LIGITEK ELECTRONICS CO.,LTD. TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LPT3323/TBS-X-PF DATA SHEET DOC. NO : RE. : QW0905- LPT3323/TBS-X-PF D DATE : 19 - Sep. - 2006
Package Dimension LIGITEK ELECTRONICS CO.,LTD. PART NO. LPT3323/TBS-X-PF Page 1/5 P2 ΔH 5.0 5.9 7.6 8.6 H2 H1 L W0 D Note:1.All dimension are in millimeter tolerance is ±0.25 unless otherwise noted 2.Specifications are subject to change without notice MAXIMUM RATINGS(Ta=25 ) Power Dissipation Collector-Emitter oltage Emitter-Collector oltage Operating Temperature Storage Temperature P1 P PARAMETER ELECTRICAL CHARACTERISTICS(Ta=25 ) F - + T W2 W1 W3 1.EMITTER 2.COLLECTOR Features. High illumination sensitivity. Stable characteristics. Spectrally and mechanically matched with IR emitter Description The LPT3323/TBS-X-PF series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and igh illumination sensitivity the cases of LPT3323/TBS-X-PF are ncapsulated in water clear plastic T1 3/4 package individuallt MAXIMUM RATINGS 100 30 5 2.3TYP 1 2-50 TO +100-50 TO +100 UNIT mw 12.5MIN 1.0MIN PARAMETER SYMBOL Min. Typ. Max. UNIT Collector-Emitter Breakdown oltage (BR)CEO 30 Emitter-Collector Breakdown oltage (BR)ECO 5 Collector-Emitter Saturation oltage CE(sat) 0.4 Rise Time Tr 5 μs Fall Time Tf 5 μs Collector Dark Current ICEO 100 na Wavelength of Peak Sensitivity λp 800 --- nm Range of Spectral Bandwidth λ0.5 400-1100 --- nm On State Collector Current Ip(on) 1 2 4 8 2 4 8 TEST CONDITION Ic=1 Ee=0mw/cm2 IE=100μA Ee=0mw/cm2 Ic=0.5 Ee=20mw/cm2 CE=30 IC=800μA,RL=1KΩ CE=10 Ee=0mw/cm2 --- --- CE=5v Ee=1mw/c m2 λp=940nm
Dimension Symbol Information Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead LengthAfter Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width REMARK : TBS = Tape And Box Straight Leads Dimensions Symbol Information Description SYMBOL ITEMS Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Symbol minimum OPTION CODE TBS-1 TBS-2 TBS-3 TBS-4 TBS-5 TBS-6 19.9 0.78 20.9 H1 TBS-7 24.0 0.94 25.0 TBS-8 TBS-9 TBS-10 TBS-11 TBS-12 TBS-13 P1 Specification maxmum SYMBOL D H H2 L P P2 T W0 W1 W2 LIGITEK ELECTRONICS CO.,LTD. PART NO. LPT3323/TBS-X-PF Page 2/5 3.8 F 2.2 17.5 0.69 21.5 25.5 27.5 22.5 24.5 19.0 18.4 21.0 20.5 18.0 12.4 4.4 5.1 8.5 14.5 0.0 Minimum W W0 0.81 0.71 0.49 0.17 0.2 0.33 0.57 0.0 W3 17.5 0.69 SPECIFICATIONS 0.15 0.09 0.85 1.0 1.08 0.89 0.96 0.75 0.72 0.83 Package Dimensions 4.2 3.0 2.0 18.5 22.5 26.5 28.5 23.5 25.5 20.0 19.4 22.0 21.5 19.0 36.0 11.0 13.0 2.8 7.7 1.42 9.75 15.5 4.0 19.0 Maximum L 0.17 0.12 0.08 0.73 0.89 1.04 1.12 0.93 0.82 0.98 1.0 0.79 0.76 0.87 0.85 0.75 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 Overall Length Overall Width L W 330 265 13.0 340 10.4 275 13.4 10.8 H Overall Thickness H 50.0 1.97 60.0 2.40 Quantity/Box 2000PCS
LIGITEK ELECTRONICS CO.,LTD. PART NO.LPT3323/TBS-X-PF Page 3/5 Typical Electro-Optical Characteristics Curve
LIGITEK ELECTRONICS CO.,LTD. PART NO. LPT3323/TBS-X-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2 Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2 Min(From solder joint to body) Temp( C) 260 260 C3sec Max 5 /sec max 120 25 0 0 Preheat 2 /sec max 60 Seconds Max 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
Reliability Test: LIGITEK ELECTRONICS CO.,LTD. PART NO. LPT3323/TBS-X-PF Page 5/5 Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ±5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ±5 &-40 ±5 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ±5 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2