n General Description The family allows the user to customize the CPU reset function without any external components. The user has a large choice of reset voltage thresholds, reset time intervals, and output driver configurations, all of which are preset at the factory. Each wafer is trimmed to the customer specifications. n Application l Portable Electronics l Power Supplies l Computer Peripherals l Data Acquisition Systems l Applicatiions using CPUs l Consumer Electronics These circuits monitor the power supply voltage of µp based systems. When the power supply voltage drops below the voltage threshold a reset is asserted immediately(within an interval T D1 ). The reset remains asserted after the supply voltage rises above the voltage threshold for a time interval, T D2. The reset output may be either active high (RESET) or active low (RESETB). The reset output may be configured as open drain. The state of the reset output is guaranteed to be correct for supply voltages greater than.9v. n Typical Application VIN GND RESET / RESETB RESET Input VIN Processor GND n Features n Functional Block Diagram l Internally Fixed Threshold 1.2V to 4.5V in.1v Step V IN l High Accuracy ± 1.5% l Low Supply Current 3µA l No External Components Required l Quick Reset within 2µs l Built-in Recovery Delay Include ms, 55ms, GND R1 R2 I1 V REF Delay N1 RESET/ RESETB 22ms, 45ms l Low Functional Supply Voltage.9V l N-Channel Open-Drain Output l Small SOT-23, TSOT-23A, SOT-143, SC-7-4, SOT-25 and TSOT-25A Package l RoHS Compliant and Halogen Free 1
n Pin Configuration SOT-23/TSOT-23A Top View SOT-23/TSOT-23A Top View 3 -AETxxxxxx 1. GND 3 -BETxxxxxx 1. RESET/RESETB 2. RESET/RESETB 3. IN 2. GND 3. IN 1 2 * Die Attach: Non-Conductive Epoxy 1 2 * Die Attach: Non-Conductive Epoxy SOT-23/TSOT-23A Top View SOT-143 Top View 3 -CETxxxxxx 4 3 -A4Uxxxxx 1. RESET/RESETB 1. GND 2. IN 3. GND 2. RESET/RESETB 3. NC 1 2 * Die Attach: Conductive Epoxy 1 2 4. IN * Die Attach: Conductive Epoxy SC-7-4 Top View SOT-25/TSOT-25A Top View 4 3 -AIUxxxxx 1. GND 5 4 -AEVxxxxxx 1. RESET/RESETB 2. RESET/RESETB 3. NC 2. IN 3. GND 4. IN 4. NC 1 2 1 2 3 5. NC * Die Attach: Non-Conductive Epoxy * Die Attach: Non-Conductive Epoxy 2
n Pin Description SOT-23 / A B C Pin No. TSOT-23A Pin Name Pin Description SOT-143 SC-7-4 SOT-25 / TSOT-25A 1 2 3 1 1 3 GND Ground. 2 1 1 2 2 1 RESET/ RESETB This pin can be ordered as RESET or RESETB. Reset is active high. RESETB is active low. It is also available with an open-drain. 3 3 2 4 4 2 IN Positive power supply. A reset is asserted after this voltage drops below a predetermined level. After V IN rises above that level the reset output remains asserted until the end of the reset timeout periold. N/A N/A N/A 3 3 4, 5 NC No connection. Not internally connected. Can left floating or connected to GND. 3
n Ordering Information - x x x x x xxx x Special Feature V IN Threshold Voltage (V TH ) Reset Time(T D2NOM ) Output Options Number of Pins Package Type Pin Configuration Pin Configuration Package Type Number of Pins Output Options Reset Time (T D2NOM ) V IN Threshold Voltage (V TH ) Special Feature A 1. GND E: SOT-2X T: 3 A: RESETB B: ms 12: 1.2V N/A: SOT-23/SOT-25 (SOT-23) 2. RESET/RESETB I: SC-7 U: 4 B: RESET C: 55ms 13: 1.3V K:.9mm max (TSOT-23A) 3. IN 4: SOT-143 V: 5 D: 22ms 14: 1.4V ( for TSOT-2XA Only) G: 45ms : : B 1. RESET/RESETB : : (SOT-23) 2. GND : : (TSOT-23A) 3. IN 48: 4.8V 49: 4.9V C 1. RESET/RESETB 5: 5.V (SOT-23) 2. IN (TSOT-23A) 3. GND A (SOT-143) 1. GND 2. RESET/RESETB 3. NC 4. IN A 1. RESET/RESETB (SOT-25) 2. IN (TSOT-25A) 3. GND 4. NC 5. NC A (SC-7-4) 1. GND 2. RESET/RESETB 3. NC 4. IN 4
n Absolute Maximum Ratings Parameter Maximum Unit Supply Voltage Input Current, V IN Output Current, RESET, RESETB 6 V 2 ma 2 ma ESD Classification HBM 2 kv MM 2 V n Recommended Operating Conditions Parameter Symbol Rating Unit Junction Temperature Range T J -4 to +125 Ambient Temperature Range T A -4 to +85 o C Storage Temperature Range T STG -65 to +15 5
n Thermal Information Parameter Package Die Attach Symbol Maximum Unit SOT-23 TSOT-23A Conductive Epoxy SOT-143 13 81 Thermal Resistance* (Junction to Case) SOT-23 SOT-25 θ JC 14 o C / W TSOT-23A TSOT-25A Non-Conductive Epoxy 13 Thermal Resistance (Junction to Ambient) SC-7-4 12 SOT-23 26 TSOT-23A Conductive Epoxy 23 SOT-143 35 SOT-23 SOT-25 θ JA 28 o C / W TSTO-23A TSOT-25A Non-Conductive Epoxy 25 SC-7-4 4 SOT-23 4 TSOT-23A Conductive Epoxy 455 SOT-143 285 Internal Power Dissipation SOT-23 SOT-25 P D 4 mw TSTO-23A TSOT-25A Non-Conductive Epoxy 4 SC-7-4 3 Lead Temperature ( soldering 1 sec)** 26 o C * Measure θ JC on backside center of molding compound if IC has no tab. ** MIL-STD-22G 21F 6
n Electrical Specifications T A =27 o C, unless otherwise specified. Parameter Operating V DD (V OUT ) Range Supply Current Reset Threshold Threshold Voltage Accuracy V DD Drop to Reset Delay Symbol Test Condition Min Typ Max Units V DD RESET.9 6 V RESET 1.1 6 I DD V DD =5V, T A =27 o C 3 8 µa V TH T A =27 o C 1.2 to 4.5 V V TH T A =27 o C -1.5 1.5 % t RD Drop=V TH -125mV 2 µs Reset Active Time Out Period Version B Version C t RP V DD 1.2 x V TH 35 55 75 Version D 143 22 297 Version G 292 45 68 ms V DD >V TH(MAX), I SINK =3.5mA, V TH 3V.4 RESET Output Voltage Low V OL V DD >V TH(MAX), I SINK =1.2mA, V TH 1.8V.3 V V DD >V TH(MAX), I SINK =.5mA, V TH 1.2V.3 V DD <V TH(MIN), I SINK =3.5mA, V TH 3V.4 RESET Output Voltage Low V OL V DD <V TH(MIN), I SINK =1.2mA, V TH 1.8V.3 V V TH(MIN) >V DD >1V, I SINK =.5mA.3 Hysteresis Width V HYS.1V TH V 7
n Characterization Curve Glitch Rejection Output Voltage vs. Input Voltage 12 1.2V 4.5V 1 8 Glitch Duration (us) 8 6 4 2 Output Voltage (V) 6 4 2.1.1 1 2 4 6 Glitch Amplitude (V) Input Voltage (V) Nch Driver Output Current vs VDS Nch Driver Output Current vs VDS V DD =1V V DD =1.1V V TH=1.2V VDD =1.5V V DD =2V V DD =2.5V V DD =3V Output Current (ma) 2.4 2 1.6 1.2.8.4.5 1 1.5 Output Current (ma) V DD =3.5V V DD =4V V DD =4.4V V TH =4.5V 14 12 1 8 6 4 2 1 2 3 4 5 VDS (V) VDS (V) Supply Current vs Input Voltage Supply Current vs Input Voltage 5-3 o C 25 o C 8 o C V TH=1.2V 1.8-3 o C 25 o C 8 o C V TH=4.5V Supply Current (ua) 4 3 2 1 Supply Current (ua) 1.6 1.4 1.2 1.8.6.4.2 1 2 3 4 5 6 1 2 3 4 5 6 7 Input Voltage (V) Input Voltage (V) 8
n Characterization Curve (Contd.) Power-Down Reset vs. Temperature Power-Down Reset vs. Temperature Power Down Reset Time-Out (us) 15 mv 2mV 25 mv VTH=1.2V 2 16 12 8 4-5 -25 25 5 75 1 125 Power Down Reset Time-Out (us) 15 mv 2mV 25 mv V TH =4.5V 35 3 25 2 15 1 5-5 -25 25 5 75 1 125 Temperature ( o C) Temperature ( o C) Reset Threshold Derivation vs. Temperature Nch Driver Sink Current vs. Input Voltage Reset Threshold (V) 6 5 4 3 2 1.2V 4.5V 2.9V Sink Current I SINK (ma) 6 5 4 3 2 1-3 o C 25 o C 8 o C VTH=4.5V, VDS=.5V 1-5 -25 25 5 75 1 125 1 2 3 4 5 Temperature ( o C) Input Voltage (V) Power-Up Reset Time-Out vs. Temperature Nch Driver Output Current vs VDS Power-Up Reset Time-Out (ms) 1 9 8 7 6 5 4 3 2 1-5 -25 25 5 75 1 125 Output Current (ma) VDS =1.5V V DS =2V V DS =2.5V V DS =3V V DS =3.5V V DS =4V V DS =4.5V V DS =5V V DS =5.5V V DS =6V 2 15 1 5 1 2 3 4 5 6 Temperature ( o C) VDS (V) 9
ºô³q² «~ n Characterization Curve (Contd.) Output Voltage vs. Input Voltage Threshold Voltage vs. Temperature 1.2V Rising Falling 1.5 1.2 Output Voltage (V) 1.2.9.6.3 Reset Threshold (V) 1.195 1.19 1.185 1.18 1.175 2 4 6 Input Voltage (V) 1.17-5 -25 25 5 75 1 125 Temperature ( o C) 1
n Tape and Reel Dimension SOT-23 P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT-23 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm TSOT-23-A P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size TSOT-23A 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm 11
n Tape and Reel Dimension (Contd.) SOT-143 P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT-143 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm SC-7-4 P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SC-7-4 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm 12
n Tape and Reel Dimension (Contd.) SOT-25 P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size SOT-25 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm TSOT-25A P W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Pitch (P) Part Per Full Reel Reel Size TSOT-25A 8.±.1 mm 4.±.1 mm 4.±.1 mm 3pcs 18±1 mm 13
n Package Dimension SOT-23 Top View Side View D E H e L Front View A b A1 n Lead Pattern Drawing.8 BSC 1. BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance ±.5mm unless otherwise specified. 1.9 BSC 14
n Package Dimension (Contd.) TSOT-23A E1 b D E L.25 SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A.7.9.28.35 A1..1..4 A2.7.8.28.31 b.35.5.14.2 c.8.2.3.8 e e1 TOP VIEW REAR VIEW A1 A2 A c SIDE VIEW D 2.82 3.2.111.119 E 1.6 1.7.63.67 E1 2.65 2.95.14.116 e e1.95 BSC 1.9 BSC.37 BSC.75 BSC L.3.6.12.24 θ o 8 o o 8 o n Lead Pattern Drawing.8 BSC 1. BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance ±.5mm unless otherwise specified. 1.9 BSC 15
n Package Dimension (Contd.) SOT-143 e e1 L E1 E d b1 1 place D TOP VIEW b x3 place L1 c.25 SIDE VIEW A2 A SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX FRONT VIEW A1 A.9 1.15.35.45 A1..1..4 A2.9 1.5.35.41 b.3.5.12.2 b1.75.9.3.35 c.8.15.3.6 D 2.8 3..11.118 d.2 TYP.8 TYP E 1.2 1.4.47.55 E1 2.25 2.55.89.1 e.95 TYP.37 TYP e1 1.8 2..71.79 L.55 REF..22 REF L1.3.5.12.2 θ o 8 o o 8 o 16
n Package Dimension (Contd.) SC-7-4 D e1 e L SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A.9 1.1.35.43 A1..1..4 E1 E A2.9 1..35.39 b.25.4.1.16 b d b1 L1 c.2 b1.35.5.14.2 c.8.15.3.6 d.5 TYP.2 TYP TOP VIEW SIDE VIEW D 2. 2.2.79.87 E 1.15 1.35.45.53 E1 2.15 2.45.85.96 e.65 TYP.26TYP A2 A e1 1.2 1.4.47.55 L.525 REF.21 REF FRONT VIEW A1 L1.26.46.1.18 θ o 8 o o 8 o n Lead Pattern Drawing 1.3 BSC Note: 1. Lead pattern unit description:.8 BSC.45 BSC 1.94 BSC BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance ±.5mm unless otherwise specified..35 BSC.5REF 17
n Package Dimension (Contd.) SOT-25 Top View Side View D H E S1 e L Front View A b A1 n Lead Pattern Drawing.7 BSC 1. BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance ±.5mm unless otherwise specified..95 BSC.95 BSC 1.9 BSC 18
n Package Dimension (Contd.) TSOT-25A D b L.25 SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A.7.9.28.35 A1..1..4 E1 E A2.7.8.28.31 b.35.5.14.2 e e1 TOP VIEW A1 A2 A c SIDE VIEW c.8.2.3.8 D 2.82 3.2.111.119 E 1.6 1.7.63.67 E1 2.65 2.95.14.116 e e1.95 BSC 1.9 BSC.37 BSC.75 BSC REAR VIEW L.3.6.12.24 θ o 8 o o 8 o n Lead Pattern Drawing.7 BSC 1. BSC 2.4 BSC Note: 1. Lead pattern unit description: BSC: Basic. Represents theoretical exact dimension or dimension target. 2. Dimensions in Millimeters. 3. General tolerance ±.5mm unless otherwise specified..95 BSC.95 BSC 1.9 BSC 19
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