Session 15: Measuring Substrate-Independent Young s Modulus of Thin Films
|
|
- Rosalyn Owens
- 5 years ago
- Views:
Transcription
1 Session 15: Measuring Substrate-Independent Young s Modulus of Thin Films Jennifer Hay Factory Application Engineer Nano-Scale Sciences Division Agilent Technologies jenny.hay@agilent.com To view previous sessions: Page 1
2 What s the problem? Low-k film (440 nm) on silicon? Berkovich indenter CSM (1nm, 75 Hz) Oliver-Pharr analysis Page 2
3 The solution: accounting for substrate influence Low-k film (440 nm) on silicon Berkovich indenter CSM (1nm, 75 Hz) Oliver-Pharr analysis PLUS thin-film analysis Hay, J.L. and Crawford, B., "Measuring Substrate-Independent Modulus of Thin Films," Journal of Materials Research 26(6), It was fun to read. Prof. Gang Feng, Villanova University Page 3
4 Both film and substrate influence measured response Development of strain field during nano-indentation of a film-substrate system, from Modelling Simul. Mater. Sci. Eng. 12 (2004) (Authors: Yo-Han Yoo, Woong Lee and Hyunho Shin) Page 4
5 Review of efforts to solve this problem (1986) Doerner and Nix: Analytic model assuming linear transition from to substrate and including an empirically determined constant. (1989) King: Form of Doerner-Nix model with no adjustable parameters. (1989) Shield and Bogy: Analytic model, but with physical problems. (1992) Gao, Chiu, and Lee: Simple approximate model. (1997) Mencik: Practical refinements to the Gao model. ( ) Song, Pharr, and colleagues: Alternate version of Gao s approximate model. Page 5
6 The Song-Pharr model with Gao s weight function 1 m a (1 1 I 0 ) m s I 1 m m shear modulus; E = 2m(1+n) 0 f a t film, m f substrate, m s Page 6
7 Modeling the relationship between two springs Springs (of differing stiffness) in series, subject to a force: The deformation in each spring is DIFFERENT. The more compliant spring deforms more. The MORE COMPLIANT spring dominates the response. Springs (of differing stiffness) in parallel, subject to a force: The springs undergo the SAME deformation. The STIFFER spring dominates the response Page 7
8 How to account for lateral support of the film? clearly series Parallel? When film is stiff: Deformation in the top layer of the substrate approaches that of the film. Film dominates the response. Page 8
9 Allow film to act both in series and parallel (Hay & Crawford, 2011) Indentation force Indentation force film film substrate film substrate previous form new form Page 9
10 But previous advancements are retained Gao s weight functions, I 0 & I 1 for gradually shifting influence of each spring with indentation depth. Mencik s suggestion that t = t 0 h c. Definition of effective Poisson s ratio suggested by Song and Pharr. Page 10
11 A new model for elastic film-substrate response Applied indentation force film film substrate Page 11
12 A new model for elastic film-substrate response force m f : shear modulus, film m s : shear modulus, substrate F : empirical constant; F = a : contact radius t : film thickness D : relates stiffness to modulus; D=4a/(1-n a ) I 0 : Gao s weighting function; as a/t 0, I 0 1; as a/t, I 0 0 Page 12
13 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Page 13
14 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Page 14
15 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Page 15
16 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Page 16
17 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Page 17
18 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Page 18
19 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Page 19
20 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Page 20
21 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Gao, et al., 1992 Page 21
22 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Menčίk et al., 1997 Gao, et al., 1992 Page 22
23 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Menčίk et al., 1997 Gao, et al., 1992 Page 23
24 Load on Sample/mN The value of finite-element simulations 70.3 o E f-in t Displacement/nm Analytic model E out Page 24
25 Load on Sample/mN The value of finite-element simulations 70.3 o E f-in t Displacement/nm Sneddon E out E apparent Page 25
26 Load on Sample/mN The value of finite-element simulations 70.3 o E f-in t Displacement/nm Sneddon & Hay-Crawford E out E film Page 26
27 Summary of 70 finite-element simulations (2D). Simulation E s, GPa Maximum indenter displacement (h), nm o E f = 10GPa 500 nm Page 27
28 Summary of 70 finite-element simulations (2D). Simulation E s, GPa Maximum indenter displacement (h), nm o E f = 10GPa 500 nm Page 28
29 Young's Modulus [GPa] Is everything OK with simulations? Ef=Es, apparent input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 29
30 Young's Modulus [GPa] Is everything OK with simulations? Ef=Es, apparent Ef=Es, film alone input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 30
31 Summary of 70 finite-element simulations (2D). Simulation E s, GPa Maximum indenter displacement (h), nm o E f = 10GPa 500 nm Page 31
32 Young's Modulus [GPa] Simulations: Compliant film on stiff substrate Ef/Es = 0.1, apparent input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 32
33 Young's Modulus [GPa] Simulations: Compliant film on stiff substrate Ef/Es = 0.1, apparent Ef/Es = 0.1, film alone input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 33
34 Young's Modulus [GPa] Simulations: Compliant film on stiff substrate Ef/Es = 0.1, apparent Ef/Es = 0.1, Film (Hay) Ef/Es = 0.1, Film (Song-Pharr) input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 34
35 Summary of 70 finite-element simulations (2D). Simulation E s, GPa Maximum indenter displacement (h), nm o E f = 10GPa 500 nm Page 35
36 Young's Modulus [GPa] Simulations: Stiff film on compliant substrate Ef/Es = 10, apparent input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 36
37 Young's Modulus [GPa] Simulations: Stiff film on compliant substrate Ef/Es = 10, apparent Ef/Es = 10, Film (Hay) input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 37
38 Young's Modulus [GPa] Simulations: Stiff film on compliant substrate Ef/Es = 10, apparent Ef/Es = 10, Film (Hay) Ef/Es = 10, Film (Song-Pharr) input film modulus for all simulations Indenter Penetration / Film Thickness [%] Page 38
39 Determining the value of F (fudge factor) E f-in sim. (P, h) E E f-out f = 2m f (1-n f ) F was determined as that value which minimized the sum of the squared relative differences (between output and input film moduli) over all 70 simulations. F : 70 d i 1 E f out E df f in / E f in 2 i 0 F = Page 39
40 Solving for film modulus: m f = f(m a, m f, t 0, a, h c, F) Hay & Crawford, 2011 Sneddon, 1965, as implemented by Oliver and Pharr, 1992 Hay & Crawford, 2011 Gao, et al., 1992 Song & Pharr, 1999 Menčίk et al., 1997 Gao, et al., 1992 Page 40
41 NanoSuite integration in CSM thin film methods Page 41
42 NanoSuite integration in ET thin film methods Page 42
43 Application: SiC on Si wafers Sample ID Description t nm 16 Silicon carbide (SiC) on Si Silicon carbide (SiC) on Si 300 Page 43
44 Experimental method Materials: o A set of 2 SiC films on Si Platform: Agilent G200 NanoIndenter with o DCM head o CSM option o Berkovich indenter o New test method: G-Series DCM CSM Hardness, Modulus for Thin Films.msm Page 44
45 Young's Modulus [GPa] Stiff films on compliant substrates: SiC on Si t=150nm, apparent citation of results Indenter Penetration / Film Thickness [%] Page 45
46 Young's Modulus [GPa] Stiff films on compliant substrates: SiC on Si t=150nm, apparent t=150nm, film citation of results Indenter Penetration / Film Thickness [%] Page 46
47 Young's Modulus [GPa] Stiff films on compliant substrates: SiC on Si t=150nm, apparent t=150nm, film t=300nm, apparent citation of results Indenter Penetration / Film Thickness [%] Page 47
48 Young's Modulus [GPa] Stiff films on compliant substrates: SiC on Si t=150nm, apparent t=150nm, film t=300nm, apparent t=300nm, film citation of results Indenter Penetration / Film Thickness [%] Page 48
49 Young's modulus, h/t=20% [GPa] SiC on Si: Modulus at h/t = 20% SiC on Si (t=150nm) Sample Film Apparent SiC on Si (t=300nm) Film modulus is about 25% higher than apparent modulus! Page 49
50 Application: low-k materials (on silicon) t 0 = 445 nm t 0 = 1007 nm Rapid Mechanical Characterization of low-k Films, Page 50
51 Experimental method Materials: o Two low-k films on Si Platform: Agilent G200 NanoIndenter with o DCM head o CSM option o Express Test option o Berkovich indenter Test Methods: o G-Series DCM CSM Hardness, Modulus for Thin Films o Express Test for Thin Films Page 51
52 Modulus of low-k film (t = 1mm) is 4.44±0.08GPa Page 52
53 Hardness of low-k film (t = 1mm) is 0.70±0.02GPa Page 53
54 Application: Ultra-thin films Page 54
55 Four samples Basecoat: sputter-deposited Al 2 O 3 (2600nm) Substrate: sintered Al 2 O 3 and TiC Page 55
56 Four samples PECVD SiO 2 (50nm) OR ALD Al 2 O 3 (50nm) Basecoat: sputter-deposited Al 2 O 3 (2600nm) Substrate: sintered Al 2 O 3 and TiC Page 56
57 Experimental method Agilent G200 with DCM II head and NanoVision Express Test Berkovich indenter Thin-film model applied to both basecoat and top layers. Page 57
58 Substrate independent modulus of 50nm films E = 146 GPa Application note: Page 58
59 In summary, the proposed model Has been verified by simulation and experiment. Is an improvement over prior models, because it works well whether the film is more compliant or more stiff than the substrate. Decreases experimental uncertainty by allowing measurements to be made at larger depths which would otherwise be unduly affected by substrate influence. Page 59
60 Application: Mechanical characterization of SAC 305 Solder by Instrumented Indentation Wednesday, May 14, 2014, 11:00 (New York) Abstract The reliability of soldered connections in electronic packaging depends on mechanical integrity; mechanical failure can cause electrical failure. Mechanical integrity, in turn, depends on mechanical properties. In this presentation, we focus on the SAC 305 solder alloy (96.5% tin, 3% silver, and 0.5% copper) due to its prevalent utilization in electronic packaging. First, we demonstrate the use of nanoindentation to measure the elastic and creep properties of SAC 305. Next, we utilize an advanced form of nanoindentation to quantitatively map mechanical properties of all the components of a realistic SAC 305 solder joint. To register: Page 60
61 Session 16: Best Practice for Instrumented Indentation Wednesday, June 11, 2014, 11:00 (New York) Abstract The purpose of this presentation is to provide a practical reference guide for instrumented indentation testing. Emphasis is placed on the better-developed measurement techniques and the procedures and calibrations required to obtain accurate and meaningful measurements. Recommended Reading Hay J.L. and Pharr G.M., Instrumented Indentation Testing, ASM Handbook: Mechanical Testing and Evaluation, Volume 8, pp (2000). To register: Page 61
62 Page 62 Thank you!
63 Two (sort of) independent problems Composite compliance: Substrate influences the stiffness that is measured. Errant contact area: Common model for determining contact area is strained in its application to thin films. These two problems are easily convoluted, because they both tend to push the calculated Young s modulus in the same direction. Page 63
Keysight Technologies Measuring Substrate-Independent Young s Modulus of Low-k Films by Instrumented Indentation. Application Note
Keysight Technologies Measuring Substrate-Independent Young s Modulus of Low-k Films by Instrumented Indentation Application Note Introduction In digital circuits, insulating dielectrics separate the conducting
More informationSession 11: Complex Modulus of Viscoelastic Polymers
Session 11: Complex Modulus of Viscoelastic Polymers Jennifer Hay Factory Application Engineer Nano-Scale Sciences Division Agilent Technologies jenny.hay@agilent.com To view previous sessions: https://agilenteseminar.webex.com/agilenteseminar/onstage/g.php?p=117&t=m
More informationKeysight Technologies Young s Modulus of Dielectric Low-k Materials. Application Note
Keysight Technologies Young s Modulus of Dielectric Low-k Materials Application Note Introduction In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors)
More informationDetermining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation
Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation The Harvard community has made this article openly available. Please share how this access benefits
More informationPerformance and Control of the Agilent Nano Indenter DCM
Performance and Control of the Agilent Nano Indenter DCM Application Note Introduction With new materials and material applications come new test challenges. As these new challenges emerge in materials
More informationAnalysis of contact deformation between a coated flat plate and a sphere and its practical application
Computer Methods and Experimental Measurements for Surface Effects and Contact Mechanics VII 307 Analysis of contact deformation between a coated flat plate and a sphere and its practical application T.
More informationSession 8: Statistical Analysis of Measurements
Session 8: Statistical Analysis of Measurements Jennifer Hay Factory Application Engineer Nano-Scale Sciences Division Agilent Technologies jenny.hay@agilent.com To view previous sessions: https://agilenteseminar.webex.com/agilenteseminar/onstage/g.php?p=117&t=m
More informationIMPROVED METHOD TO DETERMINE THE HARDNESS AND ELASTIC MODULI USING NANO-INDENTATION
KMITL Sci. J. Vol. 5 No. Jan-Jun 005 IMPROVED METHOD TO DETERMINE THE HARDNESS AND ELASTIC MODULI USING NANO-INDENTATION Nurot Panich*, Sun Yong School of Materials Engineering, Nanyang Technological University,
More informationApplication of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Materials Science-Poland, Vol. 28, No. 3, 2010 Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis A. WYMYSŁOWSKI 1*, Ł. DOWHAŃ 1, O.
More informationEFFECT OF PILE-UP ON THE MECHANICAL CHARACTERISTICS OF STEEL WITH DIFFERENT STRAIN HISTORY BY DEPTH SENSING INDENTATION
EFFECT OF PILE-UP ON THE MECHANICAL CHARACTERISTICS OF STEEL WITH DIFFERENT STRAIN HISTORY BY DEPTH SENSING INDENTATION Peter BURIK 1,a, Ladislav PEŠEK 2,b, Lukáš VOLESKÝ 1,c 1 Technical University of
More informationA Laboratory Experiment Using Nanoindentation to Demonstrate the Indentation Size Effect
Bucknell University Bucknell Digital Commons Faculty Journal Articles Faculty Scholarship 2013 A Laboratory Experiment Using Nanoindentation to Demonstrate the Indentation Size Effect Wendelin Wright Bucknell
More informationDynamic Mechanical Analysis (DMA) of Polymers by Oscillatory Indentation
Dynamic Mechanical Analysis (DMA) of Polymers by Oscillatory Indentation By Jennifer Hay, Nanomechanics, Inc. Abstract This application note teaches the theory and practice of measuring the complex modulus
More informationA Finite Element Study of the Contact Stiffness of Homogenous Materials and Thin Films
University of Tennessee, Knoxville Trace: Tennessee Research and Creative Exchange Doctoral Dissertations Graduate School 12-2007 A Finite Element Study of the Contact Stiffness of Homogenous Materials
More informationKeysight Technologies Instrumented Indentation Testing with the Keysight Nano Indenter G200. Application Note
Keysight Technologies Instrumented Indentation Testing with the Keysight Nano Indenter G200 Application Note Introduction The scale of materials and machined components continues to decrease with advances
More informationDetermining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation
Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation The Harvard community has made this article openly available. Please share how this access benefits
More informationNanoindentation of Fibrous Composite Microstructures: Experimentation and Finite Element Investigation. Mark Hardiman
Nanoindentation of Fibrous Composite Microstructures: Experimentation and Finite Element Investigation Mark Hardiman Materials and Surface Science Institute (MSSI), Department of Mechanical and Aeronautical
More informationDetermining thermal noise limiting properties of thin films
Determining thermal noise limiting properties of thin films Courtney Linn Institute for Gravitational Research University of Glasgow Summer 2011 Abstract In order to make thermally stable mirrors to be
More informationNonlinear Finite Element Modeling of Nano- Indentation Group Members: Shuaifang Zhang, Kangning Su. ME 563: Nonlinear Finite Element Analysis.
ME 563: Nonlinear Finite Element Analysis Spring 2016 Nonlinear Finite Element Modeling of Nano- Indentation Group Members: Shuaifang Zhang, Kangning Su Department of Mechanical and Nuclear Engineering,
More informationExtraction of Plastic Properties of Aluminum Single Crystal Using Berkovich Indentation
Materials Transactions, Vol. 51, No. 11 (2010) pp. 2104 to 2108 #2010 The Japan Institute of Metals EXPRESS REGULAR ARTICLE Extraction of Plastic Properties of Aluminum Single Crystal Using Berkovich Indentation
More informationINTERNATIONAL JOURNAL OF CIVIL AND STRUCTURAL ENGINEERING Volume 4, No 1, 2013
INTERNATIONAL JOURNAL OF CIVIL AND STRUCTURAL ENGINEERING Volume 4, No 1, 2013 Copyright by the authors - Licensee IPA- Under Creative Commons license 3.0 Research article ISSN 0976 4399 Nanoindentation
More informationSupplementary Figures
Fracture Strength (GPa) Supplementary Figures a b 10 R=0.88 mm 1 0.1 Gordon et al Zhu et al Tang et al im et al 5 7 6 4 This work 5 50 500 Si Nanowire Diameter (nm) Supplementary Figure 1: (a) TEM image
More informationNANOINDENTATION STUDIES OF PAPER
Progress in Paper Physics Seminar 2008 - June 2-5, Otaniemi Finland NANOINDENTATION STUDIES OF PAPER B. F. West 1, B. T. Hotle 2, J. E. Jakes 3,4, J. M. Considine 3, R. E. Rowlands 1 and K. T. Turner 1,4
More informationNANOINDENTATION OF THIN-FILM-SUBSTRATE SYSTEM: DETERMINATION OF FILM HARDNESS AND YOUNG'S MODULUS*
ACTA MECHANICA SINICA, Vol.20, No.4, August 2004 The Chinese Society of Theoretical and Applied Mechanics Chinese Journal of Mechanics Press, Beijing, China Allerton Press, INC., New York, U.S.A. ISSN
More informationMECHANICAL PROPERTIES OF HYDROGEL USING NANOINDENTATION
MECHANICAL PROPERTIES OF HYDROGEL USING NANOINDENTATION Prepared by Duanjie Li, PhD & Jorge Ramirez 6 Morgan, Ste156, Irvine CA 9618 P: 949.461.99 F: 949.461.93 nanovea.com Today's standard for tomorrow's
More informationCONSIDERATIONS ON NANOHARDNESS MEASUREMENT
CONSIDERATIONS ON NANOHARDNESS MEASUREMENT Z. Rymuza 1, M. Misiak 1 and J.T. Wyrobek 2 1 Institute of Micromechanics and Photonics, Department of Mechatronics Warsaw University of Technology, Chodkiewicza
More informationKeysight Technologies Measuring Stress-Strain Curves for Shale Rock by Dynamic Instrumented Indentation. Application Note
Keysight Technologies Measuring Stress-Strain Curves for Shale Rock by Dynamic Instrumented Indentation Application Note Abstract Three samples of shale rock, two from the Eagle Ford play, and one from
More informationIs the second harmonic method applicable for thin films mechanical properties characterization by nanoindentation?
Is the second harmonic method applicable for thin films mechanical properties characterization by nanoindentation? G Guillonneau, G Kermouche, J Teisseire, Barthel, S Bec, J.-L Loubet To cite this version:
More informationCHARACTERIZATION OF VISCOELASTIC PROPERTIES OF POLYMERIC MATERIALS THROUGH NANOINDENTATION
3 SEM nnual Conference and Exposition on Experimental and pplied Mechanics, June -4, 3, Charlotte, NC CHRCTERIZTION O VISCOELSTIC PROPERTIES O POLYMERIC MTERILS THROUGH NNOINDENTTION G.M. Odegard, T. Bandorawalla,
More informationCharacterisation Programme Polymer Multi-scale Properties Industrial Advisory Group 22 nd April 2008
Characterisation Programme 6-9 Polymer Multi-scale Properties Industrial Advisory Group nd April 8 SE: Improved Design and Manufacture of Polymeric Coatings Through the Provision of Dynamic Nano-indentation
More informationNanoindentation of Hard Coatings. Internship report of Niels Consten
Nanoindentation of Hard Coatings Internship report of Niels Consten Title Page INFORMATION STUDENT Name: Niels Consten Student number: s0182745 INFORMATION UNIVERSITY Institution: University of Twente
More informationADVANCED BOARD LEVEL MODELING FOR WAFER LEVEL PACKAGES
As originally published in the SMTA Proceedings ADVANCED BOARD LEVEL MODELING FOR WAFER LEVEL PACKAGES Tiao Zhou, Ph.D. Southern Methodist University Dallas, TX, USA tiaoz@smu.edu Zhenxue Han, Ph.D. University
More informationNano-indentation of silica and silicate glasses. Russell J. Hand & Damir Tadjiev Department of Engineering Materials University of Sheffield
Nano-indentation of silica and silicate glasses Russell J. Hand & Damir Tadjiev Department of Engineering Materials University of Sheffield Acknowledgements Pierre Samson Dr Simon Hayes Dawn Bussey EPSRC
More informationInstrumented indentation testing (IIT) is a technique for
FEATURE Nanomechanical Characterization of Materials by Nanoindentation Series INTRODUCTION TO INSTRUMENTED INDENTATION TESTING by J. Hay Instrumented indentation testing (IIT) is a technique for measuring
More informationIdentification of model parameters from elastic/elasto-plastic spherical indentation
Thomas Niederkofler a, Andreas Jäger a, Roman Lackner b a Institute for Mechanics of Materials and Structures (IMWS), Department of Civil Engineering, Vienna University of Technology, Vienna, Austria b
More informationEffects of TGO Roughness on Indentation Response of Thermal Barrier Coatings
Copyright 2010 Tech Science Press CMC, vol.17, no.1, pp.41-57, 2010 Effects of Roughness on Indentation Response of Thermal Barrier Coatings Taotao Hu 1 and Shengping Shen 1,2 Abstract: In this paper,
More informationGLASS HARDNESS AND ELASTIC MODULUS DETERMINATION BY NANOINDENTATION USING DISPLACEMENT AND ENERGY METHODS
Original papers GLASS HARDNESS AND ELASTIC MODULUS DETERMINATION BY NANOINDENTATION USING DISPLACEMENT AND ENERGY METHODS ABDELLAH CHORFA*, MOHAMED ABDERAHIM MADJOUBI**, MOHAMED HAMIDOUCHE** NADIR BOURAS**,
More informationNanoindentation of Polymers: An Overview
Nanoindentation of Polymers: An Overview Mark R. VanLandingham*, John S. Villarrubia, Will F. Guthrie, and Greg F. Meyers National Institute of Standards and Technology, 1 Bureau Drive, Gaithersburg, MD
More informationInvestigation of the Local Mechanical Properties of the SAC Solder Joint with AFM Judit Kámán a *, Attila Bonyár b
Investigation of the Local Mechanical Properties of the SAC Solder Joint with AFM Judit Kámán a *, Attila Bonyár b Department of Electronics Technology Budapest University of Technology and Economics Budapest,
More informationEE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4
Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below
More informationDetermination of the mechanical properties of metallic thin lms and substrates from indentation tests
PHILOSOPHICAL MAGAZINE A, 2002, VOL. 82, NO. 10, 2013±2029 Determination of the mechanical properties of metallic thin lms and substrates from indentation tests K. Tunvisut, E. P. Busso, N. P. O Dowdy
More informationSTUDIES ON NANO-INDENTATION OF POLYMERIC THIN FILMS USING FINITE ELEMENT METHODS
STUDIES ON NANO-INDENTATION OF POLYMERIC THIN FILMS USING FINITE ELEMENT METHODS Shen Xiaojun, Yi Sung, Lallit Anand Singapore-MIT Alliance E4-04-0, 4 Engineering Drive 3, Singapore 7576 Zeng Kaiyang Institute
More informationInstrumented Indentation Testing
Instrumented Indentation Testing J.L. Hay, MTS Systems Corporation G.M. Pharr, The University of Tennessee and Oak Ridge National Laboratory INSTRUMENTED INDENTATION TESTING (IIT), also known as depth-sensing
More informationResidual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
Jaap M. J. den Toonder Mem. ASME e-mail: jaap.den.toonder@philips.com Philips Research Laboratories, Eindhoven, The Netherlands Christian W. Rademaker Philips Center for Industrial Technology, Eindhoven,
More informationDetermination of the elastic modulus and hardness of sol gel coatings on glass: influence of indenter geometry
Ž. Thin Solid Films 372 2000 134 143 Determination of the elastic modulus and hardness of sol gel coatings on glass: influence of indenter geometry J. Malzbender a,, G. de With a, J.M.J. den Toonder b
More informationFrictional characteristics of exfoliated and epitaxial graphene
Frictional characteristics of exfoliated and epitaxial graphene Young Jun Shin a,b, Ryan Stromberg c, Rick Nay c, Han Huang d, Andrew T. S. Wee d, Hyunsoo Yang a,b,*, Charanjit S. Bhatia a a Department
More informationCharacterization of Viscoelastic Properties of Polymeric Materials Through Nanoindentation
Experimental Mechanics, Vol. 45, no., pp. 13 136 (5) Characterization of Viscoelastic Properties of Polymeric Materials Through Nanoindentation G. M. Odegard Assistant Professor, Department of Mechanical
More informationScanning Nanoindentation - One example of a quantitative SPM technique
Scanning Nanoindentation - One example of a quantitative SPM technique Topics Mechanical characterization on the nanoscale The basic idea Some models Some issues Instrumentation Tribological characteriazation
More informationAN EXPLANATION FOR THE SHAPE OF NANOINDENTATION UNLOADING CURVES BASED ON FINITE ELEMENT SIMULATION
AN EXPLANATON FOR THE SHAPE OF NANONDENTATON UNLOADNG CURVES BASED ON FNTE ELEMENT SMULATON A BOLSHAKOV*, WC OLVER**, and GM PHARR* *Department of Materials Science, Rice University, POBox 1892, Houston,
More informationReliability analysis of different structure parameters of PCBA under drop impact
Journal of Physics: Conference Series PAPER OPEN ACCESS Reliability analysis of different structure parameters of PCBA under drop impact To cite this article: P S Liu et al 2018 J. Phys.: Conf. Ser. 986
More informationADVANCED DYNAMIC MECHANICAL ANALYSIS OF A TIRE SAMPLE BY NANOINDENTATION
ADVANCED DYNAMIC MECHANICAL ANALYSIS OF A TIRE SAMPLE BY NANOINDENTATION Duanjie Li and Pierre Leroux, Nanovea, Irvine, CA Abstract The viscoelastic properties of a tire sample are comprehensively studied
More informationDelamination Modeling for Power Packages and Modules. Rainer Dudek, R. Döring, S. Rzepka Fraunhofer ENAS, Micro Materials Center Chemnitz
Delamination Modeling for Power Packages and Modules Rainer Dudek, R. Döring, S. Rzepka Fraunhofer ENAS, Micro Materials Center Chemnitz The Micro Materials Center @ Virtual Prototyping Finite Element
More informationOn the Determination of Residual Stress and Mechanical Properties by Indentation
Cleveland State University EngagedScholarship@CSU Mechanical Engineering Faculty Publications Mechanical Engineering Department 1-25-26 On the Determination of Residual Stress and Mechanical Properties
More informationA Study of the Relationship Between Indentation Creep and Uniaxial Creep
University of Tennessee, Knoxville Trace: Tennessee Research and Creative Exchange Doctoral Dissertations Graduate School 12-2006 A Study of the Relationship Between Indentation Creep and Uniaxial Creep
More informationCharacterization of Viscoelastic Properties of Polymeric Materials Through Nanoindentation
Characterization of Viscoelastic Properties of Polymeric Materials Through Nanoindentation by G.M. Odegard, T.S. Gates and H.M. Herring ABSTRACT Nanoindentation testing was used to determine the dynamic
More informationCharacteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
Materials Transactions, Vol. 51, No. 10 (2010) pp. 1790 to 1795 Special Issue on Lead-Free and Advanced Interconnection Materials for Electronics #2010 The Japan Institute of Metals Characteristics of
More informationSTANDARD SAMPLE. Reduced section " Diameter. Diameter. 2" Gauge length. Radius
MATERIAL PROPERTIES TENSILE MEASUREMENT F l l 0 A 0 F STANDARD SAMPLE Reduced section 2 " 1 4 0.505" Diameter 3 4 " Diameter 2" Gauge length 3 8 " Radius TYPICAL APPARATUS Load cell Extensometer Specimen
More informationSupplementary Information: Nanoscale heterogeneity promotes energy dissipation in bone
Supplementary Information: Nanoscale heterogeneity promotes energy dissipation in bone KUANGSHIN TAI, * MING DAO, * SUBRA SURESH,, AHMET PALAZOGLU, & AND CHRISTINE ORTIZ Department of Materials Science
More informationCHAPTER 17 MECHANICAL PROPERTIES OF THIN POLYMER FILMS WITHIN CONTACTS
CHAPTER 7 MECHANICAL PROPERTIES OF THIN POLYMER FILMS WITHIN CONTACTS Antoine Chateauminois, Christian Fretigny and Eric Gacoin Laboratoire de Physico-chimie des Polymères et des Milieux Dispersés(PPMD),
More information9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures
9-11 April 28 Measurement of Large Forces and Deflections in Microstructures Kai Axel Hals 1, Einar Halvorsen, and Xuyuan Chen Institute for Microsystem Technology, Vestfold University College, P.O. Box
More information1. A pure shear deformation is shown. The volume is unchanged. What is the strain tensor.
Elasticity Homework Problems 2014 Section 1. The Strain Tensor. 1. A pure shear deformation is shown. The volume is unchanged. What is the strain tensor. 2. Given a steel bar compressed with a deformation
More informationMeasurement of Bitumen Relaxation Modulus with Instrumented Indentation. Master s Degree Project
Measurement of Bitumen Relaxation Modulus with Instrumented Indentation Master s Degree Project Phan Ngoc Trinh Division of Highway and Railway Engineering Department of Transport Science School of Architecture
More informationSurface Chemical Analysis Using Scanning Probe Microscopy
STR/03/067/ST Surface Chemical Analysis Using Scanning Probe Microscopy A. L. K. Tan, Y. C. Liu, S. K. Tung and J. Wei Abstract - Since its introduction in 1986 as a tool for imaging and creating three-dimensional
More informationIntroduction to Engineering Materials ENGR2000. Dr. Coates
Introduction to Engineering Materials ENGR2 Chapter 6: Mechanical Properties of Metals Dr. Coates 6.2 Concepts of Stress and Strain tension compression shear torsion Tension Tests The specimen is deformed
More informationIntensity (a.u.) Intensity (a.u.) Raman Shift (cm -1 ) Oxygen plasma. 6 cm. 9 cm. 1mm. Single-layer graphene sheet. 10mm. 14 cm
Intensity (a.u.) Intensity (a.u.) a Oxygen plasma b 6 cm 1mm 10mm Single-layer graphene sheet 14 cm 9 cm Flipped Si/SiO 2 Patterned chip Plasma-cleaned glass slides c d After 1 sec normal Oxygen plasma
More informationFINITE ELEMENT ANALYSIS OF SLIDING CONTACT BETWEEN A CIRCULAR ASPERITY AND AN ELASTIC URFACE IN PLANE STRAIN CONDITION
7 th International LS-DYNA Users Conference Simulation Technology (1) FINITE ELEMENT ANALYSIS OF SLIDING CONTACT BETWEEN A CIRCULAR ASPERITY AND AN ELASTIC URFACE IN PLANE STRAIN CONDITION S. Subutay Akarca,
More informationCharacterisation of the mechanical behaviour of a polyurethane elastomer based on indentation and tensile creep experiments
Materials Characterisation VI 3 Characterisation of the mechanical behaviour of a polyurethane elastomer based on indentation and tensile creep experiments B. Buffel 1, K. Vanstreels 2, F. Desplentere
More informationMechanical Properties
Mechanical Properties Elastic deformation Plastic deformation Fracture I. Elastic Deformation S s u s y e u e T I II III e For a typical ductile metal: I. Elastic deformation II. Stable plastic deformation
More informationNAVAL POSTGRADUATE SCHOOL THESIS
NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS MODELING OF IMPRESSION TESTING TO OBTAIN MECHANICAL PROPERTIES OF LEAD-FREE SOLDERS MICROELECTRONIC INTERCONNECTS by How, Yew Seng December 2005 Thesis
More informationNanoindentation for Characterizing Wood & Related Systems
Nanoindentation for Characterizing Wood & Related Systems Johannes Konnerth and Wolfgang Gindl Institute of Wood Science and Technology BOKU University - Vienna Institute of Wood Science and Technology
More informationStress in Flip-Chip Solder Bumps due to Package Warpage -- Matt Pharr
Stress in Flip-Chip Bumps due to Package Warpage -- Matt Pharr Introduction As the size of microelectronic devices continues to decrease, interconnects in the devices are scaling down correspondingly.
More informationINTRODUCTION TO STRAIN
SIMPLE STRAIN INTRODUCTION TO STRAIN In general terms, Strain is a geometric quantity that measures the deformation of a body. There are two types of strain: normal strain: characterizes dimensional changes,
More informationSize dependence of the mechanical properties of ZnO nanobelts
Philosophical Magazine, Vol. 87, Nos. 14 15, 11 21 May 2007, 2135 2141 Size dependence of the mechanical properties of ZnO nanobelts M. LUCAS*y, W. J. MAIz, R. S. YANGz, Z. L WANGz and E. RIEDO*y yschool
More informationNanoindentation shape effect: experiments, simulations and modelling
IOP PUBLISHING JOURNAL OF PHYSICS: CONDENSED MATTER J. Phys.: Condens. Matter 19 (2007) 395002 (12pp) doi:10.1088/0953-8984/19/39/395002 Nanoindentation shape effect: experiments, simulations and modelling
More informationAn improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments W. C. Oliver Metals and Ceramics Division, Oak Ridge National Laboratory,
More informationMeasuring Young s modulus of 20LP10L20-LLA40 Microspheres and Gelatin-Methacrylamide (GelMA) Hydrogel using nanoindentation
Thesis Measuring Young s modulus of 20LP10L20-LLA40 Microspheres and Gelatin-Methacrylamide (GelMA) Hydrogel using nanoindentation Josip Rauker Abstract Mechanical properties of different tissues are important
More informationDEPARTMENT OF MECHANICAL ENIGINEERING, UNIVERSITY OF ENGINEERING & TECHNOLOGY LAHORE (KSK CAMPUS).
DEPARTMENT OF MECHANICAL ENIGINEERING, UNIVERSITY OF ENGINEERING & TECHNOLOGY LAHORE (KSK CAMPUS). Lab Director: Coordinating Staff: Mr. Muhammad Farooq (Lecturer) Mr. Liaquat Qureshi (Lab Supervisor)
More informationNanomechanics Measurements and Standards at NIST
Nanomechanics Measurements and Standards at NIST Robert F. Cook Deputy Chief, Ceramics Division Leader, Nanomechanical Properties Group robert.cook@nist.gov NIST Mission Promote U.S. innovation and industrial
More informationInfluence of friction in material characterization in microindentation measurement
Influence of friction in material characterization in microindentation measurement W.C. Guo a,b,, G. Rauchs c, W.H. Zhang b, J.P. Ponthot a a LTAS. Department of Aerospace & Mechanical Engineering, University
More informationTSOM Webinar on Instrumented Indentation.. Dr. Ilja Hermann
TSOM Webinar on Instrumented Indentation. Dr. Ilja Hermann 11-19-015 Outline Motivation Theory of instrumented-indentation Experimental aspects NanoForce Application examples Motivation Why do we need
More informationInvestigation Into The Effect Of Substrate On Pb(Zr 0.52 Ti 0.48 )O 3 Films For MEMS Application. Dan Liu. Auburn, Alabama May 09, 2011
Investigation Into The Effect Of Substrate On Pb(Zr 0.52 Ti 0.48 )O 3 Films For MEMS Application by Dan Liu A dissertation submitted to the Graduate Faculty of Auburn University in partial fulfillment
More informationCopyright 2013 Tech Science Press MCB, vol.10, no.1, pp.27-42, 2013
Copyright 213 Tech Science Press MCB, vol.1, no.1, pp.27-42, 213 Derivation of the Stress-Strain Behavior of the constituents of Bio-Inspired Layered TiO 2 /PE-Nanocomposites by Inverse Modeling Based
More informationWe are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors
We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists 4,1 116, 1M Open access books available International authors and editors Downloads Our authors
More informationRatcheting deformation in thin film structures
Ratcheting deformation in thin film structures Z. SUO Princeton University Work with MIN HUANG, Rui Huang, Jim Liang, Jean Prevost Princeton University Q. MA, H. Fujimoto, J. He Intel Corporation Interconnect
More informationMat. Res. Soc. Symp. Proc. Vol Materials Research Society
Mat. Res. Soc. Symp. Proc. Vol. 738 2003 Materials Research Society G7.26.1 Determination of the Plastic Behavior of Low Thermal Expansion Glass at the Nanometer Scale Richard Tejeda, 1 Roxann Engelstad,
More informationEE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4
Issued: Wednesday, March 4, 2016 PROBLEM SET #4 Due: Monday, March 14, 2016, 8:00 a.m. in the EE C247B homework box near 125 Cory. 1. This problem considers bending of a simple cantilever and several methods
More informationMinimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module
Purdue University Purdue e-pubs Birck and NCN Publications Birck Nanotechnology Center 9-25-212 Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module Amirkoushyar Ziabari
More information2. Experiments. 3. Results and discussion
www.elsevier.com/locate/actamat Evaluating plastic flow properties by characterizing indentation size effect using a sharp indenter Ju-Young Kim a, *, Seung-Kyun Kang b, Julia R. Greer a, Dongil Kwon b
More informationThis is an author-deposited version published in: Eprints ID: 14703
Open Archive Toulouse Archive Ouverte (OATAO) OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible. This is an author-deposited
More informationTABLE OF CONTENTS CHAPTER TITLE PAGE DECLARATION DEDICATION ACKNOWLEDGEMENT ABSTRACT ABSTRAK
vii TABLE OF CONTENTS CHAPTER TITLE PAGE DECLARATION DEDICATION ACKNOWLEDGEMENT ABSTRACT ABSTRAK TABLE OF CONTENTS LIST OF TABLES LIST OF FIGURES LIST OF ABBREVIATIONS LIST OF SYMBOLS ii iii iv v vi vii
More informationLecture 7 Constitutive Behavior of Asphalt Concrete
Lecture 7 Constitutive Behavior of Asphalt Concrete What is a Constitutive Model? A constitutive model or constitutive equation is a relation between two physical quantities that is specific to a material
More informationIntroductory guide to measuring the mechanical properties of nanoobjects/particles
Jeremias Seppä MIKES Metrology, VTT Technical Research Centre of Finland Ltd P.O. Box 1000, FI-02044 VTT, Finland Contents: AFM Cantilever calibration F-d curves and cantilever bending Hitting the particles
More informationAn Experimental Investigation of the Elastic and Viscoelastic Properties of Small
University of Tennessee, Knoxville Trace: Tennessee Research and Creative Exchange Doctoral Dissertations Graduate School 8-2008 An Experimental Investigation of the Elastic and Viscoelastic Properties
More informationDEVELOPMENT OF CALIBRATION METHODS FOR THE NANOINDENTATION TEST
DEVELOPMENT OF CALIBRATION METHODS FOR THE NANOINDENTATION TEST K. Herrmann, K. Hasche, F. Pohlenz and R. Seemann Physikalisch-Technische Bundesanstalt Braunschweig and Berlin Bundesallee 100, 38116 Braunschweig,
More information1.103 CIVIL ENGINEERING MATERIALS LABORATORY (1-2-3) Dr. J.T. Germaine Spring 2004 LABORATORY ASSIGNMENT NUMBER 6
1.103 CIVIL ENGINEERING MATERIALS LABORATORY (1-2-3) Dr. J.T. Germaine MIT Spring 2004 LABORATORY ASSIGNMENT NUMBER 6 COMPRESSION TESTING AND ANISOTROPY OF WOOD Purpose: Reading: During this laboratory
More informationExperimentally Calibrating Cohesive Zone Models for Structural Automotive Adhesives
Experimentally Calibrating Cohesive Zone Models for Structural Automotive Adhesives Mark Oliver October 19, 2016 Adhesives and Sealants Council Fall Convention contact@veryst.com www.veryst.com Outline
More informationInternational Journal of Solids and Structures
International Journal of Solids and Structures 45 (2008) 6018 6033 Contents lists available at ScienceDirect International Journal of Solids and Structures journal homepage: www.elsevier.com/locate/ijsolstr
More informationISHIK UNIVERSITY DEPARTMENT OF MECHATRONICS ENGINEERING
ISHIK UNIVERSITY DEPARTMENT OF MECHATRONICS ENGINEERING QUESTION BANK FOR THE MECHANICS OF MATERIALS-I 1. A rod 150 cm long and of diameter 2.0 cm is subjected to an axial pull of 20 kn. If the modulus
More informationA contact area function for Berkovich nanoindentation : Application to hardness determination of a TiHfCN thin film
A contact area function for Berkovich nanoindentation : Application to hardness determination of a TiHfCN thin film D. Chicot, M. Yetna N Jock, E.S. Puchi-Cabrera, Alain Iost, M.H. Staia, G. Louis, G.
More informationDesign and Analysis of Various Microcantilever Shapes for MEMS Based Sensing
ScieTech 014 Journal of Physics: Conference Series 495 (014) 01045 doi:10.1088/174-6596/495/1/01045 Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing H. F. Hawari, Y. Wahab,
More information1 INTRODUCTION 2 SAMPLE PREPARATIONS
Chikage NORITAKE This study seeks to analyze the reliability of three-dimensional (3D) chip stacked packages under cyclic thermal loading. The critical areas of 3D chip stacked packages are defined using
More information