Features: 1) Chip Material: AlGaInP & InGaN 2) Lens Color: Water Clear 3) Source Color: Red & White 4) Pb free 5) The product itself will remain within RoHS compliant version. Dimensions: 13.4 11.5 13.6 25.0 (min.) Red anode 1.0 (min.) cathode 2.54 1.0 White anode 2.54 1.0 (min.) The tolerance is ±0.25mm.
Absolute Maximum Ratings at Ta=25 : ( Red ) Power Dissipation Peak Forward Current (Duty 1/10 @ 1KHz) Forward Current Reverse oltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [2.0mm from body] Symbol Pd I FP IF R Topr Tstg Tsol Maximum 70 40-100 20 Unit mw 5-25 to +80-40 to +100 Reflow Soldering: 260 for 10 sec. Hand Soldering: 350 for 3 sec. Electrical / Optical Characteristics at Ta=25 : ( Red ) Luminous Intensity Dominant Wavelength iewing Angle Forward oltage Reverse Current Symbol Test Condition Min. Typ. Max. Unit I I F =20 380 500 520 mcd λd IF=20 620-630 nm 2 θ1/2 I F =20-39 - deg F I F =20 1.9 2. 0 2.2 IR R=5 - - <10 ua 1) Tolerance of Luminous Intensity ±10%. 2) Tolerance of Forward oltage ±0.1.
Absolute Maximum Ratings at Ta=25 : ( White ) Symbol Maximum Power Dissipation Pd 100 Peak Forward Current (Duty 1/10 @ 1KHz) I FP 120 Forward Current IF 30 Electrostatic Discharge (HBM) ESD 2000 Reverse oltage R 5 Operating Temperature Range Topr -25 to +80 Storage Temperature Range Tstg -40 to +100 Lead Soldering Temperature [2.0mm from body] Tsol Unit mw Reflow Soldering: 260 for 10 sec. Hand Soldering: 350 for 3 sec. Electrical / Optical Characteristics at Ta=25 : ( White ) Luminous Intensity Correlated Color Temperature iewing Angle Forward oltage Reverse Current Symbol Test Condition Min. Typ. Max. Unit I IF=20 2600 2720 2750 mcd CCT IF=20 6000 6500 7000 K 2 θ1/2 IF=20-65 - deg F I F =20 3.0 3. 3 3.6 IR R=5 - - <10 ua 1) Tolerance of Luminous Intensity ±10%. 2) Tolerance of Forward oltage ±0.1.
Reliability test items and conditions: The reliability of products shall be satisfied with items listed below. Confidence level: 97% LTPD: 3% No Sample Size Failure Judgmen t Criteria Ac/ Re 1 Solder Heat TEMP: 260 ± 5 10 SEC 76 PCS 0/1 H : +100 15min 2 Temperature Cycle 5 min 300 CYCLES 76 PCS 0/1 L : -40 15min H : +100 5min I 3 76 PCS Thermal Shock 10 sec 300 CYCLES 0/1 L : -40 5min I t *0.5 or f U or High Temperature 4 TEMP: 100 1000 HRS 76 PCS f L 0/1 Storage 5 Low Temperature Storage TEMP: -40 1000 HRS 76 PCS 0/1 6 DC Operating Life TEMP: 25, IF=20 1000 HRS 76 PCS 0/1 High Temperature / 7 85 / 85% RH 1000 HRS 76 PCS 0/1 High Humidity I t : To test I value of the chip before the reliability test I: The test value of the chip that has completed the reliability test U: Upper Specification Limit L: Lower Specification Limit Item Test Conditions Test Hours/ Cycle
Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1) Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with hight light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel, etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2) Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress and excessive vibration until the products go to cooling process (normal temperature). <Same for producrs with terminal leads> (1) Solder measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering: Pre-heat: 90 max. (Backside of PDB), within 60 seconds. Solder bath: 260 ±5 (Solder temperature), within 5 seconds. (3) Hand soldering: 350 max. (Temperature of soldering iron tip), within 3 seconds. 3) Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4) Others Since the heat resistant ability of the LED resin is low. SMD components are used on the same PCB. Please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason. Make sure not to apply external force, stress and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.