BAT54T/AD/CD/SD/BR Taiwan Semiconductor Small Signal Product 200mW Surface Mount Schottky Barrier Diode
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1 Small Signal Product mw Surface Mount Schottky Barrier Diode FEATURES - Fast switching speed - Low forward voltage drop - Surface mount device type - Moisture sensitivity level - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free and RoHS compliant - reen compound (Halogen free) with suffix "" on packing code and prefix "" on date code MECHANICAL DATA - Case: small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260 C/s - Polarity: Indicated by cathode band - Weight: gram (approximately) - Marking Code: KLA, KL6, KL7, KL8, KLB MAXIMUM RATINS AND ELECTRICAL CHARACTERISTICS (T A =25 unless otherwise noted) PARAMETER SYMBOL ALUE Peak Repetitive Peak Reverse oltage Working Peak Reverse oltage DC Reverse oltage Forward Continuous Current Repetitive Peak Forward Current Forward Surge t <.0 s Power Dissipation Thermal Resistance, Junction to Ambient Air RRM RWM R I F I FRM I FSM P D R θja Operating and Storage temperature T j, T ST -55 to UNIT mw C/W o C PARAMETER SYMBOL MIN MAX UNIT Reverse Breakdown oltage I R =µa I F = I F = Forward oltage I F =30 I F = Reverse Current R =25 I R 2.0 µa Total Capacitance R =, f=.0mhz (BR) F Reverse Recovery Time I F =I R =, R L =Ω, I RR = C T t rr pf ns
2 RATINS AND CHARACTERISTICS CURES (TA=25 unless otherwise noted) Fig. Forward Characteristics Fig. 2 Typical Reverse Characteristics 0 I F, Instantaneous Forward Current (A) 0. T A =25 o C T A = 75 o C T A = 25 o C T A =0 o C T A = -40 o C I R, Instantaneous Reverse Current (ua) o C T A =25 o C T A =75 o C T A =25 o C T A =0 o C F, Instantaneous Forward oltage () R, Instantaneous Reverse oltage () Fig. 3 Capacitance Between Fig. 3 Terminals Characteristics Fig. 4 Power Derating Curve C T, Capacitance Between Terminals (pf) P D, Power Dissipation (mw) R, Reverse oltage () T A, Ambient Temperature ( C)
3 ORDERIN INFORMATION PART NO. REEN MANUFACTURE PACKIN COMPOUND PACKAE PACKIN MARKIN BAT54AD BAT54CD BAT54SD BAT54BR (Note) KLA KL6 KL7 KL8 KLB Note: Manufacture special control, if empty means no special control requirement. EXAMPLE PREFERRED P/N PART NO. MANUFACTURE REEN COMPOUND PACKIN DESCRIPTION -D0 D0 reen compound reen compound
4 DIMENSIONS B C A D E H F DIM. Unit (mm) Unit (inch) Min Max Min Max A B C D E F H SUESTED PAD LAYOUT PIN CONFIURATION DIM Z X Y C C2 Unit (mm) Unit (inch) Typ Typ
5 Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.
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