INTEGRATED CIRCUITS Supersedes data of 1997 May 15 IC24 Data Handbook 1998 Jun 23
FEATURES Wide operating voltage: 1.0 to 5.5V Optimized for low voltage applications: 1.0V to 3.6V Accepts TTL input levels between V CC = 2.7V and V CC = 3.6V Typical V OLP (output ground bounce) < 0.8V at V CC = 3.3V, T amb = 25 C Typical V OHV (output V OH undershoot) > 2V at V CC = 3.3V, T amb =25 C Compare two 8-bit words Output capability: standard I CC category: MSI DESCRIPTION The is a high-speed Si-gate CMOS device, pin compatible with the 74HC/HCT688 The is an. It performs comparisons of two 8-bit binary or BCD words. The output provides P = Q (equal-to). QUICK REFERENCE DATA t PHL /t PLH SYMBOL PARAMETER CONDITIONS TYPICAL UNIT Propagation delay P n, Q n to P=Q C L = 15pF V CC = 3.3V 17 ns C I Input capacitance 3.5 pf C PD Power dissipation capacitance per gate V I = GND to V CC 1 22 pf NOTE: 1. C PD is used to determine the dynamic power dissipation (P D in W): P D = C PD V CC 2 f i + (C L V CC 2 f o ) where: f i = input frequency in MHz; C L = output load capacity in pf; f o = output frequency in MHz; V CC = supply voltage in V; (C L V CC 2 f o ) = sum of outputs. ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. # 20-Pin Plastic DIL 40 C to +125 C N N SOT146-1 20-Pin Plastic SO 40 C to +125 C D D SOT163-1 20-Pin Plastic SSOP Type II 40 C to +125 C DB DB SOT339-1 20-Pin Plastic TSSOP Type I 40 C to +125 C PW PW DH SOT360-1 PIN CONFIGURATION PIN DESCRIPTION PIN NO. SYMBOL FUNCTION E P0 Q0 1 2 3 20 19 18 V CC P = Q Q7 1 E Enable input (active LOW) 2, 4, 6, 8, 11, P0 to P7 Word inputs 13, 15, 17 P1 Q1 P2 4 5 6 17 16 15 P7 Q6 P6 3, 5, 7, 9, 12, 14, 16, 18 Q0 to Q7 Word inputs 10 GND Ground (0V) Q2 7 14 Q5 19 P=Q Equal to output P3 8 13 P5 20 V CC Positive Supply Voltage Q3 9 12 Q4 GND 10 11 P4 SY00054 1998 Jun 23 2 853-1878 19618
LOGIC SYMBOL LOGIC DIAGRAM 2 4 6 8 11 13 15 17 3 5 7 9 12 14 16 18 P0 P1 P2 P3 P4 P5 P6 P7 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 P = Q E 19 P7 Q7 P6 Q6 P5 Q5 P4 Q4 P3 Q3 P = Q 1 SY00055 P2 Q2 LOGIC SYMBOL (IEEE/IEC) P1 Q1 1 2 4 6 8 11 13 15 17 3 5 7 9 12 14 16 18 G1 0 7 0 7 P 19 (P = Q) 1 Q SY00056 P0 Q0 E FUNCTION TABLE DATA Pn, Qn INPUTS ENABLE E SY00057 OUTPUT P = Q P = Q L L X H H P > Q L H P < Q L H NOTES: H = HIGH voltage level L = LOW voltage level X = Don t care 1998 Jun 23 3
ABSOLUTE MAXIMUM RATINGS 1, 2 In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0V). SYMBOL PARAMETER CONDITIONS MIN MAX UNIT V CC DC supply voltage 0.5 +7.0 V I IK DC input diode current V I < 0.5 V or V 1 > V CC + 0.5V ± 20 ma I OK DC output diode current V O < 0.5 V or V 0 > V CC + 0.5V ± 50 ma I O DC output source or sink current standard outputs 0.5V < V O < V CC +0.5V ± 25 ma DC V ± I CC or GND current for types with GND, standard outputs ± I CC ± 50 ma T stg Storage temperature range 65 +150 C P tot power dissipation per package plastic DIL plastic mini-pack (SO) plastic medium-shrink SO (SSOP and TSSOP) for temperature range: 40 to +125 C above +70 C derate linearly with 12 mw/k above +70 C derate linearly with 8 mw/k above +60 C derate linearly with 5.5 mw/k NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolutemaximumrated conditions for extended periods may affect device reliability. 2. The performance capability of a highperformance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C. 3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. 750 500 400 mw RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V CC DC supply voltage see note 1 1.0 3.3 5.5 V V I DC Input voltage 0 V CC V V O DC output voltage 0 V CC V T amb Operating ambient temperature range in freeair See DC and AC characteristics 40 40 +85 +125 C t r, t f ( t/ v) Input rise and fall times V CC = 1.0V to 2.0V V CC = 2.0V to 2.7V V CC = 2.7V to 3.6V V CC = 3.6V to 5.5V NOTE: 1. The LV is guaranteed to function down to V CC = 1.0V (input levels GND or V CC ); DC characteristics are guaranteed from V CC = 1.2V to V CC = 5.5V. 500 200 100 50 ns/v 1998 Jun 23 4
DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions. Voltages are referenced to GND (ground = 0V). LIMITS SYMBOL PARAMETER TEST CONDITIONS -40 C to +85 C -40 C to +125 C UNIT MIN TYP 1 MAX MIN MAX V CC = 1.2V 0.9 0.9 HIGH level Input V CC = 2.0V 1.4 1.4 V IH voltage V CC = 2.7 to 3.6V 2.0 2.0 V V CC = 4.5 to 5.5V 0.7 V CC 0.7 V CC V CC = 1.2V 0.3 0.3 LOW level Input V CC = 2.0V 0.6 0.6 V IL voltage V CC = 2.7 to 3.6V 0.8 0.8 V CC = 4.5 to 5.5 0.3 V CC 0.3 V CC V CC = 1.2V; V I = V IH or V IL; I O = 100µA 1.2 V CC = 2.0V; V I = V IH or V IL; I O = 100µA 1.8 2.0 1.8 HIGH level output voltage; all outputs uts V CC = 2.7V; V I = V IH or V IL; I O = 100µA 2.5 2.7 2.5 V CC = 3.0V; V I = V IH or V IL; I O = 100µA 2.8 3.0 2.8 V OH V CC = 4.5V; V I = V IH or V IL; I O = 100µA 4.3 4.5 4.3 HIGH level output voltage; V CC = 3.0V; V I = V IH or V IL; I O = 6mA 2.40 2.82 2.20 STANDARD outputs V CC = 4.5V; V I = V IH or V IL; I O = 12mA 3.60 4.20 3.50 V CC = 1.2V; V I = V IH or V IL; I O = 100µA 0 V CC = 2.0V; V I = V IH or V IL; I O = 100µA 0 0.2 0.2 LOW level output voltage; all outputs uts V CC = 2.7V; V I = V IH or V IL; I O = 100µA 0 0.2 0.2 V CC = 3.0V; V I = V IH or V IL; I O = 100µA 0 0.2 0.2 V OL V CC = 4.5V; V I = V IH or V IL; I O = 100µA 0 0.2 0.2 V V V I I I CC LOW level output voltage; V CC = 3.0V; V I = V IH or V IL; I O = 6mA 0.25 0.40 0.50 STANDARD outputs V CC = 4.5V; V I = V IH or V IL; I O = 12mA 0.35 0.55 0.65 Input leakage current Quiescent supply current; MSI V CC = 5.5V; V I = V CC or GND 1.0 1.0 µa V CC = 5.5V; V I = V CC or GND; I O = 0 20.0 160 µa I CC Additional quiescent supply V CC = 2.7V to 3.6V; V I = V CC 0.6V 500 850 µa current NOTE: 1. All typical values are measured at T amb = 25 C. 1998 Jun 23 5
AC CHARACTERISTICS GND = 0V; t r = t f = 2.5ns; C L = 50pF; R L = 1KΩ SYMBOL PARAMETER WAVEFORM t PHL /t PLH t PHL /t PLH Propagation delay P n,q n to P=Q Propagation delay E to P=Q NOTES: 1. Unless otherwise stated, all typical values are at T amb = 25 C. 2. Typical value measured at V CC = 3.3V. 3. Typical value measured at V CC = 5.0V. CONDITION LIMITS 40 to +85 C 40 to +125 C UNIT V CC (V) MIN TYP 1 MAX MIN MAX 1.2 100 2.0 28 45 57 2 2.7 20 32 40 ns 3.0 to 3.6 16 2 26 33 4.5 to 5.5 11 2 18 22 1.2 50 2.0 17 29 38 1 2.7 13 21 27 ns 3.0 to 3.6 10 2 17 22 4.5 to 5.5 7 2 12 15 AC WAVEFORMS V M = 1.5V at V CC 2.7V; V M = 0.5 V CC at V CC 2.7V. V OL and V OH are the typical output voltage drop that occur with the output load. TEST CIRCUIT V cc V I V l V O E INPUT GND V M PULSE GENERATOR R T D.U.T. C L 50pF R L = 1k t PLH t PHL V OH P = Q OUTPUT V OL Waveform 1. V M SV00195 Propagation delays from the enable input (E) to the equal-to output (P = Q). Test Circuit for Outputs DEFINITIONS R L = Load resistor C L = Load capacitance includes jig and probe capacitiance R T = Termination resistance should be equal to Z OUT of pulse generators. TEST V CC V I t PLH/ t PHL < 2.7V 2.73.6V V CC 2.7V P n, Q n INPUT V M V M Waveform 3. 4.5 V V CC SV00902 Load circuitry for switching times t PHL t PLH P = Q OUTPUT V M V M SV00194 Waveform 2. Propagation delays from the inputs (P n, Q n ) to the equal-to output (P = Q). 1998 Jun 23 6
APPLICATION INFORMATION Two or more 688 s may be cascaded to compare binary or BCD numbers of more than 8 bits. A n 688 A n-1 688 A 0 688 A = B A = B A = B OUTPUT B n 8 MSB B n-1 B 0 8 LSB ENABLE INPUT ENABLE INPUT ENABLE INPUT SV00196 Waveform 4. Binary or BCD comparator 1998 Jun 23 7
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 1998 Jun 23 8
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1998 Jun 23 9
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 1998 Jun 23 10
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 1998 Jun 23 11
DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full Production This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 940883409 Telephone 800-234-7381 Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Date of release: 05-96 Document order number: 9397-750-04456 1998 Jun 23 12