ISCRT SMICONUCTORS T SHT Suprsds data of 2004 pr 06 2004 ug 6
FTURS uilt-in bias rsistors Simplifid circuit dsign Rduction of componnt count Rducd pick and plac costs. PPLICTIONS Gnral purpos switching and amplification Invrtr and intrfac circuits Circuit drivr. QUICK RFRNC T SYMOL PRMTR TYP. MX. UNIT V CO collctor-mittr 50 V voltag I O output currnt (C) 00 m R bias rsistor 4.7 kω R2 bias rsistor 47 kω SCRIPTION NPN rsistor-quippd transistor (s Simplifid outlin, symbol and pinning for packag dtails). PROUCT OVRVIW Not TYP NUMR. * = p: Mad in Hong Kong. * = t: Mad in Malaysia. * = W: Mad in China. PHILIPS PCKG MRKING CO PNP COMPLMNT PTC4Z SOT46 SC-75 8 PT4Z PTC4ZF SOT490 SC-89 5 PT4ZF PTC4ZK SOT46 SC-59 8 PT4ZK PTC4ZM SOT88 SC-0 PT4ZM PTC4ZS SOT54 (TO-92) SC-4 TC4Z PT4ZS PTC4ZT SOT2 *8 () PT4ZT PTC4ZU SOT2 SC-70 *54 () PT4ZU IJ 2004 ug 6 2
SIMPLIFI OUTLIN, SYMOL N PINNING PINNING TYP NUMR SIMPLIFI OUTLIN N SYMOL PIN SCRIPTION PTC4ZS bas 2 collctor handbook, halfpag 2 R 2 R2 mittr MM64 PTC4Z bas PTC4ZF 2 mittr PTC4ZK collctor PTC4ZT PTC4ZU handbook, halfpag 2 R R2 2 Top viw M269 PTC4ZM bas 2 mittr handbook, halfpag 2 R R2 2 bottom viw MHC506 collctor 2004 ug 6
ORRING INFORMTION TYP NUMR PCKG NM SCRIPTION VRSION PTC4Z plastic surfac mountd packag; lads SOT46 PTC4ZF plastic surfac mountd packag; lads SOT490 PTC4ZK plastic surfac mountd packag; lads SOT46 PTC4ZM ladlss ultra small plastic packag; soldr lands; body SOT88.0 0.6 0.5 mm PTC4ZS plastic singl-ndd ladd (through hol) packag; lads SOT54 PTC4ZT plastic surfac mountd packag; lads SOT2 PTC4ZU plastic surfac mountd packag; lads SOT2 LIMITING VLUS In accordanc with th bsolut Maximum Rating Systm (IC 604). SYMOL PRMTR CONITIONS MIN. MX. UNIT V CO collctor-bas voltag opn mittr 50 V V CO collctor-mittr voltag opn bas 50 V V O mittr-bas voltag opn collctor 0 V V I input voltag positiv +0 V ngativ 5 V I O output currnt (C) 00 m I CM pak collctor currnt 00 m P tot total powr dissipation T amb 25 C Nots SOT54 not 500 mw SOT2 not 250 mw SOT46 not 250 mw SOT2 not 200 mw SOT88 nots 2 and 250 mw SOT46 not 50 mw SOT490 nots and 2 250 mw T stg storag tmpratur 65 +50 C T j junction tmpratur 50 C T amb oprating ambint 65 +50 C tmpratur. Rfr to standard mounting conditions. 2. Rflow soldring is th only rcommndd soldring mthod.. Rfr to SOT88 standard mounting conditions; FR4 with 60 μm coppr strip lin. 2004 ug 6 4
THRML CHRCTRISTICS SYMOL PRMTR CONITIONS VLU UNIT R th(j-a) thrmal rsistanc from junction to ambint in fr air SOT54 not 250 K/W SOT2 not 500 K/W SOT46 not 500 K/W SOT2 not 625 K/W SOT88 nots 2 and 500 K/W SOT46 not 8 K/W SOT490 nots and 2 500 K/W Nots. Rfr to standard mounting conditions. 2. Rflow soldring is th only rcommndd soldring mthod.. Rfr to SOT88 standard mounting conditions; FR4 with 60 μm coppr strip lin. CHRCTRISTICS T amb = 25 C unlss othrwis spcifid. SYMOL PRMTR CONITIONS MIN. TYP. MX. UNIT I CO collctor-bas cut-off currnt V C = 50 V; I = 0 00 n I CO collctor-mittr cut-off currnt V C = 0 V; I = 0 μ V C = 0 V; I = 0 ; T j = 50 C 50 μ I O mittr-bas cut-off currnt V = 5 V; I C = 0 70 μ h F C currnt gain V C = 5 V; I C = 0 m 00 V Csat collctor-mittr saturation voltag I C = 5 m; I = 5 m 00 mv V i(off) input-off voltag I C = 00 μ; V C = 5 V 0.6 0.5 V V i(on) input-on voltag I C = 5 m; V C = 0. V. 0.9 V R input rsistor. 4.7 6. kω R2 ------- R rsistor ratio 8 0 2 C c collctor capacitanc I = i = 0 ; V C = 0 V; f = MHz 2.5 pf 2004 ug 6 5
PCKG OUTLINS Plastic surfac-mountd packag; lads SOT46 X H v M Q 2 c bp w M Lp dtail X 0 2 mm scal IMNSIONS (mm ar th original dimnsions) UNIT b p c H L p Q v w mm..0 0. 0.0 0.50 0.5 6 0.0. 2.7.7..9 0.95.0 2.5 0.6 0. OUTLIN VRSION RFRNCS IC JC JIT SOT46 TO-26 SC-59 UROPN PROJCTION ISSU T 04-- 06-0-6 2004 ug 6 6
Ladlss ultra small plastic packag; soldr lands; body.0 x 0.6 x 0.5 mm SOT88 L L 2 b b 0 0.5 mm IMNSIONS (mm ar th original dimnsions) scal UNIT mm () b b max. L L 0.50 0.46 0.0 0 0.2 0.55 0.47 0.62 0.55.02 0.95 0.5 0.65 0.0 2 0.0 2 Not. Including plating thicknss OUTLIN VRSION RFRNCS IC JC JIT UROPN PROJCTION ISSU T SOT88 SC-0 0-02-05 0-04-0 2004 ug 6 7
Plastic singl-ndd ladd (through hol) packag; lads SOT54 c d L b 2 b L 0 2.5 5 mm scal IMNSIONS (mm ar th original dimnsions) UNIT b b c d L L () max. mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.8 4.8 4.4.7.4 4.2.6 2.54.27 4.5 2.7 2.5 Not. Trminal dimnsions within this zon ar uncontrolld to allow for flow of plastic and trminal irrgularitis. OUTLIN VRSION RFRNCS IC JC JIT SOT54 TO-92 SC-4 UROPN PROJCTION ISSU T 04-06-28 04--6 2004 ug 6 8
Plastic surfac-mountd packag; lads SOT2 X H v M Q 2 c bp w M Lp dtail X 0 2 mm scal IMNSIONS (mm ar th original dimnsions) UNIT max.. mm 0. 0.9 b p c H L p Q v w 0.48 0.8 0.5 0.09.0 2.8.4.2.9 0.95 2.5 2. 0.45 0.5 0.55 0.45 0. OUTLIN VRSION SOT2 RFRNCS IC JC JIT TO-26 UROPN PROJCTION ISSU T 04--04 06-0-6 2004 ug 6 9
Plastic surfac-mountd packag; lads SOT2 X y H v M Q 2 c bp w M Lp dtail X 0 2 mm scal IMNSIONS (mm ar th original dimnsions) UNIT max. mm 0. 0.8 b p c H Lp Q v w 0.4 0. 5 0.0 2.2.8.5.5. 0.65 2.2 2.0 0.45 0.5 0. OUTLIN VRSION RFRNCS IC JC JIT UROPN PROJCTION ISSU T SOT2 SC-70 04--04 06-0-6 2004 ug 6 0
Plastic surfac-mountd packag; lads SOT46 X v M H Q 2 c bp w M Lp dtail X 0 0.5 mm scal IMNSIONS (mm ar th original dimnsions) UNIT max mm 0.95 0. 0.60 bp c H L p Q v w 0.0 0.5 5 0.0.8.4 0.9 0.7 0.5.75.45 0.45 0.5 0. OUTLIN VRSION RFRNCS IC JC JIT UROPN PROJCTION ISSU T SOT46 SC-75 04--04 06-0-6 2004 ug 6
Plastic surfac-mountd packag; lads SOT490 X H v M 2 c bp w M Lp dtail X 0 2 mm scal IMNSIONS (mm ar th original dimnsions) UNIT b p c H L p v w mm 0.8 0.6 0. 0..7.5 0.95 0.75.0 0.5.7.5 0.5 0. 0. 0. OUTLIN VRSION SOT490 RFRNCS IC JC JIT SC-89 UROPN PROJCTION ISSU T 05-07-28 06-0-6 2004 ug 6 2
T SHT STTUS Nots OCUMNT STTUS () PROUCT STTUS (2) FINITION Objctiv data sht vlopmnt This documnt contains data from th objctiv spcification for product dvlopmnt. Prliminary data sht Qualification This documnt contains data from th prliminary spcification. Production This documnt contains th product spcification.. Plas consult th most rcntly issud documnt bfor initiating or complting a dsign. 2. Th product status of dvic(s) dscribd in this documnt may hav changd sinc this documnt was publishd and may diffr in cas of multipl dvics. Th latst product status information is availabl on th Intrnt at URL http://www.nxp.com. ISCLIMRS Gnral Information in this documnt is blivd to b accurat and rliabl. Howvr, NXP Smiconductors dos not giv any rprsntations or warrantis, xprssd or implid, as to th accuracy or compltnss of such information and shall hav no liability for th consquncs of us of such information. Right to mak changs NXP Smiconductors rsrvs th right to mak changs to information publishd in this documnt, including without limitation spcifications and product dscriptions, at any tim and without notic. This documnt suprsds and rplacs all information supplid prior to th publication hrof. Suitability for us NXP Smiconductors products ar not dsignd, authorizd or warrantd to b suitabl for us in mdical, military, aircraft, spac or lif support quipmnt, nor in applications whr failur or malfunction of an NXP Smiconductors product can rasonably b xpctd to rsult in prsonal injury, dath or svr proprty or nvironmntal damag. NXP Smiconductors accpts no liability for inclusion and/or us of NXP Smiconductors products in such quipmnt or applications and thrfor such inclusion and/or us is at th customr s own risk. pplications pplications that ar dscribd hrin for any of ths products ar for illustrativ purposs only. NXP Smiconductors maks no rprsntation or warranty that such applications will b suitabl for th spcifid us without furthr tsting or modification. Limiting valus Strss abov on or mor limiting valus (as dfind in th bsolut Maximum Ratings Systm of IC 604) may caus prmannt damag to th dvic. Limiting valus ar strss ratings only and opration of th dvic at ths or any othr conditions abov thos givn in th Charactristics sctions of this documnt is not implid. xposur to limiting valus for xtndd priods may affct dvic rliability. Trms and conditions of sal NXP Smiconductors products ar sold subjct to th gnral trms and conditions of commrcial sal, as publishd at http://www.nxp.com/profil/trms, including thos prtaining to warranty, intllctual proprty rights infringmnt and limitation of liability, unlss xplicitly othrwis agrd to in writing by NXP Smiconductors. In cas of any inconsistncy or conflict btwn information in this documnt and such trms and conditions, th lattr will prvail. No offr to sll or licns Nothing in this documnt may b intrprtd or construd as an offr to sll products that is opn for accptanc or th grant, convyanc or implication of any licns undr any copyrights, patnts or othr industrial or intllctual proprty rights. xport control This documnt as wll as th itm(s) dscribd hrin may b subjct to xport control rgulations. xport might rquir a prior authorization from national authoritis. Quick rfrnc data Th Quick rfrnc data is an xtract of th product data givn in th Limiting valus and Charactristics sctions of this documnt, and as such is not complt, xhaustiv or lgally binding. 2004 ug 6
Customr notification This data sht was changd to rflct th nw company nam NXP Smiconductors, including nw lgal dfinitions and disclaimrs. No changs wr mad to th tchnical contnt, xcpt for packag outlin drawings which wr updatd to th latst vrsion. Contact information For additional information plas visit: http://www.nxp.com For sals offics addrsss snd -mail to: salsaddrsss@nxp.com NXP.V. 2009 ll rights ar rsrvd. Rproduction in whol or in part is prohibitd without th prior writtn consnt of th copyright ownr. Th information prsntd in this documnt dos not form part of any quotation or contract, is blivd to b accurat and rliabl and may b changd without notic. No liability will b accptd by th publishr for any consqunc of its us. Publication throf dos not convy nor imply any licns undr patnt- or othr industrial or intllctual proprty rights. Printd in Th Nthrlands R75/07/pp4 at of rlas: 2004 ug 6 ocumnt ordr numbr: 997 750 677