MC32, MC32 Quad 2 Input NAND Schmitt Trigger The MC/32 contains four 2 input NAND gates which are capable of transforming slowly changing input signals into sharply defined, jitter free output signals. In addition, they have greater noise margin than conventional NAND gates. Each circuit contains a 2 input Schmitt trigger. The Schmitt trigger uses positive feedback to effectively speed up slow input transitions, and provide different input threshold voltages for positive and negative-going transitions. This hysteresis between the positive going and negative going input threshold is determined by resistor ratios and is essentially insensitive to temperature and supply voltage variations. Features Schmitt Trigger Inputs Outputs Source/Sink 24 ma ACT32 Has TTL Compatible Inputs Pb Free Packages are Available 4 4 4 PDIP 4 N SUFFIX CASE 646 D SUFFIX CASE 75A SOEIAJ 4 M SUFFIX CASE 965 4 3 2 0 9 8 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 2 3 4 5 6 7 GND Figure. Pinout; 4 Lead Packages Conductors (Top iew) FUNCTION TABLE Inputs Output A B Y L L H L H H H L H H H L H = HIGH oltage Level L = LOW oltage Level Semiconductor Components Industries, LLC, 2006 Publication Order Number: MC32/D
MC32, MC32 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Supply oltage AC 2.0 5.0 6.0 ACT 4.5 5.0 5.5 in, out DC Input oltage, Output oltage (Ref. to GND) 0 t r, t f Input Rise and Fall Time (Note ) AC Devices except Schmitt Inputs t r, t f Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs @ 3.0 50 @ 4.5 40 ns/ @ 5.5 25 @ 4.5 0 @ 5.5 8.0 T J Junction Temperature (PDIP) 40 C T A Operating Ambient Temperature Range 40 25 85 C I OH Output Current High 24 ma I OL Output Current Low 24 ma. in from 30% to 70% ; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. in from 0.8 to 2.0 ; see individual Data Sheets for devices that differ from the typical input rise and fall times. ns/ DC CHARACTERISTICS Symbol Parameter OH Minimum High Level Output oltage Typ T A = 40 C to +85 C Guaranteed Limits Conditions 3.0 2.99 2.9 2.9 I OUT = 50 A 4.5 4.49 4.4 4.4 5.5 5.49 5.4 5.4 OL Maximum Low Level Output oltage * IN = IL or IH 3.0 2.56 2.46 2 ma 4.5 3.86 3.76 I OH 24 ma 5.5 4.86 4.76 24 ma 3.0 0.002 0. 0. I OUT = 50 A 4.5 0.00 0. 0. 5.5 0.00 0. 0. I IN Maximum Input Leakage Current * IN = IL or IH 3.0 0.36 0.44 2 ma 4.5 0.36 0.44 I OL 24 ma 5.5 0.36 0.44 24 ma 5.5 ±0. ±.0 A I =, GND I OLD Minimum Dynamic 5.5 75 ma OLD =.65 Max I OHD Output Current 5.5 75 ma OHD = 3.85 Min I CC Maximum Quiescent Supply Current 5.5 4.0 40 A IN = or GND *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: I IN and I CC @ 3.0 are guaranteed to be less than or equal to the respective limit @ 5.5. 2
MC32, MC32 AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL38/D) Symbol t PLH t PHL Propagation Delay Propagation Delay *oltage Range 3.3 is 3.3 ±0.3. oltage Range 5.0 is 5.0 ±0.5. Parameter * T A = 40 C to +85 C Min Typ Max Min Max 3.3 2.0 3.0.5 4.0 5.0 2.0 9.0.5 0.0 3.3 2.0 3.5.5 5.0 5.0 2.0 9.0.5 0.0 ns ns Fig. No. 3 5 3 5 DC CHARACTERISTICS Symbol Parameter T A = 40 C to +85 C Conditions Typ Guaranteed Limits OH Minimum High Level Output oltage 4.5 4.49 4.4 4.4 5.5 5.49 5.4 5.4 I OUT = 50 A OL Maximum Low Level Output oltage * IN = IL or IH 4.5 3.86 3.76 24 ma I 5.5 4.86 4.76 OH 24 ma 4.5 0.00 0. 0. I OUT = 50 A 5.5 0.00 0. 0. I IN Maximum Input Leakage Current * IN = IL or IH 4.5 0.36 0.44 24 ma I 5.5 0.36 0.44 OL 24 ma 5.5 ±0. ±.0 A I =, GND I CCT Additional Max. I CC /Input 5.5 0.6.5 ma I = 2. I OLD Minimum Dynamic 5.5 75 ma OLD =.65 Max I OHD Output Current 5.5 75 ma OHD = 3.85 Min I CC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. 5.5 4.0 40 A IN = or GND AC CHARACTERISTICS (For Figures and Waveforms See Section 3 of the ON Semiconductor FACT Data Book, DL38/D) Symbol Parameter * T A = 40 C to +85 C Min Typ Max Min Max t PLH Propagation Delay 5.0 3.0.5 2.5 3.0 ns 3 6 t PHL Propagation Delay 5.0 3.0.0 2.5 2.5 ns 3 5 *oltage Range 5.0 is 5.0 ±0.5. Fig. No. 3
MC32, MC32 INPUT CHARACTERISTICS (unless otherwise specified) Symbol Parameter Test Conditions 3.0 2.2 Maximum Positive t + 4.5 3.2 2.0 T Threshold A = Worst Case 5.5 3.9 3.0 0.5 Minimum Negative t 4.5 0.9 0.8 T Threshold A = Worst Case 5.5. 3.0.2 h(max) Maximum Hysteresis 4.5.4.2 T A = Worst Case 5.5.6 3.0 0.3 h(min) Minimum Hysteresis 4.5 0.4 0.4 T A = Worst Case 5.5 0.5 CAPACITANCE Symbol Parameter alue Typ Test Conditions C IN Input Capacitance 4.5 pf = 5.0 C PD Power Dissipation Capacitance 30 pf = 5.0 4
MC32, MC32 MARKING DIAGRAMS 4 PDIP 4 MC32N AWLYYWWG 4 AC32G AWLYWW 4 SOEIAJ 4 32 ALYWG 4 MC32N AWLYYWWG 4 ACT32G AWLYWW 4 32 ALYWG A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = Pb Free Package ORDERING INFORMATION Device Package Shipping MC32N MC32NG MC32N MC32NG MC32D MC32DG MC32DR2 MC32DR2G MC32D MC32DG MC32DR2 MC32DR2G MC32MEL MC32MELG MC32MEL MC32MELG PDIP 4 PDIP 4 PDIP 4 PDIP 4 SOEIAJ 4 SOEIAJ 4 SOEIAJ 4 SOEIAJ 4 25 s/rail 55 s/rail 2500/Tape & Reel 55 s/rail 2500/Tape & Reel 2000/Tape & Reel 5
MC32, MC32 PACKAGE DIMENSIONS CASE 75A 03 ISSUE H T SEATING PLANE A 4 8 G 7 B P 7 PL 0.25 (0.00) M B M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.27 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES C R X 45 F DIM MIN MAX MIN MAX A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.50 0.57 C.35.75 0.054 0.068 D 0.35 0.49 0.04 0.09 D 4 PL K M J F 0.40.25 0.06 0.049 G.27 BSC 0.050 BSC 0.25 (0.00) M T B S A S J 0.9 0.25 0.008 0.009 K 0.0 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.00 0.09 SOLDERING FOOTPRINT* 4X 0.58 7X 7.04 4X.52.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7