Rev. 06 6 March 2006 Product data sheet. General description 2. Features 3. Quick reference data The is a high-performance BiCMOS product designed for V CC operation at 3.3 V. This device combines low static and dynamic power dissipation with high speed and high output drive. The device is a quad buffer that is ideal for driving bus lines. The device features four output enable inputs (OE, 2OE, 3OE and 4OE), each controlling one of the 3-state outputs. Quad bus interface 3-state buffers Output capability: +64 m and 32 m TTL input and output switching levels Input and output interface capability to systems at 5 V supply Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs Live insertion and extraction permitted No bus current loading when output is tied to 5 V bus Power-up 3-state Latch-up protection: JESD78: exceeds 500 m ESD protection: MIL STD 883 method 305: exceeds 2000 V Machine model: exceeds 200 V Table. Quick reference data GND = 0 V; T amb =25 C. Symbol Parameter Conditions Min Typ Max Unit t PLH LOW-to-HIGH propagation C L = 50 pf; V CC = 3.3 V - 2.7 - ns delay n to ny t PHL HIGH-to-LOW propagation delay n to ny C L = 50 pf; V CC = 3.3 V - 2.9 - ns
4. Ordering information Table. Quick reference data continued GND = 0 V; T amb =25 C. Symbol Parameter Conditions Min Typ Max Unit C i input capacitance V I = 0 V or 3.0 V - 4 - pf C o output capacitance outputs disabled; - 8 - pf V O = 0 V or 3.0 V I CC quiescent supply current outputs disabled; V CC = 3.6 V - 0.3 - m Table 2. Type number Ordering information Package Temperature range Name Description Version 74LVT25D 40 C to +85 C SO4 plastic small outline package; 4 leads; SOT08- body width 3.9 mm 74LVT25DB 40 C to +85 C SSOP4 plastic shrink small outline package; 4 leads; SOT337- body width 5.3 mm 74LVT25PW 40 C to +85 C TSSOP4 plastic thin shrink small outline package; 4 leads; SOT402- body width 4.4 mm 74LVT25BQ 40 C to +85 C DHVQFN4 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 3 0.85 mm SOT762-74LVTH25D 40 C to +85 C SO4 plastic small outline package; 4 leads; body width 3.9 mm 74LVTH25DB 40 C to +85 C SSOP4 plastic shrink small outline package; 4 leads; body width 5.3 mm 74LVTH25PW 40 C to +85 C TSSOP4 plastic thin shrink small outline package; 4 leads; body width 4.4 mm 74LVTH25BQ 40 C to +85 C DHVQFN4 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 3 0.85 mm SOT08- SOT337- SOT402- SOT762- Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 2 of 6
5. Functional diagram 2 OE Y 3 2 EN 3 5 4 2 2OE 2Y 6 5 4 6 9 0 2 3 3 3OE 4 4OE 3Y 4Y 8 9 0 2 3 mna229 8 mna228 Fig. Logic symbol Fig 2. IEC logic symbol n ny noe mna227 Fig 3. Logic diagram 6. Pinning information 6. Pinning OE 4 V CC terminal index area OE VCC 2 3 4OE 4 2 3 4OE Y 3 2 4 Y 3 2 4 2OE 2 2Y 4 5 6 25 0 9 4Y 3OE 3 2OE 2 2Y 4 25 5 GND () 0 6 9 7 8 4Y 3OE 3 GND 7 8 3Y GND 3Y 00aac477 00aac476 Transparent top view Fig 4. Pin configuration SO4, SSOP4 and TSSOP4 Fig 5. () The die substrate is attached to the exposed die pad using conductive die attach material. It can not be used as a supply pin or input. Pin configuration DHVQFN4 Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 3 of 6
6.2 Pin description Table 3. Pin description Symbol Pin Description OE output enable input (active LOW) 2 data input Y 3 data output 2OE 4 2 output enable input (active LOW) 2 5 2 data input 2Y 6 2 data output GND 7 ground (0 V) 3Y 8 3 data output 3 9 3 data input 3OE 0 3 output enable input (active LOW) 4Y 4 data output 4 2 4 data input 4OE 3 4 output enable input (active LOW) V CC 4 supply voltage 7. Functional description 7. Function table Table 4. Function table [] Control Input Output noe n ny L L L H H H X Z [] H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF-state. Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 4 of 6
8. Limiting values Table 5. Limiting values In accordance with the bsolute Maximum Rating System (IEC 6034). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage 0.5 +4.6 V V I input voltage [] 0.5 +7.0 V V O output voltage output in OFF-state or [] 0.5 +7.0 V HIGH-state I IK input clamping current V I <0V - 50 m I OK output clamping current V O <0V - 50 m I O output current output in LOW-state - 28 m output in HIGH-state - 64 m T stg storage temperature 65 +50 C T j junction temperature [2] - 50 C [] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit V CC supply voltage 2.7-3.6 V V I input voltage 0-5.5 V V IH HIGH-state input voltage 2.0 - - V V IL LOW-state input voltage - - 0.8 V I OH HIGH-state output current - - 32 m I OL LOW-state output current none - - 32 m current duty cycle 50 %; - - 64 m f khz t/ V input transition rise and 0-0 ns/v fall rate T amb ambient temperature in free air 40 - +85 C Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 5 of 6
0. Static characteristics Table 7. Static characteristics t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit T amb = 40 C to +85 C [] V IK input clamping voltage I IK = 8 m; V CC = 2.7 V - 0.9.2 V V OH HIGH-state output voltage I OH = 00 µ; V CC 0.2 V CC 0. - V V CC = 2.7 V to 3.6 V I OH = 8 m; V CC = 2.7 V 2.4 2.5 - V I OH = 32 m; V CC = 3.0 V 2.0 2.2 - V V OL LOW-state output voltage V CC = 2.7 V I OL = 00 µ - 0. 0.2 V I OL = 24 m - 0.3 0.5 V V CC = 3.0 V I OL = 6 m - 0.25 0.4 V I OL = 32 m - 0.3 0.5 V I OL = 64 m - 0.4 0.55 V I LI input leakage current all input pins V CC = 0 V or 3.6 V; V I = 5.5 V - 0 µ control pins V CC = 3.6 V; V I =V CC or GND - ±0. ± µ data pins V CC = 3.6 V [2] V I =V CC - 0. µ V I =0V - 5 µ I OFF power-off leakage current V CC = 0 V; V I or V O = 0 V to 4.5 V - ±00 µ I HOLD bus hold current data input V CC = 3 V [3] V I = 0.8 V 75 50 - µ V I = 2.0 V 75 50 - µ V CC = 0 V to 3.6 V V I = 3.6 V ±500 - - µ I EX external current into output output in HIGH-state when - 60 25 µ V O >V CC ; V O = 5.5 V and V CC = 3.0 V I O(pu/pd) power-up/power-down output current V CC.2 V; V O = 0.5 V to V CC ; V I = GND or V CC ; noe = don t care [4] - ± ±00 µ I OZ OFF-state output current V CC = 3.6 V; V I =V IH or V IL output HIGH: V O = 3.0 V - 5 µ output LOW: V O = 0.5 V - 5 µ I CC quiescent supply current V CC = 3.6 V; V I = GND or V CC ; I O =0 outputs HIGH - 0.3 0.9 m outputs LOW - 2 7 m outputs disabled [5] - 0.3 0.9 m Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 6 of 6
Table 7. Static characteristics continued t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit [6] - 0. 0.2 m I CC additional quiescent supply current [] Typical values are measured at V CC = 3.3 V and T amb =25 C. [2] Unused pins at V CC or GND. [3] This is the bus hold overdrive current required to force the input to the opposite logic state. [4] This parameter is valid for any V CC between 0 V and.2 V with a transition time of up to 0 ms. From V CC =.2 V to V CC = 3.0 V to 3.6 V a transition time of 00 µs is permitted. This parameter is valid for T amb =25 C only. [5] I CC is measured with outputs pulled to V CC or GND. [6] This is the increase in supply current for each input at the specified voltage level other than V CC or GND.. Dynamic characteristics per input pin; V CC = 3 V to 3.6 V; one input at V CC 0.6 V and other inputs at V CC or GND C i input capacitance V I = 0 V or 3.0 V - 4 - pf C o output capacitance outputs disabled; - 8 - pf V O = 0 V or 3.0 V Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter Conditions Min Typ Max Unit T amb = 40 C to +85 C [] t PLH LOW-to-HIGH propagation delay nn to ny see Figure 6 V CC = 2.7 V - - 4.5 ns V CC = 3.0 V to 3.6 V.0 2.7 4.0 ns t PHL HIGH-to-LOW propagation delay nn to ny see Figure 6 V CC = 2.7 V - - 4.9 ns V CC = 3.0 V to 3.6 V.0 2.9 3.9 ns t PZH output enable time noe to ny see Figure 7 V CC = 2.7 V - - 6.0 ns V CC = 3.0 V to 3.6 V.0 3.4 4.7 ns t PZL output enable time noe to ny see Figure 7 V CC = 2.7 V - - 6.5 ns V CC = 3.0 V to 3.6 V. 3.4 4.7 ns t PHZ output disable time noe to ny see Figure 7 V CC = 2.7 V - - 5.7 ns V CC = 3.0 V to 3.6 V.8 3.7 5. ns t PLZ output disable time noe to ny see Figure 7 V CC = 2.7 V - - 4.0 ns V CC = 3.0 V to 3.6 V.3 2.6 4.5 ns [] Typical values are at V CC = 3.3 V and T amb =25 C. Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 7 of 6
2. Waveforms V I n input GND t PLH t PHL V OH ny output V OL mnb072 Fig 6. =.5 V. V OL and V OH are typical voltage output drop that occur with the output load. Propagation delay input (n) to output (ny) V I noe input GND t PZL t PLZ V CC ny output V OL + 0.3 V ny output V OL V OH 0 V t PZH t PHZ V OH 0.3 V 00aac475 Fig 7. =.5 V. V OL and V OH are typical voltage output drop that occur with the output load. Enable and disable times of 3-state outputs Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 8 of 6
V I negative pulse 0 V 90 % 0 % t W t f t r t r t f V I positive pulse 0 V 0 % 90 % t W V EXT V CC PULSE GENERTOR V I DUT V O RL RT CL RL 00aae235 Fig 8. Test data is given in Table 9. Definitions test circuit: R L = Load resistor. C L = Load capacitance including jig and probe capacitance. R T = Termination resistance should be equal to output impedance Z o of the pulse generator. V EXT = Test voltage for switching times. Load circuitry for switching times Table 9. Test data Input Load V EXT V I f i t W t r, t f C L R L t PHZ, t PZH t PLZ, t PZL t PLH, t PHL 2.7 V 0 MHz 500 ns 2.5 ns 50 pf 500 Ω GND 6 V open Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 9 of 6
3. Package outline SO4: plastic small outline package; 4 leads; body width 3.9 mm SOT08- D E X c y H E v M Z 4 8 Q pin index 2 ( ) 3 θ L p 7 L e b p w M detail X 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max..75 2 3 b p c D () E () e H () E L L p Q v w y Z 0.25 0.0 0.069 0.00 0.004.45.25 0.057 0.049 0.25 0.0 0.49 0.36 0.09 0.04 0.25 0.9 0.000 0.0075 8.75 8.55 0.35 0.34 Note. Plastic or metal protrusions of 0.5 mm (0.006 inch) maximum per side are not included. 4.0 3.8 0.6 0.5.27 0.05 6.2 5.8 0.244 0.228.05 0.04.0 0.4 0.039 0.06 0.7 0.6 0.028 0.024 0.25 0.25 0. 0.0 0.0 0.004 θ 0.7 0.3 o 8 o 0.028 0 0.02 OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT08-076E06 MS-02 99-2-27 03-02-9 Fig 9. Package outline SOT08- (SO4) Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 0 of 6
SSOP4: plastic shrink small outline package; 4 leads; body width 5.3 mm SOT337- D E X c y H E v M Z 4 8 Q 2 ( ) 3 pin index 7 L detail X L p θ e b p w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E () e H E L L p Q v w y Z() max. mm 2 0.2 0.05.80.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 7.9.03 0.9 0.65.25 0.2 7.6 0.63 0.7 0.3 0..4 0.9 θ o 8 o 0 Note. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT337- MO-50 99-2-27 03-02-9 Fig 0. Package outline SOT337- (SSOP4) Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 of 6
TSSOP4: plastic thin shrink small outline package; 4 leads; body width 4.4 mm SOT402- D E X c y H E v M Z 4 8 pin index 2 Q ( ) 3 θ 7 e b p w M L detail X L p 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E (2) e H () E L L p Q v w y Z max. mm. 0.5 0.05 0.95 0.80 0.25 0.30 0.9 0.2 0. 5. 4.9 4.5 4.3 0.65 6.6 6.2 0.75 0.50 0.4 0.3 0.2 0.3 0. 0.72 0.38 θ o 8 o 0 Notes. Plastic or metal protrusions of 0.5 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT402- MO-53 EUROPEN PROJECTION ISSUE DTE 99-2-27 03-02-8 Fig. Package outline SOT402- (TSSOP4) Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 2 of 6
DHVQFN4: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 x 3 x 0.85 mm SOT762- D B E c terminal index area detail X terminal index area e e b 2 6 v M w M C C B y C C y L 7 E h e 4 8 3 9 D h X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT () max. b c D () D h E () E h e e L v w y y mm 0.05 0.00 0.30 0.8 0.2 3. 2.9.65.35 2.6 2.4.5 0.85 0.5 2 0.5 0.3 0. 0.05 0.05 0. Note. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT762- - - - MO-24 - - - EUROPEN PROJECTION ISSUE DTE 02-0-7 03-0-27 Fig 2. Package outline SOT762- (DHVQFN4) Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 3 of 6
4. bbreviations Table 0. cronym CMOS DUT ESD TTL bbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Transistor-Transistor Logic 5. Revision history Table. Revision history Document ID Release date Data sheet status Change notice Supersedes 20060306 Product data sheet - 74LVT25_5 (9397 750 4703) Modifications: Section 4: dded type numbers 74LVTH25D, 74LVTH25DB, 74LVTH25PW and 74LVTH25BQ. 74LVT25_5 2005020 Product data sheet - 74LVT25_4 (9397 750 4552) 74LVT25_4 20050207 Product data sheet - 74LVT25_3 (9397 750 3535) 74LVT25_3 20040624 Product data sheet - 74LVT25_2 (9397 750 0354) 74LVT25_2 998029 Product specification - 74LVT25_ 74LVT25_ - - - - Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 4 of 6
6. Legal information 6. Data sheet status Document status [][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 6.2 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet short data sheet is an extract from a full data sheet with the same product type number(s) and title. short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 6.3 Disclaimers General Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer s own risk. pplications pplications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the bsolute Maximum Ratings System of IEC 6034) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 6.4 Trademarks Notice: ll referenced brands, product names, service names and trademarks are the property of their respective owners. 7. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com Koninklijke Philips Electronics N.V. 2006. ll rights reserved. Product data sheet Rev. 06 6 March 2006 5 of 6
8. Contents General description...................... 2 Features............................... 3 Quick reference data..................... 4 Ordering information..................... 2 5 Functional diagram...................... 3 6 Pinning information...................... 3 6. Pinning............................... 3 6.2 Pin description......................... 4 7 Functional description................... 4 7. Function table.......................... 4 8 Limiting values.......................... 5 9 Recommended operating conditions........ 5 0 Static characteristics..................... 6 Dynamic characteristics.................. 7 2 Waveforms............................. 8 3 Package outline........................ 0 4 bbreviations.......................... 4 5 Revision history........................ 4 6 Legal information....................... 5 6. Data sheet status...................... 5 6.2 Definitions............................ 5 6.3 Disclaimers........................... 5 6.4 Trademarks........................... 5 7 Contact information..................... 5 8 Contents.............................. 6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. Koninklijke Philips Electronics N.V. 2006. ll rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 6 March 2006 Document identifier: