XIAMEN G&P ELECTRONICS CO., LTD. SPECIFICATION FOR GoPro HIGH POWER LED Part No.: GPP-TS55WA1 REV:1. RECEIVED MASS PRODUCTION PRELIMINARY CUSTOMER DESIGN DEVICE NUMBER :YG211-126 PAGE: 5 CUSTOMER S APPROVAL Designed By Checked By Approved By 柳艺伟王晓梅张承宗 211.12.15 211.12.15 211.12.15 www.gpelec.com Tel: 86-592-574366 Fax: 86-592-5621415
.5W HIGH POWER GPP-TS55WA1 Features: 1. Chip material: GaN/Al2O3 2. Emitted color: white 3. Lens Appearance: yellow diffuse 4. Low power consumption. 5. High efficiency. 6. This product don t contained restriction substance, compliance RoHS standard. 7. extremely wide viewing angle ideal for backlighting and coupling in light guides 8. suitable for all SMT assembly methods 9. Soldering Technique: TTW soldering, IR reflow Package dimensions: 2 1 Applications: 1. Lighting 2. Miner, s Lamp 3. Optical indicators 4. Signal and symbol Luminaire 2 1 5. Substitution of micro incandescent lamps 6. Indoor and outdoor displays (e.g. displays for traffic; light writing displays) Note: 1. All dimensions are in millimeters. 2. Tolerance is ±.1mm unless otherwise noted. 7. Backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising, general lighting) Absolute maximum ratings(ta=25 ) Parameter Symbol Rating Unit Power Dissipation Pd.7 W Forward Current IF 2 ma Peak Forward Current*1 IFP 25 ma Reverse Voltage VR 5 V Operating Temperature Topr -25 ~8 Storage Temperature Tstg -4 ~85 Soldering Temperature Tsol 26 (for 5 seconds) *1Condition for IFP is pulse of 1/1 duty and.1msec width www.gpelec.com REV: 1. Page1of 5
.5W HIGH POWER GPP-TS55WA1 Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage V F I F =15mA 2.8-3.5 V Luminous Flux ф I F =15mA 4-5 Lm Reverse Current I R V R =5V - - 1 μa Correspondingly Color Temperature CCT I F =15mA 28-35 K Viewing Angle 2θ1/2 I F =15mA - 12 - deg *Measurement Uncertainty of Luminous Flux: ±1% *Measurement Uncertainty of Forward Voltage:±.1V *Measurement uncertainty of the color coordinates:±.1 Typical electro-optical characteristics curves 1. Fig.1 Relative intensity vs. Wavelength 6 Fig.2 Forward current derating curve vs. Ambient temperature Relative radiant intensity.5 Forward current (ma) 5 4 3 2 1 4 5 6 Wavelength d (nm) 65 2 4 6 8 1 Ambient temperature Ta( C) 5 Fig.3 Forward current vs. Forward voltage 3. Fig.4 Relative luminous intensity vs. Ambient temperature Foward current (ma) 4 3 2 1 Relative luminous intensity 2.5 2. 1.5 1..5 1 2 3 4 5-4 Forward voltage (V) -2 2 4 6 Ambient temperature Ta( C) 1.6 Fig.5 Relative luminous intensity vs. Forward current Fig.6 Radiation diagram 1 2 3 Relative luminous intensity 1.2.8.5 1 2 3 4 5 Forward current (ma) Relative radiant intensity 1..9.8.7.5.3.1.2.4.6 4 5 6 7 8 9 www.gpelec.com REV: 1. Page2of 5
.5W HIGH POWER GPP-TS55WA1 Bin Limits 1. Luminous Flux bin limits (At I F = 15mA) Bin Code Min. (Lm) Max. (Lm) D 4 5 2. Voltage Bin limits (At I F = 15mA) Bin Code Min. (V) Max. (V) G 2.9 3.1 H 3.1 3.3 J 3.3 3.5 3. Color Bin limits (At I F = 15mA) Chromaticity Ranks Chromaticity Ranks Chromaticity Ranks Chromaticity Ranks Chromaticity Ranks Rank X Y Rank X Y Rank X Y Rank X Y Rank.385.49.379.39.373.368.41.43.4.45.379.39.373.368.367.348.4.45.39.379.359.375.357.357.354.34.379.39.373.368 WA.361.392 WB.359.375 WC.357.357 WD.385.49 WE.379.39.39.379.432.442.422.418.41.39.46.458.382.358.422.418.41.39.4.367.447.43.367.348.4.45.39.379.382.358.422.418 WF.373.368 WG.41.43 WH.4.45 WI.39.379 WJ.432.442.447.43.433.4.49.47.473.44.455.41.433.4.42.373.473.44.455.41.435.375.41.39.4.367.447.43.433.4.42.373 WK.422.418 WL.41.39 WM.46.458 WN.447.43 WO.433.4.51.475.492.445.477.415.492.445.477.415.455.378.473.44.455.41.435.375 WP.49.47 WQ.473.44 WR.455.41 www.gpelec.com REV: 1. Page3of 5
.5W HIGH POWER GPP-TS55WA1.48.46.44.42 Y.4.38 WA WB WE WD WI WH WG WL WK WO WJ WN WR WM WQ WP.36 WC WF.34.32.32.34.36.38.4.42.44.46.48.5.52 X Suggest Soldering Pad Dimensions: Notes: 1. All Dimensions are in millimeters(inches). www.gpelec.com REV: 1. Page4of 5
.5W HIGH POWER GPP-TS55WA1 Suggestion IR Reflow Profile For Pb Free Process Dgree.C. Recommended Profile between Assemble And Heat-Resistance Line Temperature( ) 3. 275. 25. 225. 2. 175. 15. 125. 1. 75. 5. 25... 5. 1. 15. Pre-Heat 14 --2 6--12 sec. Time 255 1 sec. More Than 22 1--4 sec. Peak Temp. 255 25 Peak Temp. 225 22 The Profile is available that must to use SnAg(x=3.3-3.8)Cu(y=.2-.7)Solder paste Precautions for use : 1. Customer must apply the current limiting resistor in the circuit so as to drive the LEDs within the rated current. Otherwise slight voltage shift maybe will cause big current change and burn out will happen. 2. Also, caution should be taken not to overload the LEDs with instantaneous high voltage at the turning ON and OFF of the circuit. 3. Storage: 3.1 Don t open the moisture proof bag before ready to use the LEDs. 3.2 The LEDs should be kept at 3 or less and 6%RH or less before opening the package. The max. storage period before opening the package is 1 year. 3.3 After opening the package, the LEDs should be kept at 3 /35%RH or less, and it should be used within 7 days. 3.4 If the LEDs be kept over the conditions of 3.3, baking is required before mounting. Baking condition as below: 6±5 for 12 hrs. LED and against static: 2. 25. 3. 35. 4. www.gpelec.com REV: 1. Page5of 5