www.osram-os.com Produktdatenblatt Version 1.1 CHIPLED Silicon NPN Phototransistor with Vλ Characteristics Applications Accent (BAR) Area Lights Backlighting (Smartphone, Tablet) Electronic Equipment Features: Package: clear epoxy ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) Spectral range of sensitivity: (typ) 350... 950 nm Adapted to human eye sensitivity (V λ ) Very small SMT package Ordering Information Type Photocurrent Ordering Code V CE = 5 V; λ = 560 nm; E e = 0.01 mw/cm² I PCE -Z 2.5... 12.5 µa Q65110A3107-3/4-Z 4.0... 12.5 µa Q65110A3511-2/3-Z 2.5... 8.0 µa Q65110A3512 Single bins on request. 1 Version 1.4 2018-11-26
Maximum Ratings T A = 25 C Parameter Symbol Values Operating temperature T op min. max. Storage temperature T stg min. max. -40 C 85 C -40 C 85 C Collector-emitter voltage V CE max. 5.5 V Collector current I C max. 20 ma Emitter-collector voltage V EC max. 0.5 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) V ESD max. 2 kv 2 Version 1.4 2018-11-26
Characteristics T A = 25 C Parameter Symbol Values Wavelength of max sensitivity λ S max typ. 570 nm Spectral range of sensitivity λ 10% typ. 350... 950 nm Dimensions of chip area L x W typ. 0.75 x 0.75 mm x mm Radiant sensitive area A typ. 0.29 mm² Half angle φ typ. 60 Photocurrent V CE = 5 V; Std. Light A; E v = 1000 lx Dark current V CE = 5 V; E = 0 Collector-emitter saturation voltage 1) I C = I PCE,min X 0.3; E e = 0.01 mw/cm² Capacitance V CE = 0 V; f = 1 MHz; E = 0 Temperature coefficient of sensitivity λ = 550 nm Temperature coefficient of sensitivity Std. Light A I PCE typ. 350 µa I CE0 typ. max. 3 na 50 na V CEsat typ. 100 mv C CE typ. 4 pf TC I typ. 0.78 % / K TC I typ. 0.9 % / K 3 Version 1.4 2018-11-26
Grouping T A = 25 C Group Photocurrent Photocurrent V CE = 5 V; λ = 560 nm; E e = 0.01 mw/cm² V CE = 5 V; λ = 560 nm; E e = 0.01 mw/cm² min. max. I PCE I PCE 2 2.5 µa 5.0 µa 3 4.0 µa 8.0 µa 4 6.3 µa 12.5 µa Relative Spectral Sensitivity S rel = f (λ) 2), 3) S rel 100 % OHF04047 80 70 60 50 40 30 20 10 0 400 500 600 700 800 900 nm 1100 λ 4 Version 1.4 2018-11-26
Directional Characteristics S rel = f (φ) 2), 3) 40 30 20 10 ϕ 0 1.0 OHF01402 50 0.8 60 0.6 70 0.4 80 0.2 90 0 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 Photocurrent 2), 3) Photocurrent 2), 3) I PCE = f (E v ); I PCE = f (E v ); I PCE 10 2 ma OHF04055 I PCE rel 100 % OHF04056 10 1 80 10 0 70 60 10-1 50 10-2 40 30 10-3 20 10 10-4 10 0 10 1 10 2 10 3 10 4 lx 10 5 E V 0 10 0 10 1 10 2 10 3 10 4 lx 10 5 E V 5 Version 1.4 2018-11-26
Collector-Emitter Capacitance C CE = f (V CE ); f = 1 MHz; E = 0 ; 2), 3) C CE 4.0 pf OHF04052 3.0 2.5 2.0 1.5 1.0 0.5 0 10-3 10-2 10-1 10 0 10 1 V 10 2 V CE 6 Version 1.4 2018-11-26
Dimensional Drawing 4) 0.5 (0.020) 0.3 (0.012) GEOY7009 0.95 (0.037) 0.65 (0.026) 0.4 (0.016) 0.2 (0.008) 2.1 (0.083) 1.9 (0.075) 1.5 (0.059) 1.3 (0.051) Collector mark 1.35 (0.053) 1.15 (0.045) 1.0 (0.039) 0.8 (0.031) Approximate Weight: Package marking: 3.8 mg Collector 7 Version 1.4 2018-11-26
Recommended Solder Pad 4) 3.2 OHFP2578 1.25 1 Bauteil positioniert Component location on pad Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T 250 200 240 C 217 C t P t L T p OHA04525 245 C 150 t S 100 50 25 C 0 0 50 100 150 200 250 s 300 t 8 Version 1.4 2018-11-26
Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S 60 100 120 s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L 80 100 s Peak temperature T P 245 260 C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P 10 20 30 s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Taping 4) 9 Version 1.4 2018-11-26
Tape and Reel 5) W 1 D 0 P 0 P 2 P 1 F E W A N 13.0 ±0.25 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000 10 Version 1.4 2018-11-26
_< C). _< Avoid metal contact. Do not eat. If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units Barcode-Product-Label (BPL) Dry Packing Process and Materials 4) OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. If wet, parts still adequately dry. change desiccant WET Comparator check dot 15% 10% 5% CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 11 Version 1.4 2018-11-26
_< C). _< 11 0 0144 Bin3: ML 2 220 C R 2a 11 0 0144 ML 2 220 C R 2a Transportation Packing and Materials 4) Barcode label Barcode label CAUTION LEVEL This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours If blank, see bar code label OSRAM Opto Semiconductors 210021998 LSY T676 Multi TOPLED 240 C R 3 260 C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH1234 0 425 (Q)QTY: 2000 Bin1: P-1-20 Bin2: Q-1-20 Temp ST OSRAM Opto Semiconductors 210021998 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH1234 0 425 (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R 3 260 C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 12 Version 1.4 2018-11-26
Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes 13 Version 1.4 2018-11-26
Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 14 Version 1.4 2018-11-26
Glossary 1) IPCEmin: IPCEmin is the min. photocurrent of the specified group. 2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Testing temperature: TA = 25 C 4) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 5) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 15 Version 1.4 2018-11-26
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com All Rights Reserved. 16 Version 1.4 2018-11-26