EEC 118 Lecture #16: Manufacturability. Rajeevan Amirtharajah University of California, Davis

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EEC 118 Lecture #16: Manufacturability Rajeevan Amirtharajah University of California, Davis

Outline Finish interconnect discussion Manufacturability: Rabaey G, H (Kang & Leblebici, 14) Amirtharajah, EEC 118 Spring 2010 3

Design for Manufacturability For class projects or university research, goal is a single working circuit or small number of prototypes Similar scale for industrial research projects Production goal is usually thousands to 100s of millions of working (or at least marketable) parts Must evaluate circuit designs over a range of parameter variations to ensure correct functionality, performance Design for Manufacturability or Statistical Circuit Design encompasses a variety of techniques Yield estimation and maximization, worst-case analysis, etc. Amirtharajah, EEC 118 Spring 2010 4

Circuit Parameter Variations All circuit parameters vary some amount due to variations in process, lithography, or environment Geometric parameters: transistor W and L Device parameters: V T, t ox, μ Interconnect parameters: R, C Operating conditions: V DD, T Variations occur both spatially and temporally Circuit-to-circuit on same die (spatial) Die-to-die on same wafer (spatial) Wafer-to-wafer in same fab (temporal) Example: transistor width W = W 0 + ΔW Designer controls Increasing variation Random Amirtharajah, EEC 118 Spring 2010 5

CMOS Inverter Example For both NMOS and PMOS: W = W 0 + ΔW L = L 0 + ΔL V T = V T0 + ΔV T k = k 0 + Δk For capacitor: C load = C 0 + ΔC For entire circuit: T = T 0 + ΔT V DD = V DD0 + ΔV DD Vin Vout C load All these parameters affect circuit performance! Amirtharajah, EEC 118 Spring 2010 6

Performance Variation Example 25 Inverter Delay Histogram 20 Count 15 10 5 0 0-10 10-20 20-30 30-40 40-50 50-60 60-70 70-80 80-90 90- Propagation Delay (ps) 100 Delay variations with parameters, loading, V DD, and T Amirtharajah, EEC 118 Spring 2010 7

Yield Estimation and Maximization Parametric Yield: ratio of total acceptable circuits to total manufactured circuits Design for manufacturability aims to maximize yield (and $$) Yield statistics are usually complicated since circuit performance is complex function of parameters Numerous methods for estimating and maximizing yield Response surface models (RSM): compact analytical model fit to circuit simulations using Design of Experiments Direct Monte Carlo circuit simulations or the RSM can be used to estimate yields Designer controlled parameters then adjusted to maximize yield estimates Amirtharajah, EEC 118 Spring 2010 8

Worst-Case Design 1 Given range of variations for process, voltage, temperature identify worst (best) cases for performance parameter of interest Process corner models from fab define limits of device performance Labeled by NMOS-PMOS pairs, e.g. Typical NMOS-Typical PMOS (TT) Usual additional corners: Fast NMOS-Fast PMOS (FF), Slow NMOS-Slow PMOS (SS), Fast NMOS-Slow PMOS (FS), Slow NMOS-Fast PMOS (SF) Usual voltage corners: Nominal V DD +/- 10% Temperature range: 0 100 o C Amirtharajah, EEC 118 Spring 2010 9

Worst-Case Design 2 Identify worst (best) cases for performance parameter of interest Typical Speed Corner Typical NMOS-Typical PMOS (TT), nominal VDD, room temperature 27 o C Slow Speed Corner Slow NMOS-Slow PMOS (SS), 0.9 x VDD, maximum temperature 100 o C Fast Speed Corner Fast NMOS-Fast PMOS (FF), 1.1 x VDD, minimum temperature 0 o C Amirtharajah, EEC 118 Spring 2010 10

Summary Design for manufacturability converts a prototype into a real design for large-scale production Statistical models of process, device and interconnect parameters, and operating conditions used to estimate and maximize yield (and profits) Analysis is difficult because of complexity, usually numerical models and many simulations required Variability trend is worsening as processes shrink For example, locations of individual dopant atoms can affect transistor performance Statistical circuit design is becoming as important as performance and power! Amirtharajah, EEC 118 Spring 2010 11

Next Topic: Future Directions & Final Review Future directions in CMOS digital circuits Alternative logic technologies to CMOS Final exam review Amirtharajah, EEC 118 Spring 2010 12