductor Devices

MOS CAPACITOR AND MOSFET

Electrostatics: The Key to Understanding Electronic Devices. Boundary Conditions. Physics approach: vector calculus, highly symmetrical problems

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

EE 130 Intro to MS Junctions Week 6 Notes. What is the work function? Energy to excite electron from Fermi level to the vacuum level

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

FIELD-EFFECT TRANSISTORS

Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Due on March 01, 2018 at 7:00 PM

PN Junction. Ang M.S. October 8, Maxwell s Eqautions Review : Poisson s Equation for PNJ. Q encl S. E ds. σ = dq ds. ρdv = Q encl.

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Solid State Electronics. Final Examination

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

Course Administration. CPE/EE 427, CPE 527 VLSI Design I L04: MOS Transistors. Review: CMOS Process at a Glance

EE105 - Fall 2005 Microelectronic Devices and Circuits

ECE 305 Fall Final Exam (Exam 5) Wednesday, December 13, 2017

Semiconductor Integrated Process Design (MS 635)

01 01 Intro to Course

EE105 - Spring 2007 Microelectronic Devices and Circuits. Structure and Symbol of MOSFET. MOS Capacitor. Metal-Oxide-Semiconductor (MOS) Capacitor

PN Junction and MOS structure

Semiconductor Physics fall 2012 problems

EECS130 Integrated Circuit Devices

Diodes. anode. cathode. cut-off. Can be approximated by a piecewise-linear-like characteristic. Lecture 9-1

EE105 - Fall 2006 Microelectronic Devices and Circuits

Quiz #1 Practice Problem Set

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model

ECE-305: Spring 2018 Exam 2 Review

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

Junction Diodes. Tim Sumner, Imperial College, Rm: 1009, x /18/2006

CHAPTER 5 MOS FIELD-EFFECT TRANSISTORS

The Devices. Devices

EE 3329 Electronic Devices Syllabus ( Extended Play )

Lecture 20 - p-n Junction (cont.) October 21, Non-ideal and second-order effects

Devices. chapter Introduction. 1.2 Silicon Conductivity

ELEC 3908, Physical Electronics, Lecture 13. Diode Small Signal Modeling

Introduction to Power Semiconductor Devices

VLSI Design I; A. Milenkovic 1

MOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations

CMOS Devices. PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors

Transcription:

Week 3, Lectures 6-8, Jan 29 Feb 2, 2001 EECS 105 Microelectronics Devices and Circuits, Spring 2001 Andrew R. Neureuther Topics: M: Charge density, electric field, and potential; W: Capacitance of pn junction; F: MOS threshold voltage Reading for week: HS Ch 3. Light on math of a) the 2 sided model (3.4.2) and b) the MOS capacitance (3.9.2) Version 1/20/01

Depletion Regions: pn and MOS ANALYSIS Charge Density Elec. Field Potential p Charge Density hole diffusion electron diffusion hole drift electron drift - Electrical Field Potential ρ ξ V + ψ 0 -W 1 W 2 n Distance PHYSICAL RESULTS (a) Current flow. (b) Charge density. (c) Electric field. (d) Electrostatic potential. Capacitance (Small Signal) Carrier density versus potential (eponential) MOS threshold voltage physical basis for the many terms

Physics of Electrostatics E = The electric field E diverges from positive charge and the strength is inversely proportional to the dielectric constant ε (and hence will be discontinuous at boundaries between materials). The potential has a slope that is the negative of the electric field. ρ ε φ( ) E( ) = d

Eample: Sheet Charge Geometry Electrostatic Solution Charge density ρ 0 () Equal area For charge neutrality Electric Field E o () Sheet of positive charge Electric Field Sheet of negative charge Potential φ 0 ()

Eample: Multiple Sheets Geometry Electrostatic Solution Charge density ρ 0 () Electric Field E o () At first sheet see Spike Step Sheet of positive charge Electric Field Sheet of negative charge Potential φ 0 () Change in slope

Eample: Uniform Distribution Geometry Sheet of positive charge Electric Field Electrostatic Solution Uniform distribution of negative charge Charge density ρ 0 () Electric Field Potential E o () φ 0 () Equal area For charge neutrality At edge see Change in slope Parabolic region

Eample: Materials Boundary Geometry Oide ε r = 3.9 ε o Sheet of positive charge Electric Field Sheet of negative charge Electrostatic Solution Silicon ε r = 11.7 ε o Charge density ρ 0 () Electric Field Potential E o () φ 0 () Equal area For charge neutrality At boundary see Step by factor of 3.9/11.7 Change in slope by factor of 11.7/3.9

Eample: MOS Prototype Geometry GATE OXIDE See Fig. E3.3b in tet SUBSTRATE

Charge: MOS Prototype Equal area For charge neutrality Has both a boundary and a distributed charge density GATE OXIDE SUBSTRATE

Field and Potential: MOS Prototype Discontinuity by factor of 3.9/11.7 Change in slope by factor of 3.9/11.7 Parabolic shape X d increases as sqrt (V B )

Eample: pn Prototype hole diffusion electron diffusion Charge Density p Charge Density hole drift electron drift - ρ + n Distance (a) Current flow. Equal area for charge neutrality (b) Charge density. Elec. Field Electrical Field ξ (c) Electric field. E MAX = qna p = qn d n Potential Potential V ψ 0 -W 1 W 2 p n (d) Electrostatic potential. Parabolic dependence of n and p on potential φ o

One-Sided Approimation See Figure in tet pp 126

Potential from Carrier Density 0 = qnµ n E o + qd n (dn o /d) dn o /d = (-µ n /D n )n o E o = (-kt/q) n o (-dφ o /dt) dφ o = (kt/q)dn o /n o = V TH dn o /n o φ o () φ o ( o ) = V TH ln[n o ()/n o ( o )] Reference Level: φ o ( o ) = 0 when n o ( o ) = n i Logarithmic!

Carrier Density from Potential φ o () = V TH ln[n o ()/n i ] n o () = n i ep [φ o ()/ V TH ] φ o () = -V TH ln[p o ()/n i ] p o () = n i ep [-φ o ()/ V TH ] When the potential varies with position in the silicon these carrier densities n o () and p o () will also change with position. Eponential!

Eample of Potential and Carriers Doping N a = N d = 10 16 Holes need 720 mev to jump the barrier φ p = -V TH ln[n a /n i ] = (0.026 mv) ln[10 16 /sqrt(2)10 10 ] = -360 mv φ o () = V TH ln[n d /n i ] =(0.026mV) ln[10 16 /sqrt(2)10 10 ] = 360 mv Barrier 720 mv

Contact Potentials