ProLight PDSB-7FxL-BC0P 7W COB Light-Engine LEDs Technical Datasheet Version: 1.4 Features High flux density of lighting source Good color uniformity RoHS compliant Energy Star binning structure, warm white with 4 steps guarantee. More energy efficient than incandescent and most halogen lamps No UV Long lifetime Main Applications MR 16 Track lighting Downlight Introduction The input power is 7 Watt, the multi-chip ultra high power ProEngine Series delivers never before seen luminous flux output from a single emitter. The superficial illuminating nature of ProEngine makes them the preference in MR 16 and GU10, typical applications include track lighting and Downlight. 2015/10 DS-0294
Emitter Mechanical Dimensions Notes: 1. Solder pads are labeled + and - to denote positive and negative, respectively. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. Unless otherwise indicated, tolerances are ± 0.20mm. 5. Please do not use a force of over 0.3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. 2
Flux Characteristics, T C = 25 C Radiation Pattern Lambertian Color Neutral Warm Part Number COB PDSB-7FWL-BC0P PDSB-7FNL-BC0P PDSB-7FVL-BC0P DC Forward Current (ma) Luminous Flux Φ V (lm) CRI Minimum Typical Minimum 30 * 600 670 38 * 720 800 40 * 740 820 30 * 590 650 38 * 710 780 40 * 730 800 30 * 580 630 38 * 700 760 40 * 720 780 The mark * indicated product is tested and binned at the specified drive current. ProLight maintains a tolerance of ± 7% on flux and power measurements. ProLight maintains a tolerance of ± 2 on CRI measurements. Please do not drive at rated current more than 1 second without proper heat sink. 80 80 80 Electrical Characteristics at 38mA, T C = 25 C Forward Voltage V F (V) Thermal Resistance Color Min. Typ. Max. Junction to Board ( /W) 170 182 190 2.9 Neutral 170 182 190 2.9 Warm 170 182 190 2.9 ProLight maintains a tolerance of ± 2V for Voltage measurements. Optical Characteristics at 38mA, T C = 25 C Total included Viewing Angle Angle Color Bin Code Color Temperature CCT (degrees) (degrees) Min. Typ. Max. θ 0.90V 2 θ 1/2 V0 4770 K 5000 K 5230 K 160 120 W0 5350 K 5630 K 5910 K 160 120 X0 6100 K 6500 K 6780 K 160 120 Neutral S0 3840 K 4000 K 4130 K 160 120 Warm M0 2640 K 2700 K 2810 K 160 120 N0 2940 K 3000 K 3150 K 160 120 ProLight maintains a tolerance of ± 5% for CCT measurements. 3
Absolute Maximum Ratings Parameter /Neutral /Warm Max DC Forward Current (ma) 40 Peak Pulsed Forward Current (ma) 50 (less than 1/10 duty cycle@1khz) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) ±2000V LED Junction Temperature 120 C Operating Board Temperature at Maximum DC Forward Current -40 C - 90 C Storage Temperature -40 C - 120 C Reverse Voltage Not designed to be driven in reverse bias 4
y Color Bin Binning Structure Graphical Representation 0.42 IEC 62612 4-step ellipse ANSI C78.377 0.40 0.38 0.36 6500 K 5630 K 5000 K V0 Planckian (BBL) 0.34 X0 W0 0.32 0.30 0.28 0.30 0.32 0.34 0.36 0.38 0.40 X Bin Structure Bin Code x y Typ. CCT (K) Bin Code x y 0.3390 0.3445 0.3240 0.3315 V0 0.3395 0.3595 0.3230 0.3450 5000 W0 0.3535 0.3710 0.3365 0.3570 0.3515 0.3545 0.3360 0.3420 Tolerance on each color bin (x, y) is ± 0.005 Typ. CCT (K) 5630 Bin Code X0 x y Center 0.3130 0.3370 Oval parameter a 0.00223 b 0.0038 Ɵ 58.38 Typ. CCT (K) 6500 Color range stay within MacAdam 4-step ellipse from the chromaticity center. The chromaticity center refers to IEC 62612. Tolerance on each color bin (x, y) is ± 0.005 5
y Color Bin Neutral Binning Structure Graphical Representation 0.44 Color Range ANSI C78.377 0.42 0.40 4000 K 0.38 S0 Planckian (BBL) 0.36 0.34 Neutral 0.32 0.32 0.34 0.36 0.38 0.40 0.42 0.44 Neutral Bin Structure X Bin Code S0 x y Center 0.3818 0.3797 Oval parameter a 0.01252 b 0.00536 Ɵ 53.72 Typ. CCT (K) 4000 Color range stay within MacAdam 4-step ellipse from the chromaticity center. The chromaticity center refers to ANSI C78.377. Tolerance on each color bin (x, y) is ± 0.005 6
y Color Bin Warm Binning Structure Graphical Representation 0.48 Color Range ANSI C78.377 0.46 0.44 2700 K 3000 K 0.42 0.40 N0 M0 Planckian (BBL) 0.38 0.36 Warm 0.34 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 Warm Bin Structure X Bin Code M0 x y Center 0.4578 0.4101 Oval Typ. CCT Oval Bin Code Center parameter (K) parameter a 0.0108 a 0.01112 x 0.4338 b 0.0056 2700 N0 b 0.00544 y 0.4030 Ɵ 53.70 Ɵ 53.22 Typ. CCT (K) 3000 Color range stay within MacAdam 4-step ellipse from the chromaticity center. The chromaticity center refers to ANSI C78.377. Tolerance on each color bin (x, y) is ± 0.005 7
Relative Spectral Power Distribution Relative Spectral Power Distribution Relative Spectral Power Distribution Color Spectrum, T C = 25 C 1. 1.0 0.8 Standard Eye Response Curve 0.6 0.4 0.2 2. Neutral 0.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength (nm) 1.0 0.8 0.6 0.4 0.2 Standard Eye Response Curve Neutral 0.0 350 400 450 500 550 600 650 700 750 800 850 900 3. Warm Wavelength (nm) 1.0 Standard Eye Response Curve 0.8 0.6 0.4 0.2 Warm 0.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength (nm) 8
x y Relative Luminous Flux (%) Forward Voltage (V) Case Temperature Relative Characteristics 110 195 105 100 95 90 85 80 190 185 180 175 170 75 165 70 25 35 45 55 65 75 85 95 105 Board Temperature ( C) 160 20 30 40 50 60 70 80 90 Board Temperature ( C) Fig 1. Case Temperature vs. Relative Luminous Flux at 38mA. Fig 2. Case Temperature vs. Forward Voltage at 38mA. 0.005 Neutral, Warm 0.005 Neutral, Warm 0.000 0.000-0.005-0.005-0.010-0.010-0.015-0.015-0.020 25 35 45 55 65 75 85 95 105-0.020 25 35 45 55 65 75 85 95 105 Board Temperature ( C) Board Temperature ( C) Fig 3. Case Temperature vs. Chromaticity Coordinate Δx at 38mA. Fig 4. Case Temperature vs. Chromaticity Coordinate Δy at 38mA. 9
x y Forward Voltage (V) Relative Luminous Flux (%) Forward Current Relative Characteristics 185 1.2 180 1.0 175 0.8 170 0.6 165 0.4 160 0.2 155 0 10 20 30 40 50 0.0 0 10 20 30 40 50 Forward Current (ma) Forward Current (ma) Fig 5. Forward Current vs. Forward Voltage at T C =25 C. Fig 6. Forward Current vs. Relative Luminous Flux at T C =25 C. 0.020 Neutral, Warm 0.020 Neutral, Warm 0.015 0.015 0.010 0.010 0.005 0.005 0.000 0.000-0.005-0.005-0.010-0.010-0.015-0.015-0.020 0 10 20 30 40 50-0.020 0 10 20 30 40 50 Forward Current (ma) Forward Current (ma) Fig 7. Forward Current vs. Chromaticity Coordinate Δx at T C =25 C. Fig 8. Forward Current vs. Chromaticity Coordinate Δy at T C =25 C. 10
Case Temperature vs. Junction Temperature Characteristics T J ( C) T C ( C) 30 (ma) 38 (ma) 40 (ma) 0 15 20 21 5 20 25 26 10 25 30 31 15 30 35 36 20 35 40 41 25 40 45 46 30 45 50 51 35 50 55 56 40 55 60 61 45 60 65 66 50 65 70 71 55 70 75 76 60 75 80 81 65 80 85 86 70 85 90 91 75 90 95 96 80 95 100 101 85 100 105 106 90 105 110 111 95 110 115 116 100 115 120 121 Fig 9. Case Temperature vs. Junction Temperature at 30 38 40mA. 11
y y Color Coordinate vs. Forward Current, T C = 25 C Binning Graphical Representation 0.42 30 ma 38 ma 40 ma 0.40 0.38 0.36 5630 K 5000 K Planckian (BBL) 6500 K V0 0.34 W0 0.32 0.30 0.28 0.30 0.32 0.34 0.36 0.38 0.40 X Neutral Binning Graphical Representation 0.44 30 ma 38 ma 40 ma 0.42 0.40 4000 K 0.38 S0 Planckian (BBL) 0.36 0.34 Neutral 0.32 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X 12
y Color Coordinate vs. Forward Current, T C = 25 C Warm Binning Graphical Representation 0.46 30 ma 38 ma 40 ma 0.44 2700 K 0.42 0.40 3000 K N0 M0 Planckian (BBL) 0.38 0.36 Warm 0.34 0.38 0.40 0.42 0.44 0.46 0.48 0.50 X 13
Relative Intensity (%) Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 100 90 80 70 60 50 40 30 20 10 0-100 -80-60 -40-20 0 20 40 60 80 100 Angular Displacement (Degrees) Polar Radiation Pattern 14
Packing Specifications Product 36 pcs/tray Notes: 1. Drawing not to scale. 2. All dimensions are in millimeters. 3. Unless otherwise indicated, tolerances are ± 0.20mm. 15
Recommended Soldering Condition Please use lead free and no clean solders. Soldering shall be implemented using a soldering tip at a temperature lower than 350, and shall be finished within 3.5 seconds for each pad. During the soldering process, put the LEDs on materials whose conductivity is poor enough not to radiate heat of soldering. Properly solder tin wires before soldering them to LEDs. Avoid touching the silicone lens with the soldering iron. Please prevent flux from touching to the silicone lens. Please solder evenly on each pad. Contacts number of a soldering tip should be within twice for each pad. Next process of soldering should be carried out after the LEDs have return to ambient temperature. *ProLight cannot guarantee if usage exceeds these recommended conditions. Please use it after sufficient verification is carried out on your own risk if absolutely necessary. Precaution for Use The modules light output are intense enough to cause injury to human eyes if viewed directly. Precautions must be taken to avoid looking directly at the modules with unprotected eyes. The modules are sensitive to electrostatic discharge. Appropriate ESD protection measures must be taken when working with the modules. Non-compliance with ESD protection measures may lead to damage or destruction of the product. Chemical solvents or cleaning agents must not be used to clean the modules. Mechanical stress on the Emitters must be avoided. It is best to use a soft brush, damp cloth or low-pressure compressed air. The products should be stored away from direct light in dry location. The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. http:/// Handling of Silicone Lens LEDs Notes for handling of silicone lens LEDs Please do not use a force of over 0.3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure. Avoid touching the silicone lens especially by sharp tools such as Tweezers. Avoid leaving fingerprints on the silicone lens. Please store the LEDs away from dusty areas or seal the product against dust. Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) 16