FEATURE Silicon epitaxial planar diode () Surface mount pattern, available in various dimension included 0805 & 0603 (, 0805 0603,) Lead free and RoHS compliance components. (RoHS Fast AC switching input as rectified circuit and high reverse voltage location. Figure Cathode Band Color: white MECHANICAL CHARACTERISTICS Size : 0805 Weight: Approx 6.0mg. Marking: Cathode band. Electrical Symbol DIMENSION Dimension (mm) Type: 0805 L 2.0 ± 0.2 W 1.25 ± 0.2 T 0.85 ± 0.1 C 0.45 ± 0.2 W T L C THERMAL CHARACTERISTICS Parameter at Tamb = 25 1 Symbol Junction Temperature Thermal Resistance Junction to Ambient air R JA Storage Temperature range T stg *1. alid provided that electrodes are kept at ambient temperature. T j alue 150 375-55 to 150 Unit /W ELECTRICAL CHARACTERISTICS Parameter at Tamb = 25 Repetitive Peak Reverse oltage Forward Continuous Current amb =25 Average rectified current sin half wave rectification with resistive load Non-Repetitive Surge Forward Current at t<1s and and Tj=25; at t8.3ms and Tj=25. Forward Power Dissipation Power derating above 25. Forward oltage at I F =10 Forward oltage at I F = Leakage Current at R =20 Leakage Current at R =75 Capacitance at R =0, f=1mhz. oltage rise when switching ON, Testes with 50 pulses, TP=0.1us, risetime <20ns, Fp=(5- Reverse Recovery Time at I F = to I R =1, R =6, R L = Rectification efficiency at f=mhz, RF =2 1. alid provided that electrodes are kept at ambient temperature. Symbol RRM (PK) I FRM I F (A) F T RR nr alue 150 1.0 max 1.25 max 25 max 0.5 max 4 max 2.5 25max 4.0 max Unit I FSM 500 0 mw Ptot 3.2 mw/ I R C tot fr 300 na A pf ns 45 min % Page: P5- P1
TEST CHARACTERISTICS: Test Item Test Condition Requirement Solderability Sn bath at 245±5 for 2±0.5s >95% area tin covered Resistance to Soldering Heat Sn bath at 260±5 for 10±0.5s F, Z, & IR Within spec, no mechanical damage Humidity Steady State At 85 85%RH for 168hrs F, Z, & IR Within spec Continue Forward Operating Life At 25 IF = 1.1 IF for 0hrs F, Z, & IR Within spec Hi-Temperature Reverse Bias At 150 R = 0.8R rated for 0hrs F, Z, & IR Within spec Thermal Shock -55±5/5min to 150±5/5min for 10cycles F, Z, & IR Within spec Bending Strength Bending up to 2mm for 1 cycle F, Z, & IR Within spec, no mechanical damage APPLICATIONS: Function: Fast Switching. Soldering Condition: Soldering Condition & Caution: Recommended Profile Condition Sn-Pb Soldering Lead-free Soldering Wave Soldering Ramp-up rate (from pre-heat stage) <3/s <3/s T<150 Pre-heat Temperature & Time -150, 60~120s -200, 60~120s -150, 60~120s Soldering Temperature & Time 183, 60~150s 270, 60~150s 260±5, 5±2s Peak Temperature 230±5, <260 245±5, <260 260±5 Time within 5 of peak temperature 10~20s 20~30s - Ramp-down rate <6/s <6/s <6/s Time 25 to peak temperature <6min <8min - Manual Soldering: Approx. 350 for 3s, avoid solder iron tip direct touch the components body. RECTIFICATION EFFICIENCY MEASUREMENT CIRCUIT Fast AC switching input as rectified circuit and high reverse voltage location. DEICE OUTLOOK: PRODUCT STRUCTURE TURE Plant front side Plant back side Page: P5- P2
TYPICAL CHARACTERISTICS Figure 1 : Forward Characteristics Ptot-Admissible Power Dissipation / mw 500 200 0 0 20 40 60 80 120 140 160 Tamb-Ambient Temperature/ Figure 3 : Power De-rating Figure 2. : Dynamic Forward Resistor S Forward Current IF / 300 200 0 0 20 40 60 80 120 140 160 Tamb-Ambient Temperature/ Figure 4 : Forward Current De-rating Figure 5 : Reverse oltage De-rating Page: P5- P3
RECOMMENDED SOLDERING PROFILE: Fig 1: Reflow soldering profile for lead-free solder (SnAgCu) Fig 1: Wave soldering profile. Mounting Pad Layout RECOMMENDED SOLDERING FOOTPRINT A Refloe/Wave Soldering: Size: Dimension (mm) A B C D D 0603 1.8~2.6 0.8 0.5~0.9 0.8~1.0 0805 2.2~3.0 1.2 0.5~0.9 1.2~1.4 B 1206 3.4~4.2 2.1~2.2 0.6~1.0 1.5~1.7 C Storage Condition: Product termination solderability can degrade due high temperature and humidity or chemical environment, Storage condition must be in an ambient temperature of <40 and ambient humidity of <75%RH, and free from chemical. ENIRONMENTAL CHARACTERISTICS Product Hazerdous Substance or Element / ppm Pd Cd Hg Cr 6+ PBB PBDE CD4148WTP <0 < <0 <0 <0 <0 CD4148WSN <0 < <0 <0 <0 <0 CD4148WN <0 < <0 <0 <0 <0 Halogen Substance / ppm Product F Cl Br I - Total <900 <900 <900 <900 - <1500 PACKING METHOD: Product CD4148WTP CD4148WSN CD4148WN Quantity / Reel Reel Size Tape Approx Gross Weigh 10.5 Kgs/300K Ctn 10.5 Kgs/300K Ctn 13.0 Kgs/300K Ctn Carton: Size: Quantity: In Box: Box Qty: Type Reel: 39x39x20 cm 300K / Ctn. 6 Box 50K/Box 5K/Reel Page: P5- P4
PACKAGE Plastic reel front side Plastic reel back side In box packing Reel label Carton packing: Mayloon characteristic parameters of electronic product specification changes or updates without notice to improve Page: P5- P5