LED ARRAY Pb Lead-Free Parts LA140B-1/DBK-3-PF DATA SHEET DOC. NO : REV. : DATE : QW0905- A 25- Feb. LA140B-1/DBK-3-PF - 2010 發行 立碁電子 DCC
Page 1/5 Package Dimensions 3.3 4.0 5.2±0.5 5.3 6.35 3.0 3.17 + - 0.5 TYP 3.5±0.5 2.54TYP + - 4.15±0.5 LDBK2043 3.0 4.0 4.2 5.2 1.5MAX 0.5 TYP 25.0MIN 2.54TYP MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Page 2/5 Absolute Maximum Ratings at Ta=25 Parameter Symbol Ratings DBK UNIT Forward Current IF 30 ma Peak Forward Current Duty 1/10@10KHz IFP 100 ma Power Dissipation PD 120 mw Reverse Current @5V Ir 50 μa Electrostatic Discharge ESD 500 V Operating Temperature Topr -20 ~ +80 Storage Temperature Tstg -30 ~ +100 Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL COLOR Dominant wave length λdnm Spectral halfwidth λnm Forward voltage @ 20mA(V) Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Emitted Lens Typ. Max. Min. Typ. LA140B-1/DBK-3-PF InGaN/GaN Blue Water Clear 470 30 3.5 4.0 450 1100 30 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Typical Electro-Optical Characteristics Curve Page 3/5 DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) 1000 100 10 1 0 1 Relative Intensity Normalize @20mA 2.0 3.0 4.0 5.0 1 10 3.0 2.5 2.0 1.5 0.5 0.0 100 1000 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Forward Voltage@20mA Normalize @25 1.1 0.9 0.8-40 -20 0 20 40 60 80 100 Relative Intensity@20mA Normalize @25 2.5 2.0 1.5 0.5 0.0-40 -20 0 20 40 60 80 100 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 0.5 0.0 400 450 500 550 Wavelength (nm)
Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( C) 260 260 C3sec Max 5 /sec max 120 25 0 0 Preheat 2 /sec max 50 100 150 Time(sec) 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ±5 &-40 ±5 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ±5 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2