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Fall 2002 6.720J/3.43J Integrated Microelectronic Devices Prof. J. A. del Alamo Decemb er 20, 2002 - Final Exam Name: General guidelines (please read carefully b efore starting): Make sure to write your name on the space designated ab ove. Open book: you can use any material you wish. All answers should b e given in the space provided. Please do not turn in any extra material. You have three hours to complete your quiz. Make reasonable approximations and state them, i.e. low-level injection, extrinsic semiconductor, quasi-neutrality, etc. Partial credit will b e given for setting up problems without calculations. NO credit will b e given for answers without reasons. Use the symb ols utilized in class for the various physical parameters, i.e. N, τ, E, etc. c Pay attention to problems in which numerical answers are exp ected. An algebraic answer will not accrue full p oints. Every numerical answer must have the prop er units next to it. Points will b e subtracted for answers without units or with wrong units. In situations with a defined axis, the sign of the result is also part of the answer. If needed, use the doping-dep endent Si parameters graphed throughout del Alamo s notes. If needed, use physical parameters for silicon at ro om temp erature listed in App endix B of del Alamo s notes. If needed, use the values of fundamental constants listed in App endix A of del Alamo s notes.

1. (25 points) Below are two screen shots of weblab measurements taken on a 1.5x46.5 µm NMOS FET. The first one shows the output characteristics obtained for V SB =0 V, and V GS from 0 to 3 V, in steps of 0.5 V. The second one shows the output characteristics obtained with the roles of the gate and b o dy reversed. In these, V GS =1.5 V and V SB is stepp ed from 0 V to 3 V, in steps of 0.5 V. As we discussed in class, the b o dy of the MOSFET b ehaves as a gate and reasonably lo oking output characteristics are obtained.

a) (10 points) One of the most striking differences b etween the two sets of output characteristics is V DSsat. The characteristics obtained with the b o dy op erating as the main gate seem to display remarkably smaller values of V DSsat than in the normal mo de. This question is ab out understanding the origin of this. Derive a simple expression for V DSsat as a function of V SB for an ideal MOSFET. Do not include the b o dy effect (but obviously include the back bias effect). Is this expression consistent with the data ab ove? Explain.

Below are the subthreshold characteristics obtained for this MOSFET for b oth mo des of op eration. In the normal mo de (top), V SB = 0. In the mo de in which the b o dy is used as gate (b ottom), V GS =1.5 V. In b oth cases, V DS =0.1 V. A remarkable difference is also observed here: the subthreshold slop e of the device in the normal mo de is significantly sharp er than in the mo de in which the b o dy is used as the main gate.

b) (10 points) Derive an expression for the relationship b etween the inverse subthreshold slop e of a MOSFET in the normal mo de and in the gate-reversed mo de. Explain your result.

c) (5 points) From the exp erimental characteristics of the previous page, extract the subthreshold slop e of this device for b oth mo des of op eration. Compare their relationship with that predicted with the equation derived ab ove. Discuss.

2. (10 points) Consider a n-channel MOSFET pro cess from the 0.18 µm-technology generation characterized by x ox =4.5 nm and V T =0.3 V. Estimate the sheet resistance of the inversion layer for V GS =1.8 V.

3. (15 points) At the 2002 International Electron Devices Meeting last week, there were a numb er of pap ers that demonstrated a new technique to fully silicide the gate of MOSFETs. This is done by dep ositing a suitable metal on top of the p olysi gate and then reacting it at high temp erature until all the gate p olysi is completely consumed. The remaining metal is then removed. This is sketched in the figure b elow: n+ polysi gate metal silicide gate n + n + n + n + n + p p This problem is ab out examining the changes that o ccur to the MOSFET device characteristics as a result of the complete silicidation of the gate. The key change that complete silicidation intro duces in an n-channel MOSFET is an increase in the gate work function. To the first order, nothing else is changed. Indicate the impact of the increase of the gate metal work function on the parameters and figures of merit listed b elow. Circle one: incr ease =, decr ease =, or no ef f ect. For each item, give the reason for your choice (no reason, no points). -threshold voltage, V : T no ef f ect -effective inversion layer mobility at a given V gs, µ ef f : no ef f ect

-inverse subthreshold slop e, S (in units of mv /dec ): no ef f ect -off-state current, I : no ef f ect of f -minimum achievable gate length for a given DI B L criteria: no ef f ect

4. (25 points) At the 2002 IEDM, a world record SiGe HBT (Hetero junction Bip olar Transistor) was presented. The device featured an f T = 350 GH z, almost twice as high as the b est result presented last year at the 2001 IEDM. This problem is ab out studying in some detail the rep orted results. To the first order, you can think of this transistor as a regular Si bip olar junction transistor. The following table gives the value of f pap er (V CB =1 V ): T at two different collector current levels, as rep orted in the IC (ma) ft (GH z ) 0.2 70 6 350 I Cpk =6 ma is the collector current at which f T p eaks. In the pap er, the emitter-base junction 2 area is listed as A =0.12 2.5 µm. The current gain is listed as β = 2300. E F a) (5 points) Estimate the collector doping level (numerical answer expected). b) (5 points) Estimate the sum of the emitter-base and base-collector junction capacitances (numerical answer expected).

c) (5 points) Estimate the intrinsic delay (numerical answer expected). d) (5 points) Estimate the quasi-neutral base width (numerical answer expected).

e) (5 points) At I C = I C,pk, estimate the total minority carrier charge in the device (numerical answer expected).

5. (25 points) The figure b elow is a mo dified version of Fig. 7.26 in the notes. It describ es the + isolation problem when implementing pn dio des in a CMOS pro cess. Depicted is a n -p dio de + implemented using a n-mosfet. The source/drain n diffusion is used as the dio de catho de. + The p-typ e well is used as the dio de ano de. The p b o dy contact is used as the ano de contact. Surrounding the p-typ e ano de is the n-typ e substrate which is connected to the most p ositive voltage of this circuit, V DD. V DD V DD p n+ p+ electron recombination in anode (desired path) I 2 parasitic desired I 1 current path current path I=1 ma I=1 ma n electron extraction by substrate (parasitic path) V SS desired result V SS actual result The problem with this dio de is that it is actually a parasitic vertical npn bip olar transistor. Dep ending on the circuit environment, the actual current path can b e very different from the desired current path. An example is shown on the right where this dio de is connected somewhere half way b etween V DD and V SS, where V DD is the p ositive rail of the circuit and V SS is the negative rail. Immediately b elow the dio de is a current source pulling down 1 ma. Ideally, this current should entirely flow from ano de to catho de in the dio de. Since this is in reality a bip olar transistor, some of this current can b e diverted to the substrate through the bip olar effect and flow through a separate path, I.As 2 a result, the current through the desired path, I, can b e less than the intended value of 1 ma. The 1 end result might b e circuit misfunction. Computing these currents is the goal of this problem. Here are sp ecs for the three key regions: region ty p e 3 doping level (cm ) thickness (µm) catho de + n 1019 0.05 ano de p 1017 0.2 substrate n 1016 400 + 2 The area of the n p junction is 100 µm. a) (5 points) Under the conditions indicated ab ove, identify the emitter, the base and the collector of this bip olar transistor. In what regime is this bip olar transistor biased?

b) (10 points) Estimate the current gain of the bip olar transistor in the configuration indicated ab ove (numerical answer expected).

c) (5 points) Estimate I and I (numerical answer expected). 1 2

d) (5 points) Quantitatively sketch the excess minority carrier concentration across the base of the parasitic BJT.