High reliability and High quality of light High-Power LED for Automotive SWA0Y1PA RoHS AEC-Q101 Product Brief Description The WICOP LED series is designed for high current operation and high flux output applications. It incorporates state of the art SMD design and low thermal resistant material. The WICOP LED is ideal light sources for automotive applications and mobile flash, general lighting. Features and Benefits Super high Flux output and high Luminance Designed for high current operation SMT solderable Lead Free product Compact module design available. ESD Class 3B / MSL 2 level Viewing angle 120 o Key Applications Automotive Lighting 1 www.seoulsemicon.com
Table of Contents Index Product Brief 1 Table of Contents 2 Performance Characteristics 3 Characteristics Graph 5 Color Bin Structure 10 Mechanical Dimensions 12 Recommended Solder Pad 13 Reflow Soldering Characteristics 14 Emitter Tape & Reel Packaging 15 Product Nomenclature 17 Handling of Silicone Resin for LEDs 18 Precaution For Use 20 Company Information 22 2 www.seoulsemicon.com
Performance Characteristics Table 1. Characteristics, I F = 700mA, T j = 25ºC Parameter Symbol Min Typ Max Unit Forward Voltage V F 3.0 3.3 3.8 V Luminous Flux Φ V 104 130 153 lm Chromaticity Coordinates CIE x 0.57 CIE y 0.42 Viewing Angle 2θ 120 deg. [ ] Real Thermal resistance Rth JS 5.0 7.5 K / W Electrical Thermal resistance Rth JS 4.0 6.5 K / W Notes : [1] Tolerance : VF :±0.1V, ΦV :±7%, CIEx, CIEy:±0.005 [2] All measurements were made under the standardized environment of Seoul semiconductor. [3] Rθ J-S is tested at 700mA. 3 www.seoulsemicon.com
Performance Characteristics Table 2. Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current (T j =25 ) I F 50 ~ 1,500 ma Operating Temperature T opr -40 ~ +125 Storage Temperature T stg -40 ~ +125 Junction Temperature T j 150 ESD (HBM) (R=1.5kΩ, C= 100pF) Class 3B (JESD22-A114-E) - Notes : [1] All measurements were made under the standardized environment of Seoul semiconductor [2] Subject to Human Body Model / JESD22-A114. 4 www.seoulsemicon.com
Relative Luminous Intensity [%] Relative Luminous Intensity [%] Characteristics Graph Fig 1. Relative Intensity vs. Wavelength, I F = 700mA, T j = 25 120 100 80 60 40 20 0 350 400 450 500 550 600 650 700 750 800 Wavelength [nm] Fig 2. Relative Intensity vs. Angle, T j = 25 120 100 80 60 40 20 0-90 -60-30 0 30 60 90 Beam angle [Degree] 5 www.seoulsemicon.com
Relative Luminous Flux [%] Forward Current, I F [A] Characteristics Graph Fig 3. Forward Current vs. Forward Voltage, T j = 25 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Forward Voltage, V F [V] Fig 4. Forward Current vs. Relative Luminous Flux, T j = 25 180 160 140 120 100 80 60 40 20 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Forward Current, I F [A] 6 www.seoulsemicon.com
Color coordinates shift [a.u.] Characteristics Graph Fig 5. Forward Current vs. CIE x, y Shift, T j = 25 0.010 0.008 0.006 0.004 0.002 0.000-0.002-0.004-0.006-0.008 CIE x CIE y -0.010 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Forward Current, I F [A] 7 www.seoulsemicon.com
Color coordinates shift [a.u.] Relative Luminous Flux [%] Characteristics Graph Fig 6. Junction Temperature vs. Relative Light Output, I F =700mA 120 100 80 60 40 20 0-40 -20 0 20 40 60 80 100 120 140 160 Junction Temperature, Tj [ C] Fig 7. Junction Temperature vs. CIE x, y Shift, I F =700mA 0.03 0.02 CIE x CIE y 0.01 0.00-0.01-0.02-0.03-40 -20 0 20 40 60 80 100 120 140 160 Junction Temperature, Tj [ C] 8 www.seoulsemicon.com
Forward Current, I F [A] Forward Voltage, V F [V] Characteristics Graph Fig 8. Junction Temperature vs. Forward Voltage. 0.6 0.4 0.2 0.0-0.2-0.4-0.6-40 -20 0 20 40 60 80 100 120 140 160 Junction Temperature, Tj [ C] Fig 9. Maximum Forward Current vs. Solder Temperature, T j (max.) = 150 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Do not use below 50mA 0.0 0 20 40 60 80 100 120 140 Solder Temperature, T s [ C] 9 www.seoulsemicon.com
Color Bin Structure Table 3. Bin Code description (T j = 25, I F = 700mA) Part Number Luminous Flux [lm] Color Forward Voltage [V] @ I F = 0.70A Chromaticity Coordinate @ IF = 0.70A Bin Code Min. Max. @ IF = 0.70A Bin Code Min. Max. J0 104 115 V2 3.00 3.25 SWA0Y1PA K0 115 126 V3 3.25 3.50 Refer to page.11 L0 126 139 V4 3.50 3.75 M0 139 153 V5 3.75 4.00 10 www.seoulsemicon.com
CIE y Color Bin Structure CIE Chromaticity Diagram, T j =25, I F =700mA 0.435 0.430 0.425 0.420 A 0.415 B 0.410 0.405 0.400 0.55 0.56 0.57 0.58 0.59 0.60 CIE x A B CIE x CIE y CIE x CIE y 0.5613 0.4247 0.5557 0.4192 0.5800 0.4064 0.5763 0.4054 0.5901 0.4094 0.5800 0.4064 0.5680 0.4315 0.5613 0.4247 11 www.seoulsemicon.com
0.515 0.515 0.515 1.680 1.680 1.880 1.880 1.120 1.880 1.120 1.880 0.805 0.805 0.805 Mechanical Dimensions Top view Bottom view 1.610 1.610 1.610 1.6 1.120 1.120 1.410 1.1 (-) (-) (+) (+) (-) (-) (+) (-) 0.580 0.250 0.580 0.580 0.250 Side view Circuit Anode(+) ESD protection component Cathode(-) Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. Undefined tolerance is ±0.1mm 12 www.seoulsemicon.com
Recommended Solder Pad (-) (+) Cathode (-) (-) (+) (+) Anode <Recommended solder pad> <Recommended stencil pattern> Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. This drawing without tolerances are for reference only 4. Undefined tolerance is ±0.1mm 13 www.seoulsemicon.com
Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) Time maintained above: - Temperature (TL) - Time (tl) 100 C 150 C 60-120 seconds 183 C 60-150 seconds 150 C 200 C 60-180 seconds 217 C 60-150 seconds Peak Temperature (Tp) 215 260 Time within 5 C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Caution 1. Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 14 www.seoulsemicon.com
Emitter Tape & Reel Packaging 180 +0-3 -0 Cathode Anode (-) (+) 11.4 9 ±0.3 2 ±0.2 22 60 +0.2 13 ±0.2 Label ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 1000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 15 www.seoulsemicon.com
Emitter Tape & Reel Packaging * Please refer to the next page for the 'Labeling Information' and 'Product Nomenclature'. 16 www.seoulsemicon.com
Product Nomenclature Table 4. Part Numbering System : X 1 X 2 X 3 X 4 X 5 X 6 X 7 X 8 Part Number Code Description Part Number Value X 1 Company S SSC X 2 Package Type W WICOP X 3 X 4 Color A0 AMBER X 5 Chip Type Y - X 6 X 7 Chip Number 1P 1CHIP X 8 Product Revision A - Table 5. Lot Numbering System :Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Lot Number Code Description Lot Number Value Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Year Month Day Top View LED series Mass order Internal Number 17 www.seoulsemicon.com
Handling of Silicone Resin for LEDs 1. During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2. In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3. When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED s reflector area. 4. Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5. Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6. Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. 7. Avoid leaving fingerprints on silicone resin parts. 18 www.seoulsemicon.com
Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5 to 30 and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40 Humidity : less than RH30% b. If the package has been opened more than 1 year (MSL_2) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5 (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 19 www.seoulsemicon.com
Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) The slug is electrically isolated. (15) Attaching LEDs, do not use adhesives that outgas organic vapor. (16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (17) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes 20 www.seoulsemicon.com
Precaution for Use Environmental controls: - Humidity control (ESD gets worse in a dry environment) b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subje cted to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circ uit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to e lectrical overstress as the failure modes have been investigated to vary, but there are some common s igns that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device 21 www.seoulsemicon.com
Company Information Published by Seoul Semiconductor 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as npola, "Acrich", the world s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 22 www.seoulsemicon.com