DATA SHEET DEVICE NUMBER: SHEET DATE 1 2 3 4 5 6 7 CONTENTS 25.6.22 1. 1. 1. 1. 1. 1. 1. Original Released 29.5.26 1.1 1.1 1.1 1.1 1.1 1.1 1.1 ChangeTest Condition 21.3.26 1.2 1.2 1.2 1.2 1.2 1.2 1.2 Modify 3K/reel to 4K/reel 212.7.5 1.3 Updated reliability testing 佰鴻工業股份有限公司 台北縣板橋市和平路 19 號 3 樓 3F., No. 19, Ho Ping Road, Pan Chiao City, Taipei, Taiwan, R. O. C. Tel: 886-2-295919 Fax: 886-2-295476/2955889 www.brtled.com. APPROVED 占 212.7.5 旭 DRAWER 李 212.7.5 慧清
Features: 1. Emitted Color : Super Blue Package Dimensions: 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 1.6x.8x.6mm(63) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn t contain restriction Substance, comply ROHS standard. Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±.1mm (.4 ) unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. Absolute Maximum Ratings(Ta=25 ) Parameter Symbol Rating Unit Power Dissipation Pd 72 mw Forward Current I F 2 ma Peak Forward Current *1 I FP 1 ma Reverse Volage V R 5 V Operating Topr -4 ~85 - Storage Tstg -4 ~85 - Soldering Tsol See Page6 - *1 Condition for IFp is pulse of 1/1 duty and.1msec width. Ver.1.3 Page 1 of 7
Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=2mA - 3.2 3.6 V Luminous Intensity Iv IF=2mA 42 8 - mcd Reverse Current I R V R =5V - - 1 µa Peak Wave Length λp IF=2mA - 47 - nm Dominant Wave Length λd IF=2mA 465-47 nm Spectral Line Half-width Δλ IF=2mA - 3 - nm Veiwing Angle 2θ 1/2 IF=2mA - 12 - deg Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength Fig.2 Forward current derating curve vs. ambient temperature 1. 3 25 Relative radiant intensity.5 2 15 1 5 42 47 52 2 4 6 8 1 Wavelength (nm) Ambient temperature Ta( C) Fig.3 Forward current vs. forward voltage Fig.4 Relative luminous intensity vs. ambient temperature 5 3. 4 2.5 Forward current (ma) 3 2 1 Relative luminous intensity (Normalized @ 2mA) 2. 1.5 1..5 1 2 3 4 5-4 -2 2 4 6 Forward voltage(v) Ambient A temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current Fig.6 Radiation diagram 1 2 2. 3 Relative luminous intensity (@2mA) 1.5 1..5 Relative radiant intensity 1..9.8.7 4 5 6 7 8 9 1 2 3 4 5.5.3.1.2.4.6 Forward current (ma) Ver.1.3 Page 2 of 7
Tapping and packaging specifications(units: mm) Quantity:1-4PCS Package Method:(unit:mm) Vacuum 12 bag/box 4 pcs/reel Bar Code Label 2 245 22 22 Aluminum Foil Bag 185 645 6 box/carton 21 47 Ver.1.3 Page 3 of 7
Bin Limits Intensity Bin Limits (At 2mA) BIN CODE Min. (mcd) Max. (mcd) N 42 63 P 63 94 Q 94 14 R 14 21 Tolerance for each Bin limit is ± 15%. Color Bin Limits (At 2mA) BIN CODE Min. (nm) Max. (nm) 4 465 47 Tolerance for each Bin limit is ± 1nm V F Bin Limits (At 2mA) BIN CODE Min.(v) Max.(v) G 2.8 3. H 3. 3.2 J 3.2 3.4 K 3.4 3.6 Tolerance for each Bin limit is ±.5V. BIN: x x x V F BIN CODE(2mA) Color BIN CODE(2mA) Intensity BIN CODE(2mA) Ver.1.3 Page 4 of 7
Reliability Test Classification Test Item Reference Standard Test Conditions Result Endurance Test Environmental Test Operation Life High High Humidity Storage High Storage Low Storage Cycling MIL-STD-75D:126 MIL-STD-883D:15 JIS-C-721 :B-1 MIL-STD-22F:13B JIS-C-721 :B-11 MIL-STD-883:18 JIS-C-721 :B-1 JIS-C-721 :B-11 MIL-STD-22F:17D MIL-STD-75D:151 MIL-STD-883D:11 JIS-C-721 :A-2 Ta: Under room temperature Test time:1,hrs IF=Product Recommended IF /32 Ta:85±5 /32 RH:9%-95% Test time:24hrs Ta:1±5 Test time:1,hrs /32 Ta: -4±5 Test time=1,hrs /32 Ta:-35±5 ~25±5 ~85±5 ~25±5 3min 5min 3min 5min MIL-STD-22F:17D( Ta:-4±5 ~+85±5 198) 1min 1 min MIL-STD-75D:151( Time: 2min/cycle 1cycle Thermal Shock 95) MIL-STD-883D:111(1 991) /32 /32 Wetting balance MIL-STD-883:23 MIL-STD-22F:28D MIL-STD-883D:23 Ta:23±5 Time:5±.5s /32 Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage V F ( V) I F =2mA Initial Level*1.1 Reverse current I R (ua) V R =5V Over U*2 Luminous intensity Iv ( mcd ) I F =2mA Initial Level*.7 Note: 1.U means the upper limit of specified characteristics. 2. Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.3 Page 5 of 7
Soldering : 1. Manual of Soldering The temperature of the iron tip should not be higher than 3 (572 ) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 14 ~16 ±5,within 2 minutes. Operation heating : 26 (Max.) within 1 seconds.(max) Gradual Cooling (Avoid quenching). 1 SEC. MAX. 26 MAX. 14~16 4 /SEC. MAX. OVER 2 MIN. 4 /SEC. MAX. Time 3. DIP soldering (Wave Soldering) : Preheating : 12 ~15,within 12~18 sec. Operation heating : 245 ±5 within 5 sec.26 (Max) Gradual Cooling (Avoid quenching). Soldering heat Max. 26 12~15 Preheat 12~18 sec. 245 ±5 within 5 sec. Handling : Time Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Ver.1.3 Page 6 of 7
Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) : 5-3 (41 )Humidity : RH 6 % Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 3% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 6 ±3. Package and Label of Products: (1) Package: Products are packed in one bag of 4 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO B Part No. Quantity BIN. Sealing Date Manufacture Location x xx xx xx Year Month Day Ver.1.3 Page 7 of 7