PACKAGE OUTLINE SCHEMATIC 6 6 HAVS-M, HAV2S-M 6 HAV-M, HAV2-M 2 3 NC PIN. ANODE 2. CATHODE 3. NO CONNECTION 4. EMITTER 5. COLLECTOR 6. BASE 5 4 6 HAVA-M, HAV2A-M DESCRIPTION The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin dual in-line white package. FEATURES HAV and HAV2 feature 0.3" input-output lead spacing HAVA and HAV2A feature 0.4" input-output lead spacing UL recognized (File #E90700, Vol. 2) VDE recognized (File #02497) - Add option V (e.g., HAVAV-M) APPLICATIONS Power supply regulators Digital logic inputs Microprocessor inputs Page of 0
ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise specified) Parameter Symbol Value Units TOTAL DEVICE Storage Temperature T STG -40 to +50 C Operating Temperature T OPR -40 to +00 C Wave solder temperature (see page 9 for reflow solder profiles) T SOL 260 for 0 sec C Total Device Power Dissipation @ T A = 25 C Derate above 25 C EMITTER P D 250 mw 2.94 mw/ C DC/Average Forward Input Current I F 60 ma Reverse Input Voltage V R 6 V LED Power Dissipation @ T A = 25 C Derate above 25 C DETECTOR P D 20 mw.4 mw/ C Collector-Emitter Voltage V CEO 70 V Collector-Base Voltage V CBO 70 V Emitter-Collector Voltage V ECO 7 V Detector Power Dissipation @ T A = 25 C 50 mw P D Derate above 25 C.76 mw/ C Page 2 of 0
ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Min Typ* Max Unit EMITTER Input Forward Voltage (I F = 0 ma) T A = 25 C 0.8.8.5 T A = -55 C V F 0.9.28.7 V T A = 00 C 0.7.05.4 Reverse Leakage Current (V R = 6.0 V) I R 0 µa DETECTOR Collector-Emitter Breakdown Voltage (I C =.0 ma, I F = 0) BV CEO 70 00 V Collector-Base Breakdown Voltage (I C = 00 µa, I F = 0) BV CBO 70 20 V Emitter-Collector Breakdown Voltage (I E = 00 µa, I F = 0) BV ECO 7 0 V Collector-Emitter Dark Current (V CE = 0 V, I F = 0) I CEO 50 na Collector-Base Dark Current (V CB = 0 V) I CBO 0.5 na Capacitance (V CE = 0 V, f = MHz) C CE 8 pf ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ* Max Units Input-Output Isolation Voltage (f = 60 Hz, t = sec) V ISO 7500 Vac(pk) Isolation Resistance (V I-O = 500 VDC) R ISO 0 Ω Isolation Capacitance (V I-O = 0 V, f = MHz) C ISO 0.2 2 pf Note * Typical values at T A = 25 C Page 3 of 0
TRANSFER CHARACTERISTICS (T A = 25 C Unless otherwise specified.) DC Characteristic Test Conditions Symbol Device Min Typ* Max Unit Current Transfer Ratio, Collector to Emitter Collector-Emitter Saturation Voltage AC Characteristic Non-Saturated Turn-on Time (I F = 0 ma, V CE = 0 V) CTR HAV HAVA HAV2 HAV2A 00 300 % (I C = 2 ma, I F = 20 ma) V CE (SAT) All 0.4 V (I C = 2 ma, V CC = 0 V, R L = 00Ω) (Fig. ) 50 T ON All 5 µs Non Saturated Turn-off Time (I C = 2 ma, V CC = 0 V, R L = 00Ω) (Fig. ) T ON All 5 µs * Typical values at T A = 25 C Page 4 of 0
NORMALIZED CTR NORMALIZED CTR PHOTOTRANSISTOR OPTOCOUPLERS TYPICAL PERFORMANCE CURVES.8.7 Fig. LED Forward Voltage vs. Forward Current.6.4 Fig. 2 Normalized CTR vs. Forward Current V CE = 5.0V T A = 25 C Normalized to IF = 0 ma VF - FORWARD VOLTAGE (V).6.5.4.3.2 T A = -55 C TA = 25 C.2.0 0.8 0.6 0.4. TA = 00 C 0.2.0 0 00 I F - LED FORWARD CURRENT (ma) 0.0 0 2 4 6 8 0 2 4 6 8 20 I F - FORWARD CURRENT (ma) Fig. 3 Normalized CTR vs. Ambient Temperature Fig. 4 CTR vs. RBE (Unsaturated).4.0.2.0 0.8 0.6 0.4 Normalized to IF = 0 ma TA = 25 C I F = 0 ma I F = 20 ma IF = 5 ma NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0. 0.0 IF = 20 ma I F = 0 ma I F = 5 ma V CE= 5.0 V 0.2-60 -40-20 0 20 40 60 80 00 0 00 000 T A - AMBIENT TEMPERATURE ( C) R BE- BASE RESISTANCE (kω) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) Fig. 5 CTR vs. RBE (Saturated).0 0.9 VCE= 0.3 V 0.8 0.7 IF = 20 ma 0.6 0.5 IF = 0 ma 0.4 0.3 I F = 5 ma 0.2 0. 0.0 0 00 000 R BE- BASE RESISTANCE (k Ω) VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) Fig. 6 Collector-Emitter Saturation Voltage vs Collector Current 00 0 0. 0.0 T A = 25 C IF = 5 ma IF = 2.5 ma IF = 0 ma IF = 20 ma 0.00 0.0 0. 0 I C - COLLECTOR CURRENT (ma) Page 5 of 0
SWITCHING SPEED - (µs) I CEO - COLLECTOR -EMITTER DARK CURRENT (na) PHOTOTRANSISTOR OPTOCOUPLERS 000 Fig. 7 Switching Speed vs. Load Resistor 5.0 Fig. 8 Normalized t on vs. R BE 00 0 I F = 0 ma V CC = 0 V T A = 25 C T off T on T r T f NORMALIZED ton - (ton(rbe) / ton(open)) 4.5 4.0 3.5 3.0 2.5 2.0.5.0 V CC = 0 V I C = 2 ma R L = 00 Ω 0. 0. 0 00 R-LOAD RESISTOR (kω) 0.5 0 00 000 0000 00000 R BE - BASE RESISTANCE (k Ω) Fig. 0 Dark Current vs. Ambient Temperature.4.3 Fig. 9 Normalized t off vs. R BE 0000 000 V CE = 0 V T A = 25 C NORMALIZED toff - (toff(rbe) / toff(open)).2..0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 V CC = 0 V I C = 2 ma R L = 00 Ω 00 0 0. 0.0 0.2 0. 0 00 000 0000 00000 R BE - BASE RESISTANCE (k Ω) 0.00 0 20 40 60 80 00 T A - AMBIENT TEMPERATURE ( C) TEST CIRCUIT WAVE FORMS I F V CC = 0V I C R L INPUT PULSE INPUT R BE OUTPUT 0% 90% t r t f OUTPUT PULSE Adjust I F to produce IC = 2 ma t on t off Figure. Switching Time Test Circuit and Waveforms Page 6 of 0
Package Dimensions (Through Hole) Package Dimensions (Surface Mount) 0.350 (8.89) 0.320 (8.3) 0.350 (8.89) 0.320 (8.3) Pin ID PIN ID 0.260 (6.60) 0.240 (6.0) 0.260 (6.60) 0.240 (6.0) 0.390 (9.90) 0.332 (8.43) SEATING PLANE 0.070 (.77) 0.040 (.02) 0.200 (5.08) 0.5 (2.93) 0.04 (0.36) 0.00 (0.25) 0.320 (8.3) SEATING PLANE 0.070 (.77) 0.040 (.02) 0.200 (5.08) 0.5 (2.93) 0.04 (0.36) 0.00 (0.25) 0.02 (0.30) 0.008 (0.20) 0.320 (8.3) 0.00 (2.54) 0.05 (0.38) 0.020 (0.50) 0.06 (0.4) 0.00 (2.54) 5 0.02 (0.30) 0.025 (0.63) 0.020 (0.5) 0.020 (0.50) 0.06 (0.4) 0.00 [2.54] 0.035 (0.88) 0.006 (0.6) Package Dimensions (0.4 Lead Spacing) 0.350 (8.89) 0.320 (8.3) PIN ID Recommended Pad Layout for Surface Mount Leadform 0.070 (.78) 0.260 (6.60) 0.240 (6.0) 0.060 (.52) SEATING PLANE 0.070 (.77) 0.040 (.02) 0.200 (5.08) 0.5 (2.93) 0.04 (0.36) 0.00 (0.25) 0.425 (0.79) 0.305 (7.75) 0.00 (2.54) 0.030 (0.76) 0.00 (2.54) 0.05 (0.38) 0.020 (0.50) 0.06 (0.4) 0.00 [2.54] 0.02 (0.30) 0.008 (0.2) 0.425 (0.80) 0.400 (0.6) NOTE All dimensions are in inches (millimeters) Page 7 of 0
ORDERING INFORMATION Order Entry Identifier Order Entry Identifier Option Example S Surface Mount Lead Bend HAVS-M SR2 Surface Mount; Tape and reel HAVSR2-M N/A 0.4" Lead Spacing HAVA-M V VDE 0884 HAVV-M N/A VDE 0884, 0.4" Lead Spacing HAVAV-M SV VDE 0884, Surface Mount HAVSV-M SR2V VDE 0884, Surface Mount, Tape & Reel HAVSR2V-M MARKING INFORMATION V HAV X YY Q 2 6 3 4 5 White Package Definitions Fairchild logo 2 Device number VDE mark (Note: Only appears on parts ordered with VDE 3 option See order entry table) One digit year code 4 One digit for white package parts, e.g., 3 5 Two digit work week ranging from 0 to 53 6 Assembly package code *Note Parts built in the white package (M suffix) that do not have the V option (see definition 3 above) that are marked with date code 325 or earlier are marked in the portrait format. Page 8 of 0
Carrier Tape Specifications 4.5 ± 0.20 0.30 ± 0.05 4.0 ± 0. 2.0 ± 0. 2.0 ± 0.05 Ø.5 MIN.75 ± 0.0 2.0 ± 0..5 ±.0 24.0 ± 0.3 9. ± 0.20 0. MAX 0. ± 0.20 Ø.5 ± 0./-0 User Direction of Feed Reflow Profile Temperature ( C) 300 250 200 50 00 50 0 0 245 C peak 230 C, 0 30 s Time above 83 C, 20 80 sec Ramp up = 2 0 C/sec Peak reflow temperature: 245 C (package surface temperature) Time of temperature higher than 83 C for 20 80 seconds One time soldering reflow is recommended 0.5.5 2 2.5 3 3.5 4 4.5 Time (Minute) Page 9 of 0
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 0 of 0