TPC Film Chip Capacitors A KYOCERA GROUP COMPANY

Transcription

1 TPC Film Chip Capacitors A KYOCERA GROUP COMPANY

2 Contents Characteristics of Film SMD Capacitors General Information Dimensions How To Order Capacitance Values and Nominal Voltages Packaging Mounting and Soldering Recommendations Electrical Properties and Test Conditions Electrical and Frequency Characteristics Voltage and Frequency Characteristics TOTAL QUALITY POLICY Customer and employees satisfaction is linked to the successful implementation of our QUALITY STRATEGY. This strategy applies AVX s Quality Systems (QV and QOS) and certification according to ISO91 and QS9 standards. These systems are designed as a real management tool, the major elements of which are: Main operational and productive processes under control Continuous improvement process Supplier/partner involvement TPC with AVX sales and marketing support, wants to be a preferred ranked supplier for product and service quality. NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications. 1

3 Characteristics of Film SMD Capacitors PET-HT PEN PPS NP X7R Tantalum (MKT) (MKN) (MKI) Operating temperature ( C) -55/15-55/15-55/14-55/15-55/15-55/15 C/C with temperature (%) ±5 ±5 ±1.5 ±1 ±15 ±1 DC voltage coefficient (%) no. no. no. no. - no. C aging rate (%/h dec.) negl. negl. negl. negl. n.a. Dissipation factor (%) 1 khz khz khz ESR low low very low low moderate high to high IR (MΩ. µf) 5 C C Dielectric absorption (%) n.a Capacitance range from (pf) to (µf) Capacitance tolerance (±%) Self-healing yes yes no no no no Typical failure mode open open open short short short Reliability high high high high moderate low Piezoelectric effect no no no yes yes yes Resistance to thermal and high high high moderate moderate high mechanical shock to low to low Non-linear distortion very low very low very low low high n.a. (3 rd harmonic) Polarity no no no no no yes 1) All data are typical values N.B.: SMD = Surface Mounted Device SMT = Surface Mounted Technology

4 General Information APPLICATIONS General purpose function in low voltage applications where miniaturization and SMD is required. Typical applications would be: Automotive (Airbag, Fuel injection calculator,...). Telecom (Public switching systems, modems, telephone sets, cordless, mobile). Industrial (SMPS, Power converter modules,...). DESCRIPTION Film chip capacitor using a naked and stacked construction with metallized High Temperature PET (polyethylene teraphtalate). ADVANTAGES Use of high temperature dielectric films makes these capacitors suitable for IR or vapor phase reflow processes. This chip is built without specific encapsulation. The intrinsic elasticity of the dielectric film allows an excellent compatibility of the capacitor with all types of material for printed circuit boards. The self-healing property of film technology results in safe open circuit failure mode and better overall reliability. Excellent thermal shock resistance. Low dissipation factor, ESR and ESL. No piezoelectric effect. Available in tape and reel suitable for automatic placement. Non-polar construction. GENERAL CHARACTERISTICS Climatic category 55/15/56 Capacitance range 1 nf to 4.7 µf Tolerance on capacitance ±5%, ±1% Nominal voltage 5 VDC to 5 VDC Test voltage 1.4 Vr 5 C Soldering methods IR or vapor phase reflow (not suitable for wave soldering) Tangent of loss angle at 1KHz (DF) < 1 x 1-4 Insulation resistance minimum for C.33 µf; IR > 1 MΩ at C for 1 min. charge at 1 VDC for Vr < 1 VDC and 1 VDC for Vr 1 VDC for C >.33 µf; IR C > 4 sec. at C for 1 min. charge at 1 VDC for Vr < 1 VDC and 1 VDC for Vr 1 VDC Temperature range -55 C to +15 C with voltage derating of 1.5%/ C between 15 C and 15 C 3

5 DIMENSIONS.3 (.1) ±. (.8) W H L millimeters (inches) Size Code Equivalent Size Length (L) mm 3. ±.3 3. ± ± ± ±.5 1. ± ± ±.6 (inches) (.16 ±.1) (.16 ±.1) (.177 ±.) (.4 ±.) (.8 ±.) (.41 ±.4) (.5 ±.4) (.598 ±.4) Width (W) mm 1.6 ±.3.5 ±.3 3. ±.5 5. ± ± ±.8 1. ± ±.8 (inches) (.63 ±.1) (.98 ±.1) (.16 ±.) (.197 ±.) (.4 ±.) (.99 ±.31) (.41 ±.31) (.539 ±.31) HOW TO ORDER CF 4 G 15 K - - Type Size 1 or 1 = 16 or = 11 3 or 3 = or 4 = 5 or 5 = or 6 = or 7 = or 8 = 654 Dielectric = PET- HT Voltage 5 V = C 5/63 V = D 1 V = E 16 V = F 5 V = G Capacitance EIA Code * 1st digit: (zero). * nd & 3rd: the nd significant figures of the capacitance value. * 4th digit: the number of zeros to be added to the capacitance value. Tolerance 5% = J 1% = K Suffix = Bulk BA = Tape & reel Ø 18mm (7") BC = Tape & reel Ø 33mm (13") Standard range Extended range 4

6 Capacitance and Voltage Range CAPACITANCE VALUES AND NOMINAL VOLTAGES vs SIZE Voltages (Vdc/Vac) millimeters (inches) Capacitance 5 Vdc/16Vac 5 Vdc/4Vac 63 Vdc/4Vac 1 Vdc/63Vac 16 Vdc/1Vac 5 Vdc/16Vac Cap SIze H Size H Size H Size H Size H Size H Code Code max Code max Code max Code max Code max Code max 1 nf /16 1.5/ /16 1.5/ /16 1.5/ /16 1.5/ /16 1.5/ /11/16 1.5/1.6/ /11/16 1.5/1.6/ /16 1.8/ /11/16 1.5/1.8/ /16./ /11/16 1.5/./ /181./ /16./1.3 11/16./ /11 1.5/ /181./ /11./..1 / 3./ /11 3./.3 3. / 4./ /181 3./ / 3.6/ /181.5/.1 /181 3./ / 5.1/ /181 3./.6 / 4.5/ /84 3.8/ / 3.4/.3 / 4.5/ /43 5.8/ / 4./.7 84/ 3.5/ /43 4.6/ / 4.5/4.1 84/84 5.1/ /54 4.4/4.6 1µF 15 84/ 5./4.4 43/84 4.8/ /54 5.7/ /84 4.6/4.8 54/43 4.6/ /84 5.5/5.6 54/43 5.5/ /43 5.7/ /54 5.7/ /54 6./ /654 7./4.8 *For size code vs case code see How to Order page 4. Standard range Extended range Development range MILLIMETERS/INCHES CORRESPONDENCE millimeters (inches) (.43) (.51) (.59) (.63) (.67) (.71) (.79) (.83) (.87) (.91) (.94) (.98) (.13) (.11) (.11) (.118) (.134) (.137) (.14) (.15) (.154) (.157) (.16) (.166) (.17) (.17) (.178) (.181) (.189) (.195) (.1) (.13) (.17) (.1) (.4) (.7) (.3) (.34) (.58) (.74) 5

7 Packaging TAPE AND REEL DIMENSIONS The CF Series is available in bulk or tape and reel for automatic insertion.. (.79) ±.5 (.) 4. (.157) ±.1 (.4) (.59) (.69) ±.15 (.6) K W P 1 Direction of unreeling W 13. (.51) ±.5 (.) A W 1 TAPE AND REEL CHARACTERISTICS In accordance with IEC 86 and EIA 481, the material used: Carrier tape: Antistatic Material Cover tape: Polyester Reel: Recyclable Material Parts in bulk or on reel are packed in hermetically sealed plastic bags. RECOMMENDATIONS Once the bag is open, the capacitors must be kept in a dry atmosphere: 5 ±5 C and R.H. 6% until soldering and during maximum 3 months. The use-by date is 3 years if kept in origin plastic bags. In case of bad storage the following recommendations must be applied: in order to eliminate the humidity level in the CF product after storage out of the vacuum bag, the drying of the pieces can be realized during 48 hours at 8 C. 6

8 Packaging Tape and Reel Characteristics and Packaging Quantities millimeters (inches) Size Chip Dimensions Tape Dimensions Reel Dimensions Bulk Tape Packaging Code Qty/ Qty/ L W H max W P1 Ko A W1 W max Code bag reel (.16) 1.6 (.63) 1.1 (.43) 8. (.315) 4. (.157) 1. (.47) 18 (7.9) 8.4 (.331) 14.4 (.567) 39 BA 1.3 (.51) 8. (.315) 4. (.157) 1.4 (.55) 18 (7.9) 8.4 (.331) 14.4 (.567) 34 BA (.16).5 (.98) 1.8 (.71) 8. (.315) 4. (.157) 1.9 (.75) 18 (7.9) 8.4 (.331) 14.4 (.567) 5 BA.3 (.91) 8. (.315) 4. (.157).33 (.9) 18 (7.9) 8.4 (.331) 14.4 (.567) BA (.178) 3. (.16) 1.5 (.59) 1. (.47) 8. (.315) 1.6 (.63) 18 (7.9) 1.4 (.488) 18.4 (.74) 15 BA. (.79) 1. (.47) 8. (.315).6 (.81) 18 (7.9) 1.4 (.488) 18.4 (.74) 1 BA.5 (.98) 1. (.47) 8. (.315).6 (.13) 18 (7.9) 1.4 (.488) 18.4 (.74) 15 9 BA 3. (.118) 1. (.47) 8. (.315) 3.1 (.1) 18 (7.9) 1.4 (.488) 18.4 (.74) 7 BA 1.5 (.59) 1. (.47) 8. (.315) 1.6 (.63) 33 (1.99) 1.4 (.488) 18.4 (.74) 58 BC. (.79) 1. (.47) 8. (.315).6 (.81) 33 (1.99) 1.4 (.488) 18.4 (.74) BC.5 (.98) 1. (.47) 8. (.315).6 (.13) 33 (1.99) 1.4 (.488) 18.4 (.74) 36 BC 3. (.118) 1. (.47) 8. (.315) 3.1 (.1) 33 (1.99) 1.4 (.488) 18.4 (.74) 3 BC 5.7 (.4) 5. (.195). (.79) 1. (.47) 8. (.315).1 (.83) 33 (1.99) 1.4 (.488) 18.4 (.74) 44 BC.1 (.83) 1. (.47) 8. (.315).18 (.86) 33 (1.99) 1.4 (.488) 18.4 (.74) 43 BC.8 (.11) 1. (.47) 8. (.315) 3.1 (.1) 33 (1.99) 1.4 (.488) 18.4 (.74) 15 3 BC 3. (.118) 1. (.47) 8. (.315) 3.45 (.136) 33 (1.99) 1.4 (.488) 18.4 (.74) 8 BC 4. (.157) 1. (.47) 8. (.315) 4.1 (.16) 33 (1.99) 1.4 (.488) 18.4 (.74) 3 BC 4.5 (.178) 16. (.63) 8. (.315) 4.6 (.181) 33 (1.99) 16.4 (.646).4 (.88) 19 BC (.8) 6.1 (.4) 3.6 (.14) 4. (.945) 1. (.47) 3.73 (.147) 33 (1.99) 4.4 (.961) 3.4 (1.197) 16 BC 5. (.195) 16. (.63) 1. (.47) 5.3 (.6) 33 (1.99) 16.4 (.646).4 (.88) 11 1 BC 5.1 (.1) 16. (.63) 1. (.47) 5.5 (.17) 33 (1.99) 16.4 (.646).4 (.88) 1 BC 5.6 (.1) 16. (.63) 1. (.47) 5.9 (.3) 33 (1.99) 16.4 (.646).4 (.88) 9 BC (.4) 7.6 (.99) 3.8 (.15) 4. (.945) 1. (.47) 3.93 (.155) 33 (1.99) 4.4 (.961) 3.4 (1.197) 14 BC 4.8 (.189) 16. (.63) 1. (.47) 4.9 (.193) 33 (1.99) 16.4 (.646).4 (.88) 5 11 BC 6. (.34) 4. (.945) 1. (.47) 6.19 (.44) 33 (1.99) 4.4 (.961) 3.4 (1.197) 9 BC (.5) 1. (.4) 3.8 (.15) 4. (.945) 16. (.63) 4. (.157) 33 (1.99) 4.4 (.961) 3.4 (1.197) 11 BC 4.6 (.181) 4. (.945) 16. (.63) 4.7 (.185) 33 (1.99) 4.4 (.961) 3.4 (1.197) 3 9 BC 5.5 (.17) 4. (.945) 16. (.63) 5.7 (.4) 33 (1.99) 4.4 ( (1.197) 7 BC 6.6 (.58) 4. (.945) 16. (.63) 7. (.74) 33 (1.99) 4.4 (.961) 3.4 (1.197) 6 BC (.598) 13.7 (.539) 4.4 (.17) 4. (.945) 4. (.945) 4.5 (.178) 33 (1.99) 4.4 (.961) 3.4 (1.197) 6 BC 4.8 (.189) 4. (.945) 4. (.945) 5.5 (.17) 33 (1.99) 4.4 (.961) 3.4 (1.197) 3 5 BC 6. (.44) 4. (.945) 4. (.945) 6.3 (.48) 33 (1.99) 4.4 (.961) 3.4 (1.197) 4 BC 7. (.74) 4. (.945) 4. (.945) 7.6 (.99) 33 (1.99) 4.4 (.961) 3.4 (1.197) 3 BC 7

9 Mounting and Soldering Recommendations TEMPERATURE SOLDERING PROFILE For infrared and vapor phase reflow soldering, the temperature profile below shows the times and the temperatures operating limits. These capacitors are NOT suitable for wave soldering. Phase Temperature ( C) * Time (s) Preheating 16 to 18 C max. 18s max. Soldering 18 to 35 C max. 3s max. *Temperature at capacitor surface RECOMMENDED SOLDER PASTE THICKNESS To allow optimum solderability, the recommended soldering paste thickness is: 15 to µm for 16 to 84 to 3 µm for 43 to 654 In case of hand soldering, the temperature of the soldering iron should not be above 5 C. Special care must be taken to avoid touching the capacitor body with the iron tip. PAD DIMENSIONS C B A Size Code millimeters (inches) Case Dimensions Size A B C (.51) 1.3 (.51). (.87). 11. (.79) 1.3 (.51). (.87) (.118) 1.5 (.59) 3.5 (.137) (.195) 1.9 (.75) 4.5 (.178) (.34).5 (.98) 5.7 (.4) (.95) 3. (.118) 8. (.315) (.441) 3.5 (.137) 1.3 (.46) (.575) 3.6 (.14) 1.6 (.496) RECOMMENDED CLEANING To clean flux from the PC board assembly, the recommended products are: ethanol, isopropyl alcohol, and deionized water wash. The cleaning products to avoid are: Toluene, Xylene, Trichloroethylene, Terpene Cleaner EC-7, surface active agent. In case of using another solvent, please contact us. OTHER CAUTIONS Flame retardancy: the dielectric film is not a flame retardant material. Environment: contact us when chips are used in humid or gas atmosphere and/or when using with resin. Recommended handling: do not use edged tools, so not to damage the capacitor. 8

10 Electrical Properties and Test Conditions STANDARDIZATION Reference Standard is CECC 31 (see detailed tests hereunder) Test Description Performance Capacitance C Measurement frequency 1 KHz C Shall be within tolerance of the rated value Dissipation Factor DF Measurement frequency 1 KHz C DF < Voltage applied: 1 V - for Vr < 1 V - IR > 1 MΩ for C.33 µf Insulation Resistance IR 1 V - for Vr 1 V - IR x C > 4 sec. for C >.33 µf Dielectric Strength Surge Voltage = 1.4 Vr applied There shall be no direct breakdown for 1 mm between terminals Mounting Board = 1.6mm (.63") thick epoxy glass laminated or alumine substrate C = within ± % of initial value DF = at 1 KHz IR = within initial limit Adhesion Force of 5 N applied for 1 secs. No visible damage Board Bending Test Bending of 1 mm (.39") C = within ± % of initial value for 9mm (3.543") length No visible damage C = within ± 5% of initial value Thermal Shock 5 cycles -55/+15 C ESR = no more than 3 times initial value IR = not less than 5% of the initial limit C = within ± 7% of initial value Damp Heat 4 C 93% RH/no voltage/56 days DF = < at 1 KHz Steady State IR = not less than 5% of the initial limit C = within ± 7% of initial value Accelerated Damp Heat 85 C 85% RH 1.5V- 5 H DF = at 1 KHz (Load Humidity) IR = not less than 5% of the initial limit C = within ± 8% of initial value Life Test 85 C /1.5 Vr/1, Hours DF = < at 1 KHz IR = not less than 5% of the initial limit 15 C / Vr/1, Hours C = within ± 7% of initial value Life Test 15 C / Vr/1, Hours DF = < at 1 KHz 14 C /.5 Vr/1, Hours IR = not less than 5% of the initial limit C = within ± 5% of initial value Charge/Discharge 1, cycles/vr DF = at 1 KHz IR = not less than 5% of the initial limit 9

11 Electrical and Frequency Characteristics (typical values) ELECTRICAL CHARACTERISTICS CAPACITANCE 1 C/C vs TEMPERATURE D.F. (1-4 ) DISSIPATION FACTOR DC/C DF (1kHz) = (temperature) vs TEMPERATURE C -3 C -5 C + C +45 C +7 C +95 C +1 C Temperature INSULATION RESISTANCE IR vs TEMPERATURE -55 C -3 C -5 C + C +45 C +7 C +95 C +1 C Temperature 1 nf IR(G.ohm) FREQUENCY CHARACTERISTICS CAPACITANCE C/C C (%) FREQUENCY (khz).1-55 C -3 C -5 C + C +45 C +7 C +95 C +1 C Temperature Z (mohm) IMPEDANCE DF C (1-4).1 DISSIPATION FACTOR FREQUENCY (khz) µF 47 nf 1 nf nf 47 nf 4.7µF FREQUENCY (MHz) 1

12 Voltage and Frequency Characteristics MAXIMUM VOLTAGE (Vrms) AND CURRENT (Irms) vs FREQUENCY Typical curves results from measurement carried out at ambient temperature (5 C) and sinusoidal wave-forms (for size CF1 to CF18) Vrms (Volts) 5 VDC / 15 VAC 5 VDC / 15 VAC µF.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Irms (A) µF.1µF.1.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Vrms (Volts) VDC / 4 VAC 63 VDC / 4 VAC 4.7µF 1µF.1µF.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Irms (A) µF 4.7µF 1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6.1µF 1E+7 1 VDC / 63 VAC 1 VDC / 63 VAC µF 1µF.1µF.1µF.1µF µF 5 5 Vrms (Volts) E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Irms (A) 4 3 1µF 1.1µF.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Note: the temperature rise maximum is 4 C 11

13 Voltage and Frequency Characteristics MAXIMUM VOLTAGE (Vrms) AND CURRENT (Irms) vs FREQUENCY Typical curves results from measurement carried out at ambient temperature (5 C) and sinusoidal wave-forms (for size CF1 to CF18) VDC / 1 VAC 16 VDC / 1 VAC 1µF.1µF.1µF.1µF 3.5 1µF Vrms (Volts) Irms (A) µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7.5.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 5 VDC / 16 VAC 5 VDC / 16 VAC Vrms (Volts) µF.1µF.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Irms (A) µF 1.5.1µF 1.5.1µF.1µF 1E+ 1E+3 1E+4 1E+5 1E+6 1E+7 Note: the temperature rise maximum is 4 C MAXIMUM PULSE RISE TIME (dv/dt) Voltage Range 5 5/ dv/dt max (V/µsec)

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