SMD Type LED ISCL-T21RGBB APPROVAL SHEET CUSTOMER : DEVICE NAME : 528 RGB LED MODEL NO. : ISCL-T21RGBB [ISCL-T21RGBB] ISSUED DATE : 2007.10 [ CUSTOMER APPROVAL ] APPROVAL NO. APPROVAL DATE APPROVAL INSPECTOR CHECK APPROVAL COMMENT ISSUED DEPT. ISSUE R&D REVIEW QA APPR D ILJIN SEMICONDUCTOR CO., LTD. 112-26 Annyung-dong, Hwasung-Si, Kyunggi-do, Korea TEL : 82-1-20-540, FAX : 82-1-20-550
ISCL-T21RGBB P A G E 1 / 16 - CONTENTS - 1. REVISION HISTORY 2. FEATURES. OUTLINE DIMENSIONS 4. SPECIFICATIONS 5. RANKS 6. COMPOSITION OF PACKAGE 7. ENVIRONMENTAL POLLUTION FREE 8. TYPICAL ELECTRICAL / OPTICAL CHARACTERISTICS CURVES 9. CLASSIFICATION BY NAME 10. RELIABILITY 11. TAPING 12. PACKING 1. CAUTIONS KQSP-07-10-01-IR
ISCL-T21RGBB P A G E 2 / 16 1. Revision history Spec. No. Title Specification for Approval Times Date Summary of revision Remarks 1 2 2007. 10. 2011.04 2011.04 New establishment Environmental Pollution Free Modification Reliability Modification
ISCL-T21RGBB P A G E / 16 2. FEATURES SMD type Colored Diffusion Chip Based on InGaN, InGaAlP High Luminous Intensity Very Wide Viewing Angle Package Size :.5mm 2.8mm 1.9mm Reliability Test completed [ISCL-T21RGBB]. OUTLINE DIMENSIONS (Unit : mm)
ISCL-T21RGBB P A G E 4 / 16 4. SPECIFICATIONS (1) Absolute Maximum Rating (Ta=25 ) Parameter Symbol Value Unit Forward Current I F 60 ma Pulse Forward Current 1 I FP 00 ma Reverse Voltge V R 5 V Power Dissipation P D 220 mw Operating Temperature Topr -40 to +85 Storage Temperature Tstg -40 to +100 Soldering temperature 1 : Duty Ratio 1/10, Pulse Width 10 msec Tsol Reflow Soldering : 260, 10 sec Hand Soldering : 50, sec (2) Electrical / Optical Characteristics (Ta=25 ) Forward Voltage Parameter Symbol Condition Min Typ Max Unit Red 2.0-2.4 Dominant Wavelength V F λ D Green I F=20mA.0 -.4 V Blue 2.8 -.4 Reverse Current I R V R=5V - - 10 μa Red 400-600 Luminous Intensity 2 I V Green I F=20mA 1,000-1,400 mcd Blue 200-400 Viewing Angle 2θ 1/2 I F=20mA - 120 - deg. Red 625-60 Green I F=20mA 525-50 nm Blue 460-465 2 : Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. Please refer to rank table. : θ 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
5. RANKS ISCL-T21RGBB P A G E 5 / 16 (1) Luminous Intensity Ranks IV Rank Chip Count Condition Color Min Typ Max Unit T004D Red 400 600 T010D 1,000 1,200 1Chip I F = 20mA Green T012D 1,200 1,400 mcd T002D Blue 200-400 Measurement Uncertainty of the Luminous Intensity : ± 12% (2) Forward Voltage Ranks (Ta=25 ) VF Rank Condition Color Min Typ Max Unit V202 2.0-2.2 Red V222 2.2-2.4 V02.0 -.2 Green V22 I F = 20mA.2 -.4 V282 2.8 -.0 V02 Blue.0 -.2 V22.2 -.4 V Measurement Uncertainty of the Forward Voltage : ± 0.1V () Wavelength Rank λp Rank Condition Red Green Blue Min Max Min Max Min Max Unit A I F = 20mA 625 60 525 50 460 465 nm
ISCL-T21RGBB P A G E 6 / 16 6. Composition of Package 1 4 5 2 (1) Component material Number Item Material 1 Encapsulant Silicone 2 Electrodes Ag Plating Cu Alloy Die adhesive Ag Epoxy/Clear Epoxy 4 LED Chip InGaN, InGaAlP 5 Wire Gold
ISCL-T21RGBB P A G E 7 / 16 7. Environmental Pollution Free (1) Testing Institute : Korea Environment & Merchandise Testing Institute (2) Test Material : LED-PCB Resin, Metal Resin Test Test Item Unit Result Test Method Pb mg/kg No Detection Cd mg/kg No Detection Hg mg/kg No Detection Cr +b mg/kg No Detection PBB S mg/kg No Detection ISO 6101-2 (AAS) EN 1122 (ICP) ISO 856/7 (AAS) ISO 856/5 UV-Vis. Spectrophotometer PBDE S mg/kg No Detection Metal Test Test Item Unit Result Test Method Pb mg/kg No Detection Cd mg/kg No Detection Hg mg/kg No Detection Cr +b μg /kg No Detection PBB S mg/kg No Detection ISO 4749-98 ISO 5960-84 JIS H 1066-9 ICP analysis method ISO 61:2000(E) PBDE S mg/kg No Detection
ISCL-T21RGBB P A G E 8 / 16 8. Typical Electrical / Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) Forward Voltage Vs. Forward Current Forward Current Vs. Relative Luminosity Forward Current I F (ma) 10 2 5 10 1 5 Relative Luminosity Iv(ratio) 10 1 5 1 5 1 1.0 1.5 2.0 2.5.0.5 4.0 Forward Voltage V F (V) 1 5 10 20 0 50 100 Forward Current I F (ma) Forward Current Derating Curve Relative Luminosity Vs. Ambient Temperature 10 1 Relative Luminosity Iv(ratio) 5 1 5 1-20 0 20 40 60 80 100 Ambient Temperature Ta (ºC)
ISCL-T21RGBB P A G E 9 / 16 Directivity 0 º 20 º 10 º 0 º 50 º 40º 80 º 70 º 60 º 90 º 100 80 60 40 20 0 Relative Luminosity Iv(%) Relative Luminous Intensity vs. Wavelength 100 Relative Luminosity Iv(%) 80 60 40 20 0 400 450 500 550 600 650 Wavelength λ (nm) 700
9. Classification by name ISCL-T21RGBB P A G E 10 / 16 PART NO.>> ISCL 5 4 1 ILJIN Semiconductor Chip LED LAMP 2 PACKAGE TYPE S11 812 Side View LED, T=0.8mm T21 528 Top View LED, T=1.9mm S12 812 Side View LED, T=0.6mm T22 528 Top View LED, T=1.0mm S1 810 Side View LED, T=0.4mm T2 528 Top View LED, T=0.9mm S14 810 Side View LED, T=0.6mm T1 020 Top View LED, T=1.mm S15 709 Side View LED, T=0.4mm T2 020 Top View LED, T=0.8mm S16 5508 Side View LED, T=0.8mm T6 014 Top View LED, T=0.8mm S17 5506 Side View LED, T=0.6mm T41 1615 Top View LED, T=0.4mm S60 606 Side View LED, T=.0mm T51 560 Top View LED, T=1.0mm T10 5450 Top View LED, T=2.2mm T52 5620 Top View LED, T=0.8mm T11 5450 Top View LED, T=1.6mm P 55 Power LED (1W, 2W) T12 5450 Top View LED, T=0.9mm P5 560 Power LED (1W) P55 5450 Power LED (1W) EMISSION COLOR B G Y O A R W X I S Blue P-Green Yellow Orange Amber Red White Y-Green Infrared Sky Blue 4 LENS COLOR A Colored Transparency C Colored Diffusion B Colorless Transparency D Milky Diffusion 5 COLOR RENDERING INDEX Mark 00S 70S 75S 80S 85S 90S 95S CRI (Ra) 60~69.9 70~74.9 75~79.9 80~84.9 85~89.9 90~94.9 95~97 Refer to Rank Sheet
ISCL-T21RGBB P A G E 11 / 16 10. RELIABILITY (1) TEST ITEMS AND RESULTS (Application LED PKG Type : Top - View LED PKG) Test Item Standard Test Method Test Conditions Note Number of Damaged Room Temperature Operating Life Test EIAJ ED-4701 Ta=25 ±5, IF=60mA 1000 hrs. 0/22 Room Temperature Storage Test High Humidity & High Temperature Operating Life Test High Humidity & High Temperature Storage Test Ta=25 ±5 500 hrs. 0/50 60, RH=90%, IF=60mA 1000 hrs. 0/22 EIAJ ED-4701 Ta=60, RH=90% 1000 hrs. 0/50 High Temperature Operating Life Test EIAJ ED-4701 Ta=85, IF=60mA 1000 hrs. 0/22 High Temperature Storage Test EIAJ ED-4701 Ta=100 1000 hrs. 0/50 Low Temperature Operating Life Test Ta=-40, IF=60mA 1000 hrs. 0/22 Low Temperature Storage Test EIAJ ED-4701 Ta=-40 1000 hrs. 0/50 Temperature Cycle Test EIAJ ED-4701-40 ~ 25 ~ 100 ~ 25 2min, 2min, 2min, 2min 100 cycles 0/100 Solderability Test EIAJ ED-4701 Tsol=215±5, sec. (Lead Solder) 1 time Over 90% 0/22 Soldering Heat Test EIAJ ED-4701 Tsol=260, 10sec. (Pre treatment 0, 70%, 168hrs.) 2 Times 0/22 (2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max. Forward Voltage Reverse Current Luminous Intensity VF IR IV IF=60mA VR=5V IF=60mA - - L.S.L.**) 0.7 U.S.L.*) 1.2 U.S.L.*) 2.0 - *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level
11. TAPING ISCL-T21RGBB P A G E 12 / 16 (Unit : mm)
12. PACKING ISCL-T21RGBB P A G E 1 / 16 Remark : Quantity : 2000pcs/reel
ISCL-T21RGBB P A G E 14 / 16 1. CAUTIONS The follow cautions should be taken when handling LEDs. (1) Moisture When moisture is absorbed by the LEDs, it may vaporize and expand during soldering. There is a possibility that this can cause the exfoliation of the contacts and the damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to minimize moisture in the package. After opening the package, the LEDs should be kept at 25, 60%RH or less. The LEDs should be soldered within 168 hours(7days) after opening the package. When storing the LEDs after opening the package, use a sealable away from package with a moisture absorbent material inside. If the blue color of the desiccant indicator has faded after storing, a baking treatment should be performed as follows : 55 ± 5 for more than 24 hours. (2) Soldering Conditions Temperature-Profile The LEDs can be soldered in place using the reflow soldering method. The recommended soldering conditions are as follows: Hand Soldering Soldering iron : 00 Max., seconds (one time only) A soldering iron less than 20W must be used. Reflow Soldering Use the conditions shown in the figures on the right. Pre-heating : 120~150 120 seconds Max. Soldering : 240 Max. 10 seconds Max. (Rapid cooling should be avoided.) 2.5~5 /sec. 1~5 /sec. * Lead Solder 2.5~5 /sec. Pre-heating 120~150 120sec. Max. * Lead Free Solder 1~5 /sec. Pre-heating 180~220 120sec. Max. 60sec. Max. Above 200 60sec. Max. Above 220 240 Max. 10sec. Max. 260 Max. 10sec. Max.
ISCL-T21RGBB P A G E 15 / 16 Modifications should not be done after the LEDs have been soldered. If modifications cannot be avoided, a double-head soldering iron should be used after checking whether the characteristics of the LEDs will not be damaged by modification after soldering. In reflow soldering, do not apply force to the package during heating. After soldering, do not warp the circuit board. () Heat Dissipation Heat Dissipation must be taken into design consideration when using the LEDs. The coefficient of temperature increase per input electric power is about 0.62 /mw at the LED s active layer. This coefficient will be affected by the heat resistance of the circuit board and by dense mounting of the LEDs. At the same time, precautions must be taken into the design of circuitry to avoid intense heat generation. Proper designs which allow radiation of heat, etc. may be needed. The operating current should be decided after considering the ambient maximum temperature when the LEDs are illuminating. (4) Static Electricity(ESD) Static Electricity and surge damages the LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. When inspecting own final products on which LEDs were mounted, it is recommended to check also whether the mounted LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by light emission test at lower current (below 1 ma is recommended). Damaged LEDs will show some unusual characteristics such as substantial increase in leakage current, lower starting forward voltage, or unlit LEDs at low current.
ISCL-T21RGBB P A G E 16 / 16 (5) Cleaning When cleaning, don't press the surface. Use Isopropyl Alcohol as a solvent for cleaning the LEDs. Using other solvents may dissolve the LED package and the epoxy. Caution is needed. Ultrasonic cleaning of the LEDs should not be done. (6) Others Don't touch the light emitting surface, while handling with sharp tools like tweezer. Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using LEDs with matrix drive. The electrode sections are plated with silver. Those will become discolored by contact with corrosion gas etc. Precautions must be taken to maintain a clean storing atmosphere. The LEDs light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. These LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliance). Consult ILJIN SEMICONDUCTOR s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as airplanes, aerospace, automobiles, traffic control equipment, life support systems and safety devices). User shall not reverse engineer by disassembling or analyzing of the LEDs without having a prior written consent of ILJIN SEMICONDUCTOR. When defective LEDs are found, user shall inform ILJIN SEMICONDUCTOR directly before disassembling or analyzing. The formal specifications must be exchanged and signed by both parties before large volume purchase begins. The appearance and specifications of the product may be modified for improvement without notice.