LED ARRAY Pb Lead-Free Parts LA256B/3EG-S2-PF DATA SHEET DOC. NO : QW0905-LA256B/3EG-S2-PFB REV. : A DATE : 03 - Mar. - 2017 發行 立碁電子 DCC
Page 1/8 Package Dimensions Ø 3.35*3 7.00 Ø *3 3.2± 11.6 EG 5.1 EG 14.8 5.1 EG 2.3 TYP 2.6± G E 2.54TYP 1 2 3 2.54TYP 5.05± 7.45± 9.85± 1 2 3 - + - 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE ORANGE LEG2392/R1-PF 5.0 TYP 18.0MIN G E 2.0MIN 2.54TYP] 1 2 3 2.54TYP 2.0MIN 1 2 3 - + - 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE ORANGE Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Page 2/8 Absolute Maximum Ratings at Ta=25 Parameter Symbol E Ratings G UNIT Forward Current IF 30 30 ma Peak Forward Current Duty 1/10@10KHz IFP 120 120 ma Power Dissipation PD mw Reverse Current @5V Ir 10 10 μa Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ + Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL Emitted COLOR Lens Peak wave length λpnm Spectral halfwidth λnm Forward voltage @20mA(V) Min. Max. Min. Luminous intensity @10mA(mcd) Typ. Viewing angle 2θ 1/2 (deg) GaAsP/GaP Orange LA256B/3EG-S2-PF GaP Green White Diffused 635 565 45 1.7 2.6 1.2 30 1.7 2.6 1.2 68 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Page3/8 Brightness Code For Standard LED Lamps Bin Code E.G CHIP Group A5 A6 Luminous Intensity(mcd) at 10 ma Min. Max. 1.2 1.8 1.8 A7 A8 A9 4.5 8.0 4.5 8.0 12
Page 4/8 Brightness Code For Standard LED Lamps Color Code E CHIP Group Wave length(nm) at 10 ma Min. Max. 26 615 620 27 620 625 28 625 630 29 630 635 30 635 640 G CHIP Group 5 6 7 568 8 570 9 572 Wave length(nm) at 10 ma Min. 564 566 Max. 566 568 570 572 574
Typical Electro-Optical Characteristics Curve E CHIP Page 5/8 Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 0 Forward Current(mA) 10 0.1 Relative Intensity Normalize @20mA 2.5 2.0 1.5 2.0 4.0 5.0 10 0 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 Forward Voltage@20mA Normalize @25 1.1 0.9 0.8-40 -20 Relative Intensity@20mA Normalize @25 2.5 2.0 1.5 0 20 40 60 80-40 -20 0 20 40 60 80 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 550 600 650 700 750 Wavelength (nm)
Typical Electro-Optical Characteristics Curve Page 6/8 G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 0 3.5 Forward Current(mA) 10 0.1 Relative Intensity Normalize @20mA 2.5 2.0 1.5 2.0 4.0 5.0 10 0 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25 1.2 1.1 0.9 0.8-40 -20 0 20 40 60 80 Relative Intensity@20mA Normalize @25 2.5 2.0 1.5-40 -20 0 20 40 60 80 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 500 550 600 650 Wavelength (nm)
Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( C) 260 260 C3sec Max 5 /sec max 120 25 0 0 2 /sec max Preheat 60 Seconds Max 50 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=0 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 5 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ±5 2.t=0 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:8 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ±5 2.t=0 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ±5 &-40 ±5 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ±5 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2