CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) SECIFICATION ITEM MOEL CUSTOMER ISSUE ATE BLUE TO VIEW LE CLC6BBZ33E(S)C Approved by C U S T O M E R Approved by Approved by / rawn by / S U L I E R Checked by / Approved by / / / OWERLIGHTEC Co., LT. 1101 Galgot ri, Jinwy myun, yeongtaeksi, Kyunggi do, Korea Tel : +82313795400 Fax : +82313789759 http : //www.powerlightec.com 1/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) C O N T E N T S 1. Revision history 2. General escription 3. ElectroOptical Characteristics 4. Ranks 5. Composition of ackage 6. Environmental pollution free 7. Typical Electrical / Optical Characteristics Curves 8. Classification by name 9. Reliability 10. Soldering Condition 11. Reel acking Structure 12. recaution for Use 2/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 1. Revision history Title oc. No. Specification for Approval KQSLL353 Rev. No. ate Summary of revision Remarks 00 2003.07. New establishment 01 2004.10. New Chromaticity Coordinates ranks 01 2004.12. Appliance b free material 03 2006.04. ocument registration number change 04 2007.11 Revised All Sheets 05 2008.02 Model name, Outline imensions, Ranks 3/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 2. General escription (1) Features ackage Size : 5.4 5.0 1.6mm SM (Top View) type Very wide viewing angle Transparency lens type Chip material based on InGaN High luminous Intensity Long life time ES protection (Level 2 under 2KV) (2) Outline imensions UNIT : mm 4/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 3. ElectroOptical Characteristics (1) Absolute Maximum Rating (Ta=25 ) arameter Symbol Value Unit Forward Current I F 90 ma eak Forward Current I F 300 ma Reverse Voltage V R 5 V ower issipation 360 mw Operating Temperature Topr 40 to +85 Storage Temperature Tstg 40 to +100 Soldering temperature uty Ratio 1/10, ulse Width 10 msec Tsol Reflow soldering : 260, 10 sec Hand Soldering : 300, 3 sec (2) Electrical / Optical Characteristics (Ta=25 ) arameter Symbo l Condition Min Typ Max Unit Forward Voltage V F I F =60 ma 3.2 4.0 V Reverse Current I R V R =5V 10 μa Luminous Intensity I V I F =60 ma 200 1,000 mcd Viewing Angle 2θ 1/2 I F =60 ma 100 120 140 deg. ominant Wavelength Wd I F =60 ma 450 474 nm Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eyeresponse curve. lease refer to rank table. θ1/2 is the offaxis angle at which the luminous intensity is half the axial luminous intensity. 5/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 4. Ranks (1) Luminous Intensity Ranks (Ta=25 ) Iv Rank Condition Min Typ Max Unit A 200 300 B 300 400 C I F = 60mA 400 600 mcd 600 800 E 800 1000 Measurement Uncertainty of the Luminous Intensity : ± 10% (2) Forward Voltage Ranks (Ta=25 ) V F Rank Condition Min Typ Max Unit A 2.8 3.0 B 3.0 3.2 C I F = 60mA 3.2 3.4 3.4 3.6 V E 3.6 3.8 F 3.8 4.0 Measurement Uncertainty of the Forward Voltage : ± 7% (3) ominant Wavelength Ranks (Ta=25 ) W Rank Condition Min Typ Max Unit A 450 456 B C I F = 60mA 456 462 462 468 nm 468 474 Measurement Uncertainty of the wavelength : ± 1.5nm 6/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 5. Composition of ackage (1) Composition of ackage (2) Component material Number Item Material 1 Mold Resin Epoxy or Silicone 2 Electrodes Ag lating Cu Alloy 3 ie adhesive Ag Epoxy or Silicone 4 LE Chip InGaN 5 Au Wire 1.0~1.2mil 7/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 6. Environmental pollution free (1) Testing institute : Korea Environment & Merchandise Testing Institute (2) Test material : LECB 1Resin, 2 Metal 1 Resin Test Test item Unit Result Test method b Cd Hg Cr +6 mg/kg mg/kg mg/kg mg/kg No detection No detection No detection No detection ISO 61012 (AAS) EN 1122 (IC) ISO 3856/7 (AAS) ISO 3856/5 UVVis. Spectrophotometer 2 Metal Test Test item Unit Result Test method b Cd Hg Cr +6 mg/kg mg/kg mg/kg μg /kg No detection No detection No detection No detection ISO 474998 ISO 596084 JIS H 106693 IC analysis method ISO 3613:2000(E) 8/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 7. Typical Electrical / Optical Characteristics Curves Forward Voltage Vs. Forward Current Forward Current _ If [ma] 100 90 80 70 60 50 40 30 20 10 0 VoltageCurrent 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Forward Voltage_Vf [V] Forward Current Vs. Relative Luminosity Relative Virtual Intensity. [ Iv/Iv(60mA) ] 4 3.5 3 2.5 2 1.5 1 0.5 0 CurrentIntensity 0 30 60 90 120 150 180 210 240 270 300 Forward Current _ If [ma] Forward Current erating Curve (per 1 chip) 35 Relative Luminosity Vs. Ambient Temperature 30 Forward Current (If) 25 20 15 10 5 0 20 0 20 40 60 80 100 Ambient Temperature (Ta) irectivity Relative Luminous intensity vs. Wavelength 100 10 20 º º 30 º 40º 50 º 60 º 70 º 80 º 0 º 90 º 100 80 60 40 20 0 Relative Luminosity Iv(%) 0 400 450 500 550 600 650 Relative Luminosity Iv(%) 80 60 40 20 Wavelength λ (nm) 700 25 Ambient Temperature Unless Otherwise Noted 9/ 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 8. Classification by name ART NO. CL (1) OWERLIGHTEC Lamp (2) ACKAGE TYE (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) C0 1608 C/LE ackage, T=0.3mm S11 3810 Side View LE, T=0.8mm C1 1608 C/LE ackage, T=0.4mm S12 3810 Side View LE, T=0.6mm C2 1608 C/LE ackage, T=0.55mm S21 N 4011 Side View LE, T=0.8mm C3 4014 Side View LE, T=0.8mm S22 N 4011 Side View LE, T=0.6mm C31 4014 Side View LE, T=0.6mm S31 5508 Side View LE, T=0.8mm C32 4014 Side View LE, T=0.48mm S32 5506 Side View LE, T=0.6mm C4 3528 Top View LE, T=1.9mm T2 5450 Flat Type LE, T=0.9mm C41 3528 TO LE Transfer T=1.2mm M80 8080 Metal ower ackage C42 3528 TO LE Transfer T=0.9mm 13 1314 ragon EYE ower ackage C5 C6 C61 C7 3020 Top View LE, T=1.3mm 5450 Flash LE ackage T=1.6mm 5450 Flash LE ackage T=0.9mm 1615 Seven Color ackage N : New roduct : roduct : evelop roduct C71 1612 ual Color ackage C8 ower LE ackage (HB) 1 1608 C/LE CB ackage T=0.4mm (3) EMITION COLOR B G Y O A R Blue Green Yellow Orange Amber Red W WW YG RGB I White Warm White YGreen ual R, G, B Infrared (4) LENS COLOR A Colored Transparency C Colored iffusion B Colorless Transparency Milky iffusion (5) ES ROTECTION ( Zener iode: Z / Varistor: V / No rotection: N ) (6) NUMBER OF CHI ( 1Chip: 1 / 2Chip: 2 / 3Chip: 3 / 4Chip: 4 / 5Chip: 5 ) (7) NUMBER OF ZENER ( No Zener: 0 / 1Zener: 1 / 2Zener : 2 / 3Zener : 3 ) (8) MOL RESIN ( Epoxy: E / Silicone: S ) (9) OLARITY MARK ( Anode: A / Cathode: C ) (10) COMMON OF OLARITY ( Anode: A / Cathode: C ) 10 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 9. Reliability (1) Test items and results Test Item Standard Test Method Test Conditions Note Number of amaged Resistance to Soldering Heat (Reflow Soldering) MILST105 Tsol=260, 10sec. (re treatment 30, 70%, 168hrs.) 2 times Solderability (Reflow Soldering) MILST105 Tsol=215±5, 3sec. 1 time over 95% Temperature Cycle MILST105 40 ~ 25 ~ 100 ~ 25 30min. 5min. 30min. 5min. 100 cycles High Temperature Storage MILST105 Ta=100 1000 hrs. Humidity Heat Load MILST105 Ta=60, RH=90% 1000 hrs. Low Temperature Storage MILST105 Ta=40 1000 hrs. Life Test Condition 1 MILST105 Ta=25, IF=60mA 1000 hrs. Life Test Condition 2 MILST105 Ta=25, IF=90mA 500 hrs. High Temperature Life Test Ta=85, IF=15mA 1000 hrs. High Humidity Heat Life Test 60, RH=90%, IF=45mA 500 hrs. Low Temperature Life Test Ta=40, IF=60mA 1000 hrs. (2) Criteria for judging the damage Item Symbol Test Conditions Min. Criteria for Judgment Max. Forward Voltage Reverse Current Luminous Intensity VF IR IV IF=60mA VR=5V IF=60mA L.S.L.**) 0.7 U.S.L.*) 1.1 U.S.L.*) 2.0 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level 11 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 10. Soldering Condition (1) Soldering condition Reflow soldering Hand soldering Step Lead solder Lead free Solder Condition Spec. re heating re heating time 120~150 Max 120 sec. 180~220 Max 120 sec. Soldering Temp. Max 300 eak temp. Soldering time Max 240 Max 10 sec. Max 260 Max 10 sec. Soldering Time Max 3sec. (2) Recommended Reflow Soldering profile Lead Solder Lead Free Solder (3) Recommended Soldering pattern 6.9 2.5 1.9 2.5 0.2 1.4 1.4 4.6 (4) Soldering Cautions Modifications should not be done after the LEs have been soldered. If modifications cannot be avoided, a doublehead soldering iron should be used after checking whether the characteristics of the LEs will not be damaged by modification after soldering. Reflow soldering, do not apply force to the package during heating. After soldering, do not warp the circuit board. 12 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 11. Reel acking Structure (1) Carrier tape & Reel dimensions 13 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 11. Reel acking Structure (2) acking & ackaging Reel Label V : CLXXXXX IV : OO ~ OO mcd Vf : OO ~ OO V Color Code : XXX rank Q ty : OOOO ea Lot No. : XXXXXXXXXXXX Aluminum bag (in a Reel) V : CLXXXXX IV : OO ~ OO mcd Vf : OO ~ OO V Color Code : XXX rank Q ty : OOOO ea Lot No. : XXXXXXXXXXXX V : CLXXXXX IV : OO ~ OO mcd Vf : OO ~ OO V Color Code : XXX rank Lot No. : XXXXX W : 2007. 11. 11 Q ty : OOOO ea Inner Box Outer Box ( in 8ea inner boxes) 14 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 12. recaution for Use High ower Blue LEs are devices which are materialized by HB Blue LEs. Consequently, the color of Blue LEs is changed a little by an operating current. Care should be taken after due consideration when using LEs (1) Moistureproof ackage When moisture is absorbed into the LEs it may vaporize and expand during soldering. There is a possibility that this can cause the exfoliation of the contacts and the damage the optical characteristics of the LEs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. After opening the package, the LEs should be kept at 30, 70%RH or less. The LEs should be soldered within 168 hours(7days) after opening the package. When storing the LEs after opening the package, use a sealable away from package with a moisture absorbent material inside. If the blue color of the desiccant indicator has faded after storing, a baking treatment should be performed as follows : 65 ± 5 for more than 24 hours (2) Heat Generation Heat generation must be taken into design consideration when using the LEs. The coefficient of temperature increase per input electric power is about 0.62 /mw at the LE s active layer. This coefficient will be affected by the heat resistance of the circuit board and by dense mounting of the LEs. At the same time, precautions must be taken into the design of circuitry to avoid intense heat generation. roper designs which allow radiation of heat, etc. may be needed. The operating current should be decided after considering the ambient maximum temperature when the LEs are illuminating. (3) Static Electricity Static Electricity and surge damages the LEs. It is recommended to use a wrist band or antielectrostatic glove when handling the LEs. All devices, equipment and machinery must be properly grounded. When inspecting own final products on which LEs were mounted, it is recommended to check also whether the mounted LEs are damaged by static electricity or not. It is easy to find staticdamaged LEs by light emission test at lower current (below 1 ma is recommended). amaged LEs will show some unusual characteristics such as leak current remarkably increases, starting forward voltage becomes lower, or the LEs get unlighted at the low current. 15 / 16
CLC6BBZ33E(S)C C6BBZ33E(S)C KQSLL353 (Rev. 05) 12. recaution for Use (4) Cleaning Use Isopropyl Alcohol as a solvent for cleaning the LEs. Using other solvents may dissolve the LE package and the epoxy. Caution is needed. Ultrasonic cleaning of the LEs should not be done. (4) Others Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using LEs with matrix drive. The electrode sections are plated with silver. Those will become discolored by contact with corroded gas etc. recautions must be taken to maintain a clean storing atmosphere. The LEs light output is strong enough to injure human eyes. recautions must be taken to prevent looking directly at the LEs with unaided eyes for more than a few seconds. These LEs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliance). Consult OWERLIGHTEC s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEs may directly jeopardize life or health. (such as airplanes, aerospace, automobiles, traffic control equipment, life support systems and safety devices) User shall not reverse engineer by disassembling or analysis of the LEs without having the prior written consent of OWERLIGHTEC. When defective LEs are found, User shall inform to OWERLIGHTEC directly before disassembling or analysis. The formal specifications must be exchanged and signed by both parties before large volume purchase begins. The appearance and specifications of the product may be modified for improvement without notice. 16 / 16