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Transcription:

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - NXP N.V. (year). ll rights reserved or Koninklijke Philips Electronics N.V. (year). ll rights reserved Should be replaced with: - Nexperia.V. (year). ll rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

DISCRETE SEMICONDUCTORS DT SHEET Supersedes data of 2004 Mar 18 2004 ug 06

FETURES uilt-in bias resistors Simplified circuit design Reduction of component count Reduced pick and place costs. PPLICTIONS General purpose switching and amplification Inverter and interface circuits Circuit driver. QUICK REFERENCE DT SYMOL PRMETER TYP. MX. UNIT V CEO collector-emitter 50 V voltage I O output current (DC) 100 m R1 bias resistor 2.2 kω R2 bias resistor 2.2 kω DESCRIPTION NPN resistor-equipped transistor (see Simplified outline, symbol and pinning for package details). PRODUCT OVERVIEW Note TYPE NUMER 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. PHILIPS PCKGE MRKING CODE PNP COMPLEMENT PDTC12EE SOT416 SC-75 5 PDT12EE PDTC12EEF SOT490 SC-89 6 PDT12EEF PDTC12EK SOT46 SC-59 48 PDT12EK PDTC12EM SOT88 SC-101 G1 PDT12EM PDTC12ES SOT54 (TO-92) SC-4 TC12E PDT12ES PDTC12ET SOT2 *26 (1) PDT12ET PDTC12EU SOT2 SC-70 *48 (1) PDT12EU EIJ 2004 ug 06 2

SIMPLIFIED OUTLINE, SYMOL ND PINNING PINNING TYPE NUMER SIMPLIFIED OUTLINE ND SYMOL PIN DESCRIPTION PDTC12ES 1 base 2 collector handbook, halfpage 2 1 R1 1 2 R2 emitter MM64 PDTC12EE 1 base PDTC12EEF 2 emitter PDTC12EK collector PDTC12ET PDTC12EU handbook, halfpage 1 1 2 R1 R2 2 Top view MD269 PDTC12EM 1 base 2 emitter handbook, halfpage 2 R1 1 R2 1 2 bottom view MHC506 collector 2004 ug 06

ORDERING INFORMTION TYPE NUMER PCKGE NME DESCRIPTION VERSION PDTC12EE plastic surface mounted package; leads SOT416 PDTC12EEF plastic surface mounted package; leads SOT490 PDTC12EK plastic surface mounted package; leads SOT46 PDTC12EM leadless ultra small package; solder lands; body 1.0 0.6 SOT88 0.5 mm PDTC12ES plastic single-ended leaded (through hole) package; leads SOT54 PDTC12ET plastic surface mounted package; leads SOT2 PDTC12EU plastic surface mounted package; leads SOT2 LIMITING VLUES In accordance with the bsolute Maximum Rating System (IEC 6014). SYMOL PRMETER CONDITIONS MIN. MX. UNIT V CO collector-base voltage open emitter 50 V V CEO collector-emitter voltage open base 50 V V EO emitter-base voltage open collector 10 V V I input voltage positive +12 V negative 10 V I O output current (DC) 100 m I CM peak collector current 100 m P tot total power dissipation T amb 25 C Notes SOT54 note 1 500 mw SOT2 note 1 250 mw SOT46 note 1 250 mw SOT2 note 1 200 mw SOT416 note 1 150 mw SOT490 notes 1 and 2 250 mw SOT88 notes 2 and 250 mw T stg storage temperature 65 +150 C T j junction temperature 150 C T amb operating ambient temperature 65 +150 C 1. Refer to standard mounting conditions. 2. Reflow soldering is the only recommended soldering method.. Refer to SOT88 standard mounting conditions; FR4 with 60 μm copper strip line. 2004 ug 06 4

THERML CHRCTERISTICS SYMOL PRMETER CONDITIONS VLUE UNIT R th(j-a) thermal resistance from junction to ambient in free air SOT54 note 1 250 K/W SOT2 note 1 500 K/W SOT46 note 1 500 K/W SOT2 note 1 625 K/W SOT416 note 1 8 K/W SOT490 notes 1 and 2 500 K/W SOT88 notes 2 and 500 K/W Notes 1. Refer to standard mounting conditions. 2. Reflow soldering is the only recommended soldering method.. Refer to SOT88 standard mounting conditions; FR4 with 60 μm copper strip line. CHRCTERISTICS T amb = 25 C unless otherwise specified. SYMOL PRMETER CONDITIONS MIN. TYP. MX. UNIT I CO collector-base cut-off current V C = 50 V; I E = 0 100 n I CEO collector-emitter cut-off current V CE = 0 V; I = 0 1 μ V CE = 0 V; I = 0 ; T j = 150 C 50 μ I EO emitter-base cut-off current V E = 5 V; I C = 0 2 m h FE DC current gain V CE = 5 V; I C = 20 m 0 V CEsat collector-emitter saturation voltage I C = 10 m; I = 0.5 m 150 mv V i(off) input-off voltage I C = 1 m; V CE = 5 V 1.2 0.5 V V i(on) input-on voltage I C = 20 m; V CE = 0. V 2 1.6 V R1 input resistor 1.54 2.2 2.86 kω R2 ------- R1 resistor ratio 0.8 1 1.2 C c collector capacitance V C = 10 V; I E = i e = 0 ; f = 1 MHz 2.5 pf 2004 ug 06 5

PCKGE OUTLINES Plastic surface-mounted package; leads SOT416 D E X v M H E Q 1 2 1 c e1 bp w M e Lp detail X 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT 1 max mm 0.95 0.1 0.60 bp c D E e e 1 H E L p Q v w 0.0 0.15 5 0.10 1.8 1.4 0.9 0.7 1 0.5 1.75 1.45 0.45 0.15 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT416 SC-75 04-11-04 06-0-16 2004 ug 06 6

Plastic surface-mounted package; leads SOT490 D E X H E v M 1 2 c e1 bp w M Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT b p c D E e e 1 H E L p v w mm 0.8 0.6 0. 0.1 1.7 1.5 0.95 0.75 1.0 0.5 1.7 1.5 0.5 0. 0.1 0.1 OUTLINE VERSION SOT490 REFERENCES IEC JEDEC JEIT SC-89 EUROPEN PROJECTION ISSUE DTE 05-07-28 06-0-16 2004 ug 06 7

Plastic surface-mounted package; leads SOT46 D E X H E v M Q 1 2 1 c e1 bp w M Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT 1 b p c D E e e 1 H E L p Q v w mm 1. 1.0 0.1 0.01 0.50 0.5 6 0.10.1 2.7 1.7 1. 1.9 0.95.0 2.5 0.6 0. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT46 TO-26 SC-59 EUROPEN PROJECTION ISSUE DTE 04-11-11 06-0-16 2004 ug 06 8

Leadless ultra small plastic package; solder lands; body 1.0 x 0.6 x 0.5 mm SOT88 L L 1 2 b e b 1 1 e 1 1 E D 0 0.5 1 mm DIMENSIONS (mm are the original dimensions) scale UNIT mm (1) 1 b b max. 1 D E e e 1 L L 1 0.50 0.46 0.0 0 0.12 0.55 0.47 0.62 0.55 1.02 0.95 0.5 0.65 0.0 2 0.0 2 Note 1. Including plating thickness OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT88 SC-101 0-02-05 0-04-0 2004 ug 06 9

Plastic single-ended leaded (through hole) package; leads SOT54 c E d L b 1 D 2 e 1 e b 1 L 1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT b b 1 c D d E e e 1 L L 1 (1) max. mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.8 4.8 4.4 1.7 1.4 4.2.6 2.54 1.27 14.5 12.7 2.5 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT54 TO-92 SC-4 EUROPEN PROJECTION ISSUE DTE 04-06-28 04-11-16 2004 ug 06 10

Plastic surface-mounted package; leads SOT2 D E X H E v M Q 1 1 2 c e1 bp w M Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT 1 max. 1.1 mm 0.1 0.9 b p c D E e e 1 H E L p Q v w 0.48 0.8 0.15 0.09.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.1 OUTLINE VERSION SOT2 REFERENCES IEC JEDEC JEIT TO-26 EUROPEN PROJECTION ISSUE DTE 04-11-04 06-0-16 2004 ug 06 11

Plastic surface-mounted package; leads SOT2 D E X y H E v M Q 1 2 1 c e1 bp w M Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT 1 max 1.1 mm 0.1 0.8 b p c D E e e 1 H E Lp Q v w 0.4 0. 5 0.10 2.2 1.8 1.5 1.15 1. 0.65 2.2 2.0 0.45 0.15 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT2 SC-70 04-11-04 06-0-16 2004 ug 06 12

DT SHEET STTUS Notes DOCUMENT STTUS (1) PRODUCT STTUS (2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Production This document contains the product specification. 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. pplications pplications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the bsolute Maximum Ratings System of IEC 6014) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 2004 ug 06 1

Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com NXP.V. 2009 ll rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/07/pp14 Date of release: 2004 ug 06 Document order number: 997 750 1667

Mouser Electronics uthorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Nexperia: PDTC12ETVL NXP: PDTC12EE,115 PDTC12EM,15 PDTC12ET,215 PDTC12EU,115

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